What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Mechanical engineering
His primary areas of investigation include Composite material, Metallurgy, Soldering, Electrical conductor and Microstructure.
His Composite material research includes elements of Ball and Stub.
His work on Intermetallic, Grain orientation and Crystal twinning as part of general Metallurgy study is frequently connected to Degradation, therefore bridging the gap between diverse disciplines of science and establishing a new relationship between them.
His Soldering research is multidisciplinary, incorporating elements of Eutectic system and Ternary eutectic.
The concepts of his Electrical conductor study are interwoven with issues in Electrical contacts, Optoelectronics, Integrated circuit and Electronic engineering.
His research in Microstructure intersects with topics in Alloy and Microelectronics.
His most cited work include:
- Three dimensional high performance interconnection package (208 citations)
- Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders (190 citations)
- High density cantilevered probe for electronic devices (187 citations)
What are the main themes of his work throughout his whole career to date?
The scientist’s investigation covers issues in Soldering, Composite material, Metallurgy, Optoelectronics and Electrical conductor.
His work on Solder paste as part of general Soldering research is frequently linked to Supercooling, bridging the gap between disciplines.
His Composite material study incorporates themes from Ball and Stub.
Da-Yuan Shih regularly ties together related areas like Electromigration in his Metallurgy studies.
His studies deal with areas such as Electronic engineering, Substrate and Electrical engineering as well as Optoelectronics.
His Electrical contacts research includes themes of Electrical connector, Printed circuit board and Interposer.
He most often published in these fields:
- Soldering (54.40%)
- Composite material (37.60%)
- Metallurgy (36.80%)
What were the highlights of his more recent work (between 2006-2020)?
- Soldering (54.40%)
- Composite material (37.60%)
- Metallurgy (36.80%)
In recent papers he was focusing on the following fields of study:
Da-Yuan Shih mostly deals with Soldering, Composite material, Metallurgy, Flip chip and Electromigration.
His study in Soldering is interdisciplinary in nature, drawing from both Barrier layer, Tin and Substrate.
The Layer research Da-Yuan Shih does as part of his general Composite material study is frequently linked to other disciplines of science, such as Fabrication, therefore creating a link between diverse domains of science.
His Layer study combines topics from a wide range of disciplines, such as Electrical conductor and Chip.
In the subject of general Metallurgy, his work in Microstructure, Intermetallic, Nickel and Grain size is often linked to Supercooling, thereby combining diverse domains of study.
His Flip chip research incorporates elements of Mold, Wafer, Bumping and Electronic engineering.
Between 2006 and 2020, his most popular works were:
- Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders (190 citations)
- High density cantilevered probe for electronic devices (187 citations)
- High density integrated circuit apparatus, test probe and methods of use thereof (169 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Electrical engineering
- Mechanical engineering
Da-Yuan Shih mainly investigates Soldering, Metallurgy, Flip chip, Composite material and Intermetallic.
His work on Solder paste as part of his general Soldering study is frequently connected to Process, thereby bridging the divide between different branches of science.
Da-Yuan Shih has included themes like Substrate and Electromigration in his Metallurgy study.
His research investigates the connection between Flip chip and topics such as Mold that intersect with problems in Cooling down.
His work carried out in the field of Composite material brings together such families of science as Surface and Engineering drawing.
His Intermetallic research is multidisciplinary, incorporating perspectives in Indentation hardness, Sputter deposition and Thermal aging.
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