World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
50
Citations
8155
World Ranking
10301
National Ranking
2450

Da-Yuan Shih publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Da-Yuan Shih sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 140 publications — 11th percentile

11% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

Da-Yuan Shih D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Da-Yuan Shih sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 50 D-Index — 22nd percentile

22% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

Da-Yuan Shih is affiliated with IBM in the United States. Their academic and research profile indicates a professional role connected with this institution within the country.

There are no records of recent papers, frequent co-authors, publication venues, book publications, fields or subfields of study, main research topics, or awards associated with Da-Yuan Shih. This absence suggests that detailed publicly available documentation on their research output or collaborative networks is limited or not indexed in the referenced sources.

Without specific publication data or thematic details, the scope of Da-Yuan Shih's scientific contributions cannot be outlined explicitly. Similarly, the lack of information regarding awards or honors does not provide measurable indicators of recognition within the academic community.

Given the available data, the profile of Da-Yuan Shih reflects a research professional affiliated with a major technology organization in the United States but without further publicly accessible bibliometric or institutional output records.

Best Publications

  • Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

    Minhua Lu;Da-Yuan Shih;Paul Lauro;Charles Goldsmith

  • High density cantilevered probe for electronic devices

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  • High density integrated circuit apparatus, test probe and methods of use thereof

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  • Interconnector with contact pads having enhanced durability

    Da-Yuan Shih;Paul Lauro;Keith Edward Fogel;Brian Beaman

  • The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

    Donald W. Henderson;James J. Woods;Timothy A. Gosselin;Jay Bartelo

  • Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

    Donald W. Henderson;Timothy Gosselin;Amit Sarkhel;Sung K. Kang

  • Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

    Sung K. Kang;Da-Yuan Shih;Ny. Donald;W. Henderson

  • Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

    Sung K. Kang;Da-Yuan Shih;Donovan Leonard;Donald W. Henderson

  • Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

    S. K. Kang;P. A. Lauro;D.-Y. Shih;D. W. Henderson

  • High density integral test probe and fabrication method

    Brian Beaman;Keith Fogel;Paul Lauro;Maurice Norcott

  • High density test probe with rigid surface structure

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  • Angled flying lead wire bonding process

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

  • Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

    Moon Gi Cho;Sung K. Kang;Da-Yuan Shih;Hyuck Mo Lee

  • Integrated compliant probe for wafer level test and burn-in

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Apartment Lauro;Da-Yuan Shih

  • Structures and processes to create a desired probetip contact geometry on a wafer test probe

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

  • Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

    Y.C. Sohn;Jin Yu;S.K. Kang;D.Y. Shih

  • Process for making a foamed elastometric polymer

    Jeffrey Curtis Hedrick;James Lupton Hedrick;Jons Gunnar Hilborn;Yun-Hsin Liao

  • Interconnections for flip-chip using lead-free solders and having reaction barrier layers

    Keith E. Fogel;Balaram Ghosal;Sung K. Kang;Stephen Kilpatrick

  • Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

    Sung K. Kang;Donovan Leonard;Da-Yuan Shih;Lynne Gignac

  • Pluggable chip scale package

    Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

Frequent Co-Authors

Fuad E. Doany
Fuad E. Doany IBM (United States)
Hyuck Mo Lee
Hyuck Mo Lee Korea Advanced Institute of Science and Technology
James L. Hedrick
James L. Hedrick IBM (United States)
Roger R. Schmidt
Roger R. Schmidt IBM (United States)
Madhusudan K. Iyengar
Madhusudan K. Iyengar Google (United States)
Robert D. Miller
Robert D. Miller Stanford University
Michael J. Ellsworth
Michael J. Ellsworth IBM (United States)
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Richard C. Chu
Richard C. Chu IBM (United States)
Jöns Hilborn
Jöns Hilborn Uppsala University

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