Da-Yuan Shih

Overview

Best Publications

• Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

  Minhua Lu;Da-Yuan Shih;Paul Lauro;Charles Goldsmith

  328
  Citations

• High density cantilevered probe for electronic devices

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  280
  Citations

• High density integrated circuit apparatus, test probe and methods of use thereof

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  258
  Citations

• Interconnector with contact pads having enhanced durability

  Da-Yuan Shih;Paul Lauro;Keith Edward Fogel;Brian Beaman

  251
  Citations

• The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue

  Donald W. Henderson;James J. Woods;Timothy A. Gosselin;Jay Bartelo

  243
  Citations

• Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

  Donald W. Henderson;Timothy Gosselin;Amit Sarkhel;Sung K. Kang

  228
  Citations

• Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

  Sung K. Kang;Da-Yuan Shih;Ny. Donald;W. Henderson

  199
  Citations

• Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

  Sung K. Kang;Da-Yuan Shih;Donovan Leonard;Donald W. Henderson

  186
  Citations

• Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

  S. K. Kang;P. A. Lauro;D.-Y. Shih;D. W. Henderson

  184
  Citations

• High density integral test probe and fabrication method

  Brian Beaman;Keith Fogel;Paul Lauro;Maurice Norcott

  184
  Citations

• High density test probe with rigid surface structure

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Maurice Heathcote Norcott

  182
  Citations

• Angled flying lead wire bonding process

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

  163
  Citations

• Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

  Moon Gi Cho;Sung K. Kang;Da-Yuan Shih;Hyuck Mo Lee

  163
  Citations

• Integrated compliant probe for wafer level test and burn-in

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Apartment Lauro;Da-Yuan Shih

  146
  Citations

• Structures and processes to create a desired probetip contact geometry on a wafer test probe

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

  139
  Citations

• Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

  Y.C. Sohn;Jin Yu;S.K. Kang;D.Y. Shih

  137
  Citations

• Process for making a foamed elastometric polymer

  Jeffrey Curtis Hedrick;James Lupton Hedrick;Jons Gunnar Hilborn;Yun-Hsin Liao

  131
  Citations

• Interconnections for flip-chip using lead-free solders and having reaction barrier layers

  Keith E. Fogel;Balaram Ghosal;Sung K. Kang;Stephen Kilpatrick

  123
  Citations

• Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

  Sung K. Kang;Donovan Leonard;Da-Yuan Shih;Lynne Gignac

  119
  Citations

• Pluggable chip scale package

  Brian Samuel Beaman;Keith Edward Fogel;Paul Alfred Lauro;Da-Yuan Shih

  119
  Citations