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D-Index & Metrics

Materials Science

D-Index
53
Citations
8315
World Ranking
9339
National Ranking
111

C. R. Kao publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where C. R. Kao sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 248 publications — 46th percentile

46% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

C. R. Kao D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where C. R. Kao sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 53 D-Index — 30th percentile

30% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

C. R. Kao is affiliated with National Taiwan University in Taiwan. Their research primarily focuses on engineering and materials science, with significant contributions in the subfields of electrical and electronic engineering, mechanical engineering, materials chemistry, electronic, optical and magnetic materials, and biomedical engineering.

The main topics of Kao's work include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Electrodeposition and Electroless Coatings
  • Copper Interconnects and Reliability
  • Aluminum Alloys Composites Properties
  • Semiconductor materials and interfaces
  • Electrochemical sensors and biosensors

Some of Kao's recent papers demonstrate a focus on advanced materials and processing techniques related to electronics and sensing technologies:

  • "Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat" (2022, Chemosphere)
  • "Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment" (2021, Journal of Materials Research and Technology)
  • "Highly uniform microfluidic electroless interconnections for chip stacking applications" (2021, Electrochimica Acta)
  • "Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations" (2023, Scientific Reports)
  • "Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper - glycerin complex solution" (2022, Electrochimica Acta)

Kao frequently collaborates with a group of coauthors active in related fields, including:

  • Vengudusamy Renganathan
  • Po-Shao Shih
  • J.H. Huang
  • Simon Johannes Gräfner
  • H. T. Hung

The most common publication venues for Kao's work include:

  • Materials
  • Journal of Materials Research and Technology
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Journal of Electronic Materials
  • Scientific Reports

Best Publications

  • Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

    C. E. Ho;R. Y. Tsai;Y. L. Lin;C. R. Kao

  • Interfacial reaction issues for lead-free electronic solders

    C. E. Ho;S. C. Yang;C. R. Kao

  • Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

    W. T. Chen;C. E. Ho;C. R. Kao

  • Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

    Y.W. Wang;Y.W. Lin;C.T. Tu;C.R. Kao

  • A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

    J. Y. Tsai;Y. C. Hu;C. M. Tsai;C. R. Kao

  • In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

    Y. H. Lin;Y. C. Hu;C. M. Tsai;C. R. Kao

  • Electromigration failure in flip chip solder joints due to rapid dissolution of copper

    Y. C. Hu;Y. H. Lin;C. R. Kao;King-Ning Tu

  • Effects of limited cu supply on soldering reactions between SnAgCu and Ni

    C. E. Ho;Y. W. Lin;S. C. Yang;C. R. Kao

  • Formation and resettlement of (Au x Ni 1-x )Sn 4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

    C. E. Ho;R. Zheng;G. L. Luo;A. H. Lin

  • On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds

    C.R. Kao;Y.A. Chang

  • Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

    Y.W. Wang;Y.W. Lin;C.R. Kao

  • Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations

    W.C. Luo;C.E. Ho;J.Y. Tsai;Y.L. Lin

  • Controlling the microstructure from the gold-tin reaction

    J. Y. Tsai;C. W. Chang;Y. C. Shieh;Y. C. Hu

  • Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

    L.C. Shiau;C.E. Ho;C.R. Kao

  • Electromigration-induced failure in flip-chip solder joints

    Y. H. Lin;C. M. Tsai;Y. C. Hu;Y. L. Lin

  • Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni

    C. E. Ho;Y. L. Lin;C. R. Kao

  • Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

    C. E. Ho;Y. M. Chen;C. R. Kao

  • Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

    Y.W. Wang;C.C. Chang;C.R. Kao

  • Elimination of voids in reactions between Ni and Sn: A novel effect of silver

    H.Y. Chuang;J.J. Yu;M.S. Kuo;H.M. Tong

  • Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

    S. C. Yang;C. E. Ho;C. W. Chang;C. R. Kao

Frequent Co-Authors

Y. A. Chang
Y. A. Chang University of Wisconsin–Madison
King-Ning Tu
King-Ning Tu City University of Hong Kong
Yunzhi Wang
Yunzhi Wang The Ohio State University
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory
Sinn-wen Chen
Sinn-wen Chen National Tsing Hua University
A.S.M.A. Haseeb
A.S.M.A. Haseeb Bangladesh University of Engineering and Technology
Monica Olvera de la Cruz
Monica Olvera de la Cruz Northwestern University
Chun-Wei Chen
Chun-Wei Chen National Taiwan University
Jenq-Gong Duh
Jenq-Gong Duh National Tsing Hua University
Yi-Ling Lin
Yi-Ling Lin Academia Sinica

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