C. R. Kao mostly deals with Metallurgy, Soldering, Intermetallic, Eutectic system and Microstructure. His work deals with themes such as Layer, Joint, Doping and Analytical chemistry, which intersect with Metallurgy. His work on Ball grid array as part of general Soldering research is frequently linked to Reaction product and Concentration effect, bridging the gap between disciplines.
His study focuses on the intersection of Intermetallic and fields such as Interfacial reaction with connections in the field of Wafer bonding and Void. His research in Eutectic system intersects with topics in Failure mechanism and Electromigration. C. R. Kao usually deals with Microstructure and limits it to topics linked to Surface finish and Thin film, Electronic packaging, Shear strength and Electronic packages.
His primary areas of investigation include Metallurgy, Soldering, Intermetallic, Microstructure and Composite material. He works in the field of Metallurgy, focusing on Copper in particular. C. R. Kao has researched Soldering in several fields, including Layer, Eutectic system, Electromigration and Flip chip.
C. R. Kao works mostly in the field of Intermetallic, limiting it down to concerns involving Crystallography and, occasionally, Transmission electron microscopy. As part of the same scientific family, he usually focuses on Microstructure, concentrating on Joint and intersecting with Three-dimensional integrated circuit. His Composite material research is multidisciplinary, relying on both Microelectronics and Focused ion beam.
His scientific interests lie mostly in Intermetallic, Microstructure, Composite material, Nanoindentation and Cell biology. His Intermetallic research incorporates elements of Brittleness, Substrate and Soldering. Analytical chemistry is closely connected to Thermocompression bonding in his research, which is encompassed under the umbrella topic of Soldering.
His Microstructure research incorporates themes from Indium, Electroplating, Shear, Joint and Die. In general Composite material study, his work on Surface finish, Wetting and Porosity often relates to the realm of Silver Nano, thereby connecting several areas of interest. The concepts of his Nanoindentation study are interwoven with issues in Electron backscatter diffraction, Crystal and Scanning electron microscope.
C. R. Kao focuses on Intermetallic, Microstructure, Cell biology, Mitochondrion and Mechanism. The study incorporates disciplines such as Electron backscatter diffraction, Nanoindentation, Scanning electron microscope and Analytical chemistry in addition to Intermetallic. He combines subjects such as Wetting, Porosity, Indium and Shear with his study of Microstructure.
His work on Unfolded protein response as part of his general Cell biology study is frequently connected to Calcium metabolism, Premature aging, Glycolysis and Gastrocnemius muscle, thereby bridging the divide between different branches of science. His Mitochondrion study combines topics from a wide range of disciplines, such as Phenotype, Transcriptome and Downregulation and upregulation. His Mechanism research includes a combination of various areas of study, such as Process, Nanotechnology and Microfluidics.
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Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
C. E. Ho;R. Y. Tsai;Y. L. Lin;C. R. Kao.
Journal of Electronic Materials (2002)
Interfacial reaction issues for lead-free electronic solders
C. E. Ho;S. C. Yang;C. R. Kao.
Journal of Materials Science: Materials in Electronics (2006)
Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders
W. T. Chen;C. E. Ho;C. R. Kao.
Journal of Materials Research (2002)
A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
J. Y. Tsai;Y. C. Hu;C. M. Tsai;C. R. Kao.
Journal of Electronic Materials (2003)
In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Y.H. Lin;Y.C. Hu;C.M. Tsai;C.R. Kao.
Acta Materialia (2005)
Effects of limited cu supply on soldering reactions between SnAgCu and Ni
C. E. Ho;Y. W. Lin;S. C. Yang;C. R. Kao.
Journal of Electronic Materials (2006)
Formation and resettlement of (Au x Ni 1-x )Sn 4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
C. E. Ho;R. Zheng;G. L. Luo;A. H. Lin.
Journal of Electronic Materials (2000)
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
Y.C. Hu;Y.H. Lin;C.R. Kao;K.N. Tu.
Journal of Materials Research (2003)
On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds
C.R. Kao;Y.A. Chang.
Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
S.C. Yang;C.E. Ho;C.W. Chang;C.R. Kao.
Journal of Materials Research (2006)
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