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Materials Science

D-Index
53
Citations
8315
World Ranking
9341
National Ranking
110

Overview

C. R. Kao is affiliated with National Taiwan University in Taiwan. Their research primarily focuses on engineering and materials science, with significant contributions in the subfields of electrical and electronic engineering, mechanical engineering, materials chemistry, electronic, optical and magnetic materials, and biomedical engineering.

The main topics of Kao's work include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Electrodeposition and Electroless Coatings
  • Copper Interconnects and Reliability
  • Aluminum Alloys Composites Properties
  • Semiconductor materials and interfaces
  • Electrochemical sensors and biosensors

Some of Kao's recent papers demonstrate a focus on advanced materials and processing techniques related to electronics and sensing technologies:

  • "Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat" (2022, Chemosphere)
  • "Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment" (2021, Journal of Materials Research and Technology)
  • "Highly uniform microfluidic electroless interconnections for chip stacking applications" (2021, Electrochimica Acta)
  • "Impact of crystalline orientation on Cu-Cu solid-state bonding behavior by molecular dynamics simulations" (2023, Scientific Reports)
  • "Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper - glycerin complex solution" (2022, Electrochimica Acta)

Kao frequently collaborates with a group of coauthors active in related fields, including:

  • Vengudusamy Renganathan
  • Po-Shao Shih
  • J.H. Huang
  • Simon Johannes Gräfner
  • H. T. Hung

The most common publication venues for Kao's work include:

  • Materials
  • Journal of Materials Research and Technology
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Journal of Electronic Materials
  • Scientific Reports

Best Publications

  • Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

    C. E. Ho;R. Y. Tsai;Y. L. Lin;C. R. Kao

  • Interfacial reaction issues for lead-free electronic solders

    C. E. Ho;S. C. Yang;C. R. Kao

  • Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

    W. T. Chen;C. E. Ho;C. R. Kao

  • Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

    Y.W. Wang;Y.W. Lin;C.T. Tu;C.R. Kao

  • A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

    J. Y. Tsai;Y. C. Hu;C. M. Tsai;C. R. Kao

  • In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

    Y. H. Lin;Y. C. Hu;C. M. Tsai;C. R. Kao

  • Electromigration failure in flip chip solder joints due to rapid dissolution of copper

    Y. C. Hu;Y. H. Lin;C. R. Kao;King-Ning Tu

  • Effects of limited cu supply on soldering reactions between SnAgCu and Ni

    C. E. Ho;Y. W. Lin;S. C. Yang;C. R. Kao

  • Formation and resettlement of (Au x Ni 1-x )Sn 4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

    C. E. Ho;R. Zheng;G. L. Luo;A. H. Lin

  • On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds

    C.R. Kao;Y.A. Chang

  • Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

    Y.W. Wang;Y.W. Lin;C.R. Kao

  • Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations

    W.C. Luo;C.E. Ho;J.Y. Tsai;Y.L. Lin

  • Controlling the microstructure from the gold-tin reaction

    J. Y. Tsai;C. W. Chang;Y. C. Shieh;Y. C. Hu

  • Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

    L.C. Shiau;C.E. Ho;C.R. Kao

  • Electromigration-induced failure in flip-chip solder joints

    Y. H. Lin;C. M. Tsai;Y. C. Hu;Y. L. Lin

  • Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni

    C. E. Ho;Y. L. Lin;C. R. Kao

  • Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering

    C. E. Ho;Y. M. Chen;C. R. Kao

  • Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

    Y.W. Wang;C.C. Chang;C.R. Kao

  • Elimination of voids in reactions between Ni and Sn: A novel effect of silver

    H.Y. Chuang;J.J. Yu;M.S. Kuo;H.M. Tong

  • Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

    S. C. Yang;C. E. Ho;C. W. Chang;C. R. Kao

Frequent Co-Authors

Y. A. Chang
Y. A. Chang University of Wisconsin–Madison
King-Ning Tu
King-Ning Tu City University of Hong Kong
Yunzhi Wang
Yunzhi Wang The Ohio State University
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory
Sinn-wen Chen
Sinn-wen Chen National Tsing Hua University
A.S.M.A. Haseeb
A.S.M.A. Haseeb Bangladesh University of Engineering and Technology
Monica Olvera de la Cruz
Monica Olvera de la Cruz Northwestern University
Chun-Wei Chen
Chun-Wei Chen National Taiwan University
Jenq-Gong Duh
Jenq-Gong Duh National Tsing Hua University
Yi-Ling Lin
Yi-Ling Lin Academia Sinica

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