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Materials Science

D-Index
59
Citations
13602
World Ranking
7329
National Ranking
304

Overview

Seung-Boo Jung is affiliated with Sungkyunkwan University in South Korea and has an extensive publication record in the field of engineering. Their work predominantly spans Electrical and Electronic Engineering, with additional contributions in Mechanical Engineering, Biomedical Engineering, Materials Chemistry, and Polymers and Plastics.

The main research areas and topics covered by Jung include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Advanced Sensor and Energy Harvesting Materials
  • Advanced Welding Techniques Analysis
  • Aluminum Alloys Composites Properties
  • Intermetallics and Advanced Alloy Properties
  • Conducting polymers and applications

Jung's recent publications illustrate their engagement with materials science and electronic textiles. Selected papers include:

  • "Electronic textiles: New age of wearable technology for healthcare and fitness solutions" (2023), published in Materials Today Bio
  • "Recent progress of Ti3C2Tx-based MXenes for fabrication of multifunctional smart textiles" (2022), published in Applied Materials Today
  • "Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)" (2020), published in Composite Structures
  • "Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications" (2020), published in Applied Surface Science
  • "Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressing" (2020), published in Journal of Alloys and Compounds

Jung collaborates regularly with several co-authors, including Kyung Deuk Min, Choong-Jae Lee, Byeong-Uk Hwang, Haksan Jeong, and Jong-Woong Kim.

Their frequent publication venues reflect a focus on material science and electronic materials engineering, featuring notable journals and conferences such as:

  • Journal of Materials Science Materials in Electronics
  • Journal of Alloys and Compounds
  • Electronic Materials Letters
  • Journal of Electronic Materials
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

With 148 publications in engineering fields, Jung's work predominantly centers on electrical and electronic engineering (95 publications), supported by significant contributions in mechanical engineering, biomedical engineering, materials chemistry, and polymer sciences.

Best Publications

  • Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

    Won-Bae Lee;Kuek-Saeng Bang;Seung-Boo Jung

  • The joint properties of copper by friction stir welding

    Won-Bae Lee;Seung-Boo Jung

  • Interfacial reaction in steel–aluminum joints made by friction stir welding

    Won-Bae Lee;Martin Schmuecker;Ulises Alfaro Mercardo;Gerhard Biallas

  • Microstructural investigation of friction stir welded pure titanium

    Won-Bae Lee;Chang-Young Lee;Woong-Seong Chang;Yun-Mo Yeon

  • The improvement of mechanical properties of friction-stir-welded A356 Al alloy

    W.B. Lee;Y.M. Yeon;S.B. Jung

  • The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materials

    Won-Bae Lee;Yun-Mo Yeon;Seung-Boo Jung

  • Joint properties of friction stir welded AZ31B– H24 magnesium alloy

    W. B. Lee;Y. M. Yeon;S. B. Jung

  • IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

    Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung

  • Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate

    Jeong-Won Yoon;Young-Ho Lee;Dae-Gon Kim;Han-Byul Kang

  • Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

    Jeong-Won Yoon;Bo-In Noh;Bong-Kyun Kim;Chang-Chae Shur

  • Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir Welding

    Won-Bae Lee;Yun-Mo Yeon;Seung-Boo Jung

  • Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

    Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung

  • Interdiffusion and its size effect in nickel solid solutions of Ni-Co, Ni-Cr and Ni-Ti systems

    S. B. Jung;T. Yamane;Y. Minamino;K. Hirao

  • Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate

    Dae-Gon Kim;Seung-Boo Jung

  • Formation of intermetallic compounds in Al and Mg alloy interface during friction stir spot welding

    Don-Hyun Choi;Byung-Wook Ahn;Chang-Yong Lee;Yun-Mo Yeon

  • Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced composite

    Won-Bae Lee;Chang-Yong Lee;Myoung-Kyun Kim;Jung-Il Yoon

  • Evaluation of the microstructure and mechanical properties of friction stir welded 6005 aluminum alloy

    W. B. Lee;Y. M. Yeon;S. B. Jung

  • Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment

    Jeong-Won Yoon;Chang-Bae Lee;Seung-Boo Jung

  • The Joint Characteristics of Friction Stir Welded AZ91D Magnesium Alloy

    Won-Bae Lee;Jong-Woong Kim;Yun-Mo Yeon;Seung-Boo Jung

  • Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

    Chang-Bae Lee;Seung-Boo Jung;Young-Eui Shin;Chang-Chae Shur

Frequent Co-Authors

Cheol-Woong Yang
Cheol-Woong Yang Sungkyunkwan University
Jae-Do Nam
Jae-Do Nam Sungkyunkwan University
Hyoungsub Kim
Hyoungsub Kim Sungkyunkwan University
Hiroyuki Kokawa
Hiroyuki Kokawa Tohoku University
Hyun You Kim
Hyun You Kim Chungnam National University
Kiyoshi Hirao
Kiyoshi Hirao National Institute of Advanced Industrial Science and Technology
Youngkwan Lee
Youngkwan Lee Sungkyunkwan University
Sang-Woo Kim
Sang-Woo Kim Yonsei University
Yutaka S. Sato
Yutaka S. Sato Tohoku University
Jung Ho Kim
Jung Ho Kim University of Wollongong

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