World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
68
Citations
12560
World Ranking
4988
National Ranking
1548

Y.C. Chan publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Y.C. Chan sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 418 publications — 79th percentile

79% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

Y.C. Chan D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Y.C. Chan sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 68 D-Index — 63rd percentile

63% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

Y.C. Chan is affiliated with the City University of Hong Kong in China. Their research contributions span primarily the fields of Materials Science and Medicine, with focused subfields in Materials Chemistry, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Surgery, and Public Health, Environmental and Occupational Health.

The research topics covered by Y.C. Chan include:

  • GaN-based semiconductor devices and materials
  • Ga2O3 and related materials
  • ZnO doping and properties
  • Crystallization and Solubility Studies
  • X-ray Diffraction in Crystallography
  • Kawasaki Disease and Coronary Complications
  • Streptococcal Infections and Treatments

Their recent publications reflect this diverse range of interests. Notable papers include:

  • Enhanced Light Extraction and Electrical Properties in Ultraviolet-C AlGaN Light-Emitting Diodes with Porous Hole-Array Patterns, 2024, published in ACS Applied Electronic Materials
  • CCDC 2489185: Experimental Crystal Structure Determination, 2025, published in The Cambridge Structural Database
  • Recurrent Kawasaki Disease With Kawasaki Disease Shock Syndrome: A Case Report and Literature Review, 2024, published in Clinical Pediatrics

Y.C. Chan has collaborated with several researchers in their work. Frequent co-authors include:

  • Shihua Yu
  • Yuanji Cheng
  • Yang Chen
  • Y.C. Kao
  • Kuei-Ting Chen

Publication venues where Y.C. Chan's work appears most frequently are:

  • ACS Applied Electronic Materials
  • The Cambridge Structural Database
  • Clinical Pediatrics

Best Publications

  • Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

    Yan Cheong Chan;Dan Yang

  • Research advances in nano-composite solders

    Jun Shen;Y. C. Chan

  • Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

    Y.C Chan;Alex C.K So;J.K.L Lai

  • Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

    P.L. Tu;Y.C. Chan;J.K.L. Lai

  • Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

    Y.C Chan;D.Y Luk

  • Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

    M.N. Islam;Y.C. Chan;M.J. Rizvi;W. Jillek

  • GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINT

    P.L Tu;Y.C Chan;K.C Hung;J.K.L Lai

  • Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

    Sha Xu;Yan Cheong Chan;Kaili Zhang;Kam Chuen Yung

  • Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

    R.A. Islam;B.Y. Wu;M.O. Alam;Y.C. Chan

  • Reliability study of the electroless Ni–P layer against solder alloy

    M.O Alam;Y.C Chan;K.C Hung

  • Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

    J. Shen;Y.C. Chan;S.Y. Liu

  • Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

    Yi Li;Y.C. Chan

  • Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films

    Qing-Yuan Tang;Y.C. Chan;Kaili Zhang

  • Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad

    M. O. Alam;Y. C. Chan;King-Ning Tu

  • Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

    Asit Kumar Gain;Y.C. Chan;Winco K.C. Yung

  • Carrier transport in thin films of organic electroluminescent materials

    Zhenbo Deng;S.T Lee;D.P Webb;Y.C Chan

  • Reliability studies of surface mount, solder joints-effect of Cu-Sn intermetallic compounds

    A.C.K. So;Y.C. Chan

  • Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

    Guang Chen;Guang Chen;Fengshun Wu;Changqing Liu;Vadim V. Silberschmidt

  • Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

    M. N. Islam;Ahmed Sharif;Y. C. Chan

  • Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film

    M.A. Uddin;M.O. Alam;Y.C. Chan;H.P. Chan

  • Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

    Asit Kumar Gain;Y.C. Chan;Winco K.C. Yung

Frequent Co-Authors

King-Ning Tu
King-Ning Tu City University of Hong Kong
Zhong Chen
Zhong Chen Nanyang Technological University
Changqing Liu
Changqing Liu Loughborough University
Chi-Man Lawrence Wu
Chi-Man Lawrence Wu City University of Hong Kong
Aleksandra B. Djurišić
Aleksandra B. Djurišić University of Hong Kong
Shuit-Tong Lee
Shuit-Tong Lee Macau University of Science and Technology
Zhilun Gui
Zhilun Gui Tsinghua University
Leena Ukkonen
Leena Ukkonen Tampere University
Lauri Sydanheimo
Lauri Sydanheimo Tampere University
Vadim V. Silberschmidt
Vadim V. Silberschmidt Loughborough University

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