What is he best known for?
The fields of study he is best known for:
- Composite material
- Semiconductor
- Metallurgy
His primary areas of investigation include Soldering, Metallurgy, Intermetallic, Microstructure and Ball grid array.
His Soldering research is within the category of Composite material.
The concepts of his Metallurgy study are interwoven with issues in Nanoparticle, Dissolution, Layer, Substrate and Shear strength.
His work carried out in the field of Intermetallic brings together such families of science as Surface-mount technology, Annealing and Isothermal process.
His studies examine the connections between Microstructure and genetics, as well as such issues in Nano-, with regards to Kinetic analysis and Joint.
His Ball grid array research is multidisciplinary, relying on both Stress, Lead and Metallizing.
His most cited work include:
- Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (202 citations)
- Research advances in nano-composite solders (187 citations)
- Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints (146 citations)
What are the main themes of his work throughout his whole career to date?
Y.C. Chan focuses on Soldering, Metallurgy, Composite material, Intermetallic and Microstructure.
He interconnects Shear strength, Eutectic system and Electromigration in the investigation of issues within Soldering.
Y.C. Chan combines subjects such as Layer, Substrate and Dissolution with his study of Metallurgy.
His study on Composite material is mostly dedicated to connecting different topics, such as Forensic engineering.
Y.C. Chan has included themes like Surface-mount technology, Diffusion, Solder paste and Metallizing in his Intermetallic study.
His Microstructure research focuses on subjects like Composite number, which are linked to Carbon nanotube.
He most often published in these fields:
- Soldering (54.55%)
- Metallurgy (42.42%)
- Composite material (41.92%)
What were the highlights of his more recent work (between 2012-2021)?
- Soldering (54.55%)
- Metallurgy (42.42%)
- Composite material (41.92%)
In recent papers he was focusing on the following fields of study:
His primary scientific interests are in Soldering, Metallurgy, Composite material, Microstructure and Intermetallic.
His biological study spans a wide range of topics, including Electromigration, Nanoparticle, Layer, Shear strength and Composite number.
The Metallurgy study combines topics in areas such as Wetting and Direct shear test.
Y.C. Chan works mostly in the field of Composite material, limiting it down to topics relating to Dopant and, in certain cases, Thermal shock and Reflow soldering.
His Microstructure study integrates concerns from other disciplines, such as Tin, Activation energy and Void.
His Intermetallic study deals with Copper intersecting with Tin-silver-copper and Elastic modulus.
Between 2012 and 2021, his most popular works were:
- Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing (78 citations)
- Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets (66 citations)
- Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis (63 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Semiconductor
- Thermodynamics
Y.C. Chan mostly deals with Soldering, Metallurgy, Composite material, Microstructure and Intermetallic.
His research in Metallurgy intersects with topics in Wetting, Nanoparticle and Shear strength.
As a member of one scientific family, Y.C. Chan mostly works in the field of Shear strength, focusing on Layer and, on occasion, Amorphous solid, Activation energy and Shear strength test.
His study in the field of Carbon nanotube, Powder metallurgy and Coating also crosses realms of Radio-frequency identification.
His research in Microstructure tackles topics such as Electromigration which are related to areas like Hillock, Condensed matter physics and Thermal diffusivity.
His Intermetallic research includes themes of Composite number, Anode, Grain boundary and Copper.
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