World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
68
Citations
12560
World Ranking
4990
National Ranking
1547

Overview

Y.C. Chan is affiliated with the City University of Hong Kong in China. Their research contributions span primarily the fields of Materials Science and Medicine, with focused subfields in Materials Chemistry, Condensed Matter Physics, Electronic, Optical and Magnetic Materials, Surgery, and Public Health, Environmental and Occupational Health.

The research topics covered by Y.C. Chan include:

  • GaN-based semiconductor devices and materials
  • Ga2O3 and related materials
  • ZnO doping and properties
  • Crystallization and Solubility Studies
  • X-ray Diffraction in Crystallography
  • Kawasaki Disease and Coronary Complications
  • Streptococcal Infections and Treatments

Their recent publications reflect this diverse range of interests. Notable papers include:

  • Enhanced Light Extraction and Electrical Properties in Ultraviolet-C AlGaN Light-Emitting Diodes with Porous Hole-Array Patterns, 2024, published in ACS Applied Electronic Materials
  • CCDC 2489185: Experimental Crystal Structure Determination, 2025, published in The Cambridge Structural Database
  • Recurrent Kawasaki Disease With Kawasaki Disease Shock Syndrome: A Case Report and Literature Review, 2024, published in Clinical Pediatrics

Y.C. Chan has collaborated with several researchers in their work. Frequent co-authors include:

  • Shihua Yu
  • Yuanji Cheng
  • Yang Chen
  • Y.C. Kao
  • Kuei-Ting Chen

Publication venues where Y.C. Chan's work appears most frequently are:

  • ACS Applied Electronic Materials
  • The Cambridge Structural Database
  • Clinical Pediatrics

Best Publications

  • Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

    Yan Cheong Chan;Dan Yang

  • Research advances in nano-composite solders

    Jun Shen;Y. C. Chan

  • Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

    Y.C Chan;Alex C.K So;J.K.L Lai

  • Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

    P.L. Tu;Y.C. Chan;J.K.L. Lai

  • Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

    Y.C Chan;D.Y Luk

  • Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

    M.N. Islam;Y.C. Chan;M.J. Rizvi;W. Jillek

  • GROWTH KINETICS OF INTERMETALLIC COMPOUNDS IN CHIP SCALE PACKAGE SOLDER JOINT

    P.L Tu;Y.C Chan;K.C Hung;J.K.L Lai

  • Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

    Sha Xu;Yan Cheong Chan;Kaili Zhang;Kam Chuen Yung

  • Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

    R.A. Islam;B.Y. Wu;M.O. Alam;Y.C. Chan

  • Reliability study of the electroless Ni–P layer against solder alloy

    M.O Alam;Y.C Chan;K.C Hung

  • Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

    J. Shen;Y.C. Chan;S.Y. Liu

  • Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders

    Yi Li;Y.C. Chan

  • Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films

    Qing-Yuan Tang;Y.C. Chan;Kaili Zhang

  • Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad

    M. O. Alam;Y. C. Chan;King-Ning Tu

  • Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

    Asit Kumar Gain;Y.C. Chan;Winco K.C. Yung

  • Carrier transport in thin films of organic electroluminescent materials

    Zhenbo Deng;S.T Lee;D.P Webb;Y.C Chan

  • Reliability studies of surface mount, solder joints-effect of Cu-Sn intermetallic compounds

    A.C.K. So;Y.C. Chan

  • Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets

    Guang Chen;Guang Chen;Fengshun Wu;Changqing Liu;Vadim V. Silberschmidt

  • Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

    M. N. Islam;Ahmed Sharif;Y. C. Chan

  • Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film

    M.A. Uddin;M.O. Alam;Y.C. Chan;H.P. Chan

  • Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

    Asit Kumar Gain;Y.C. Chan;Winco K.C. Yung

Frequent Co-Authors

King-Ning Tu
King-Ning Tu City University of Hong Kong
Zhong Chen
Zhong Chen Nanyang Technological University
Changqing Liu
Changqing Liu Loughborough University
Chi-Man Lawrence Wu
Chi-Man Lawrence Wu City University of Hong Kong
Aleksandra B. Djurišić
Aleksandra B. Djurišić University of Hong Kong
Shuit-Tong Lee
Shuit-Tong Lee Macau University of Science and Technology
Zhilun Gui
Zhilun Gui Tsinghua University
Leena Ukkonen
Leena Ukkonen Tampere University
Lauri Sydanheimo
Lauri Sydanheimo Tampere University
Vadim V. Silberschmidt
Vadim V. Silberschmidt Loughborough University

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