World's Best Scientists 2026 revealed!
Chi-Man Lawrence Wu

Chi-Man Lawrence Wu

D-Index & Metrics

Materials Science

D-Index
51
Citations
7579
World Ranking
10035
National Ranking
2822

Overview

Chi-Man Lawrence Wu is affiliated with the City University of Hong Kong in China. Their research spans primarily the fields of Engineering and Materials Science, with significant contributions in various subfields including Materials Chemistry, Electrical and Electronic Engineering, Renewable Energy, Sustainability and the Environment, Mechanical Engineering, and Molecular Biology.

The scientist's main research topics concentrate on electrocatalysts for energy conversion, MXene and MAX phase materials, advanced thermoelectric materials and devices, advanced biosensing and bioanalysis techniques, catalytic processes in materials science, gold and silver nanoparticles synthesis and applications, as well as chalcogenide semiconductor thin films.

Recent research papers authored or coauthored by Wu include:

  • A review of bearing failure Modes, mechanisms and causes, 2023, Engineering Failure Analysis
  • Label-free sensing of exosomal MCT1 and CD147 for tracking metabolic reprogramming and malignant progression in glioma, 2020, Science Advances
  • NiMo@C3N5 heterostructures with multiple electronic transmission channels for highly efficient hydrogen evolution from alkaline electrolytes and seawater, 2022, Chemical Engineering Journal
  • Failure modes, mechanisms and causes of shafts in mechanical equipment, 2022, Engineering Failure Analysis
  • Encapsulating dual-phased Mo2C-WC nanocrystals into ultrathin carbon nanosheet assemblies for efficient electrocatalytic hydrogen evolution, 2020, Chemical Engineering Journal

Frequently collaborating coauthors include Maohuai Wang, Xiongyi Liang, Ling-Yan Kong, Xiaoqing Lü, and Chen Guo, reflecting an active engagement in collaborative research efforts.

Wu's work is frequently published in a range of scientific journals and venues. Most commonly appearing venues are:

  • SSRN Electronic Journal
  • Engineering Failure Analysis
  • Chemical Engineering Journal
  • Applied Surface Science
  • Journal of Colloid and Interface Science

Best Publications

  • Properties of lead-free solder alloys with rare earth element additions

    C.M.L. Wu;D.Q. Yu;D.Q. Yu;C.M.T. Law;L. Wang

  • Review and comparison of shearography and active thermography for nondestructive evaluation

    Y.Y. Hung;Y.S. Chen;S.P. Ng;L. Liu

  • Graphene sheets via microwave chemical vapor deposition

    G.D. Yuan;W.J. Zhang;Y. Yang;Y.B. Tang

  • The properties of Sn-9Zn Lead-free solder alloys doped with trace rare earth elements

    C. M. L. Wu;D. Q. Yu;C. M. T. Law;L. Wang

  • Adsorption of gas molecules on Ga-doped graphene and effect of applied electric field: A DFT study

    Xiong-Yi Liang;Ning Ding;Ning Ding;Siu-Pang Ng;Chi-Man Lawrence Wu;Chi-Man Lawrence Wu

  • Direct detection of two different tumor-derived extracellular vesicles by SAM-AuNIs LSPR biosensor.

    Abhimanyu Thakur;Guangyu Qiu;Siu-Pang Ng;Jintao Guan

  • N-P transition sensing behaviors of ZnO nanotubes exposed to NO2 gas.

    J X Wang;J X Wang;X W Sun;Y Yang;C M L Wu

  • Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

    D.Q. Yu;D.Q. Yu;C.M.L. Wu;C.M.T. Law;L. Wang

  • The wettability and microstructure of Sn-Zn-RE alloys

    C. M. L. Wu;C. M. T. Law;D. Q. Yu;L. Wang

  • Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

    C. M. L. Wu;D. Q. Yu;C. M. T. Law;L. Wang

  • Creep behavior of eutectic Sn–Ag lead-free solder alloy

    M. L. Huang;L. Wang;C. M. L. Wu

  • Label-free sensing of exosomal MCT1 and CD147 for tracking metabolic reprogramming and malignant progression in glioma

    A. Thakur;G. Qiu;C. Xu;X. Han

  • Detection of Glioma‐Derived Exosomes with the Biotinylated Antibody‐Functionalized Titanium Nitride Plasmonic Biosensor

    Guangyu Qiu;Guangyu Qiu;Abhimanyu Thakur;Chen Xu;Siu-Pang Ng

  • Rare-earth additions to lead-free electronic solders

    C. M. L. Wu;Y. W. Wong

  • Electrochemical CO2 Reduction to C1 Products on Single Nickel/Cobalt/Iron‐Doped Graphitic Carbon Nitride: A DFT Study

    Chen Guo;Tian Zhang;Xiangxuan Deng;Xiongyi Liang

  • Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

    C. M. T. Law;C. M. L. Wu;D. Q. Yu;D. Q. Yu;L. Wang

  • Creep behavior of eutectic Sn-Cu lead-free solder alloy

    C. M. L. Wu;M. L. Huang

  • Adsorption of formaldehyde on transition metal doped monolayer MoS2: A DFT study

    Xiangxuan Deng;Xiongyi Liang;Siu-Pang Ng;Siu-Pang Ng;Chi-Man Lawrence Wu

  • Can Polypyridyl Cu(I)-based Complexes Provide Promising Sensitizers for Dye-Sensitized Solar Cells? A Theoretical Insight into Cu(I) versus Ru(II) Sensitizers

    Xiaoqing Lu;Shuxian Wei;Chi-Man Lawrence Wu;Shaoren Li

  • The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering

    Xiaoying Liu;Mingliang Huang;Yanhui Zhao;C.M.L. Wu

  • The formation of nano-Ag3Sn particles on the intermetallic compounds during wetting reaction

    D.Q. Yu;D.Q. Yu;L. Wang;C.M.L. Wu;C.M.T. Law

Frequent Co-Authors

Xiaoqing Lu
Xiaoqing Lu China University of Petroleum, Beijing
Zhiwen Chen
Zhiwen Chen Shanghai University
Lei Wang
Lei Wang University of Wollongong
Robert K.Y. Li
Robert K.Y. Li City University of Hong Kong
Minghong Wu
Minghong Wu Shanghai University
Ho-Pui Ho
Ho-Pui Ho Chinese University of Hong Kong
Y.C. Chan
Y.C. Chan City University of Hong Kong
Chun-Sing Lee
Chun-Sing Lee City University of Hong Kong
Shuit-Tong Lee
Shuit-Tong Lee Macau University of Science and Technology
Wenjun Zhang
Wenjun Zhang City University of Hong Kong

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