World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
55
Citations
11951
World Ranking
2175
National Ranking
849

Pradeep Lall publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Pradeep Lall sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 863 publications — 97th percentile

97% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Pradeep Lall D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Pradeep Lall sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 55 D-Index — 69th percentile

69% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Pradeep Lall is affiliated with Auburn University in the United States and has contributed extensively to the field of engineering, with a focus on electrical and electronic engineering as well as mechanical and automotive engineering subfields. Their research encompasses over 214 publications within engineering, including 115 specifically in electrical and electronic engineering and 28 in mechanical engineering. The research work also touches on mechanics of materials and biomedical engineering.

Significant topics of their research include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Nanomaterials and Printing Technologies
  • Aluminum Alloys Composites Properties
  • Mechanical Behavior of Composites
  • Advanced Sensor and Energy Harvesting Materials

Pradeep Lall has published their work regularly in notable venues. Frequent publication venues associated with their research are:

  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Journal of Electronic Packaging
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IEEE Journal of Photovoltaics

Among recent papers authored or co-authored by Pradeep Lall are:

  • High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days, 2021, Journal of Electronic Packaging
  • Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature, 2022, Journal of Electronic Packaging
  • Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

They have collaborated extensively with several researchers. Frequent co-authors include:

  • Jeffrey C. Suhling
  • Ravi Mahajan
  • Alan Huffman
  • K Yokouchi
  • Karlheinz Bock

Best Publications

  • Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

    Pradeep Lall;Michael G. Pecht;Edward B. Hakim

  • The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

    Hongtao Ma;J.C. Suhling;Yifei Zhang;P. Lall

  • Reliability of the aging lead free solder joint

    Hongtao Ma;J.C. Suhling;P. Lall;M.J. Bozack

  • Determination of Anand constants for SAC solders using stress-strain or creep data

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

    P. Lall;D.R. Panchagade;Yueli Liu;R.W. Johnson

  • The effects of aging temperature on SAC solder joint material behavior and reliability

    Yifei Zhang;Zijie Cai;J.C. Suhling;P. Lall

  • Model for BGA and CSP reliability in automotive underhood applications

    P. Lall;M.N. Islam;N. Singh;J.C. Suhling

  • Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact

    P. Lall;D. Panchagade;Yueli Liu;W. Johnson

  • Reduction of lead free solder aging effects using doped SAC alloys

    Zijie Cai;Yifei Zhang;Jeffrey C. Suhling;Pradeep Lall

  • Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling

    P. Lall;S. Gupte;P. Choudhary;J. Suhling

  • Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

    P. Lall;P. Choudhary;S. Gupte;J. Suhling

  • Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

    P. Lall;D.R. Panchagade;P. Choudhary;S. Gupte

  • Flexible connector for circuit boards

    Joseph G. Gillette;Scott G. Potter;Pradeep Lall

  • Prognostics and Health Management of Electronic Packaging

    P. Lall;M.N. Islam;M.K. Rahim;J.C. Suhling

  • Improved predictions of lead free solder joint reliability that include aging effects

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Jiawei Zhang

  • Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

    P. Lall;D. Panchagade;P. Choudhary;J. Suhling

  • The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders

    Muhannad Mustafa;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

    P. Lall;P. Choudhary;S. Gupte;J. Suhling

  • Correlation of reliability models including aging effects with thermal cycling reliability data

    Mohammad Motalab;Muhannad Mustafa;Jeffrey C. Suhling;Jiawei Zhang

  • Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

    P. Lall;P. Choudhary;S. Gupte;J. Hofmeister

  • Prognostics and Health Management of Electronics

    P. Lall;M. Hande;C. Bhat;J. Suhling

Frequent Co-Authors

Jeffrey C. Suhling
Jeffrey C. Suhling Auburn University
Kai Goebel
Kai Goebel Palo Alto Research Center
Richard C. Jaeger
Richard C. Jaeger Auburn University
Ryan J. Lowe
Ryan J. Lowe University of Western Australia
Michael Pecht
Michael Pecht University of Maryland, College Park
Robert L. Jackson
Robert L. Jackson Auburn University
Herbert Reichl
Herbert Reichl Fraunhofer Society
John W. Fowler
John W. Fowler Arizona State University

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