World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
55
Citations
11951
World Ranking
2175
National Ranking
848

Overview

Pradeep Lall is affiliated with Auburn University in the United States and has contributed extensively to the field of engineering, with a focus on electrical and electronic engineering as well as mechanical and automotive engineering subfields. Their research encompasses over 214 publications within engineering, including 115 specifically in electrical and electronic engineering and 28 in mechanical engineering. The research work also touches on mechanics of materials and biomedical engineering.

Significant topics of their research include:

  • Electronic Packaging and Soldering Technologies
  • 3D IC and TSV technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Nanomaterials and Printing Technologies
  • Aluminum Alloys Composites Properties
  • Mechanical Behavior of Composites
  • Advanced Sensor and Energy Harvesting Materials

Pradeep Lall has published their work regularly in notable venues. Frequent publication venues associated with their research are:

  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Journal of Electronic Packaging
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IEEE Journal of Photovoltaics

Among recent papers authored or co-authored by Pradeep Lall are:

  • High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days, 2021, Journal of Electronic Packaging
  • Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature, 2022, Journal of Electronic Packaging
  • Effect of Underfill Property Evolution on Solder Joint Reliability in Automotive Applications, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

They have collaborated extensively with several researchers. Frequent co-authors include:

  • Jeffrey C. Suhling
  • Ravi Mahajan
  • Alan Huffman
  • K Yokouchi
  • Karlheinz Bock

Best Publications

  • Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

    Pradeep Lall;Michael G. Pecht;Edward B. Hakim

  • The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints

    Hongtao Ma;J.C. Suhling;Yifei Zhang;P. Lall

  • Reliability of the aging lead free solder joint

    Hongtao Ma;J.C. Suhling;P. Lall;M.J. Bozack

  • Determination of Anand constants for SAC solders using stress-strain or creep data

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

    P. Lall;D.R. Panchagade;Yueli Liu;R.W. Johnson

  • The effects of aging temperature on SAC solder joint material behavior and reliability

    Yifei Zhang;Zijie Cai;J.C. Suhling;P. Lall

  • Model for BGA and CSP reliability in automotive underhood applications

    P. Lall;M.N. Islam;N. Singh;J.C. Suhling

  • Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact

    P. Lall;D. Panchagade;Yueli Liu;W. Johnson

  • Reduction of lead free solder aging effects using doped SAC alloys

    Zijie Cai;Yifei Zhang;Jeffrey C. Suhling;Pradeep Lall

  • Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling

    P. Lall;S. Gupte;P. Choudhary;J. Suhling

  • Health monitoring for damage initiation & progression during mechanical shock in electronic assemblies

    P. Lall;P. Choudhary;S. Gupte;J. Suhling

  • Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

    P. Lall;D.R. Panchagade;P. Choudhary;S. Gupte

  • Flexible connector for circuit boards

    Joseph G. Gillette;Scott G. Potter;Pradeep Lall

  • Prognostics and Health Management of Electronic Packaging

    P. Lall;M.N. Islam;M.K. Rahim;J.C. Suhling

  • Improved predictions of lead free solder joint reliability that include aging effects

    Mohammad Motalab;Zijie Cai;Jeffrey C. Suhling;Jiawei Zhang

  • Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging

    P. Lall;D. Panchagade;P. Choudhary;J. Suhling

  • The effects of aging on the cyclic stress-strain behavior and hysteresis loop evolution of lead free solders

    Muhannad Mustafa;Zijie Cai;Jeffrey C. Suhling;Pradeep Lall

  • Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

    P. Lall;P. Choudhary;S. Gupte;J. Suhling

  • Correlation of reliability models including aging effects with thermal cycling reliability data

    Mohammad Motalab;Muhannad Mustafa;Jeffrey C. Suhling;Jiawei Zhang

  • Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

    P. Lall;P. Choudhary;S. Gupte;J. Hofmeister

  • Prognostics and Health Management of Electronics

    P. Lall;M. Hande;C. Bhat;J. Suhling

Frequent Co-Authors

Richard C. Jaeger
Richard C. Jaeger Auburn University
Michael Pecht
Michael Pecht University of Maryland, College Park
Herbert Reichl
Herbert Reichl Fraunhofer Society

External Links

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

Studying Electronics and Electrical Engineering online offers flexible pathways for diverse learners. Many programs adopt a competency-based online colleges model, allowing students to progress at their own pace by mastering key skills rather than following a rigid semester schedule.

For military spouses and dependents, finding a supportive college is crucial. Several universities are recognized as military spouse friendly online colleges, offering tailored resources and flexible enrollment to accommodate unique family commitments.

Starting your studies without delay is often a priority. Numerous online colleges starting soon allow applications and course beginnings on a weekly basis, supporting quick entry into degree programs or certifications.

Additionally, short-term credentials can jumpstart your career. Programs featured among short certificate programs that pay well provide valuable skills in as little as six months, often leading to high-demand jobs in technology and engineering sectors.

Best Scientists Citing Pradeep Lall

Trending Scientists

Recently Published Articles