World's Best Scientists 2026 revealed!
Seng Guan Chow

Seng Guan Chow

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
37
Citations
5436
World Ranking
5153
National Ranking
82

Seng Guan Chow publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Seng Guan Chow sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 108 publications — 5th percentile

5% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Seng Guan Chow D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Seng Guan Chow sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 37 D-Index — 27th percentile

27% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Seng Guan Chow is affiliated with STATS ChipPAC Ltd in Singapore. Their professional work is primarily connected to this organization, which is known in the semiconductor packaging and testing industry.

There are no records of recent papers, specific research topics, co-authors, or publication venues associated with Seng Guan Chow in the available data. Additionally, there are no listed book publications or defined main fields or subfields of study documented for this individual.

Similarly, no awards or recognitions have been noted for Seng Guan Chow in the source data provided.

This profile reflects the available factual details concerning Seng Guan Chow's professional affiliation without additional information on research output or scholarly contributions.

Best Publications

  • Stacked semiconductor packages

    Il Kwon Shim;Kambhampati Ramakrishna;Seng Guan Chow;Byung Joon Han

  • Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin

  • Wafer Level Integration Package

    Heap Hoe Kuan;Seng Guan Chow;Linda Pei Ee Chua

  • Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof

    Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna;Seng Guan Chow

  • Semiconductor package with heat sink

    Il Kwon Shim;Seng Guan Chow;Gerry Balanon

  • Super thin/super thermal ball grid array package

    Raymundo M. Camenforte;Dioscoro A. Merilo;Seng Guan Chow

  • Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

    Marcos Karnezos;Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna

  • Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin;Rui Huang

  • SEMICONDUCTOR DEVICE WITH THREE-DIMENSIONAL VERTICALLY ORIENTED INTEGRATED CAPACITORS

    Huang Rui;Kuan Heap Hoe;Lin Yaojian;Chow Seng Guan

  • Integrated circuit package system with die and package combination

    Seng Guan Chow;Ming Ying;Il Kwon Shim

  • Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

    Marcos Karnezos;Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna

  • Semiconductor package with passive device integration

    Seng Guan Chow;Il Kwon Shim;Ming Ying;Byung Hoon Ahn

  • Leadframe package for mems microphone assembly

    Kambhampati Ramakrishna;Seng Guan Chow

  • Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier

    Il Kwon Shim;Seng Guan Chow;Heap Hoe Kuan

  • Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer

    Il Kwon Shim;Yaojian Lin;Seng Guan Chow

  • Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

    Rui Huang;Il Kwon Shim;Seng Guan Chow;Heap Hoe Kuan

  • 3-d package stacking system

    Il Kwon Shim;Byung Joon Han;Seng Guan Chow

  • Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant

    Seng Guan Chow;Il Kwon Shim;Heap Hoe Kuan;Rui Huang

  • Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die

    Reza A. Pagaila;Seng Guan Chow;Seung Uk Yoon

  • Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect

    Reza A. Pagaila;Seng Guan Chow;Seung Uk Yoon

Frequent Co-Authors

Il Kwon Shim
Il Kwon Shim UTAC Group
Byung Tai Do
Byung Tai Do STATS ChipPAC Ltd
Yaojian Lin
Yaojian Lin STATS ChipPAC Ltd
Reza A. Pagaila
Reza A. Pagaila STATS ChipPAC Ltd

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