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Seng Guan Chow

Seng Guan Chow

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
37
Citations
5436
World Ranking
5153
National Ranking
83

Overview

Seng Guan Chow is affiliated with STATS ChipPAC Ltd in Singapore. Their professional work is primarily connected to this organization, which is known in the semiconductor packaging and testing industry.

There are no records of recent papers, specific research topics, co-authors, or publication venues associated with Seng Guan Chow in the available data. Additionally, there are no listed book publications or defined main fields or subfields of study documented for this individual.

Similarly, no awards or recognitions have been noted for Seng Guan Chow in the source data provided.

This profile reflects the available factual details concerning Seng Guan Chow's professional affiliation without additional information on research output or scholarly contributions.

Best Publications

  • Stacked semiconductor packages

    Il Kwon Shim;Kambhampati Ramakrishna;Seng Guan Chow;Byung Joon Han

  • Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin

  • Wafer Level Integration Package

    Heap Hoe Kuan;Seng Guan Chow;Linda Pei Ee Chua

  • Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof

    Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna;Seng Guan Chow

  • Semiconductor package with heat sink

    Il Kwon Shim;Seng Guan Chow;Gerry Balanon

  • Super thin/super thermal ball grid array package

    Raymundo M. Camenforte;Dioscoro A. Merilo;Seng Guan Chow

  • Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

    Marcos Karnezos;Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna

  • Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die

    Il Kwon Shim;Seng Guan Chow;Yaojian Lin;Rui Huang

  • SEMICONDUCTOR DEVICE WITH THREE-DIMENSIONAL VERTICALLY ORIENTED INTEGRATED CAPACITORS

    Huang Rui;Kuan Heap Hoe;Lin Yaojian;Chow Seng Guan

  • Integrated circuit package system with die and package combination

    Seng Guan Chow;Ming Ying;Il Kwon Shim

  • Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides

    Marcos Karnezos;Il Kwon Shim;Byung Joon Han;Kambhampati Ramakrishna

  • Semiconductor package with passive device integration

    Seng Guan Chow;Il Kwon Shim;Ming Ying;Byung Hoon Ahn

  • Leadframe package for mems microphone assembly

    Kambhampati Ramakrishna;Seng Guan Chow

  • Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier

    Il Kwon Shim;Seng Guan Chow;Heap Hoe Kuan

  • Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer

    Il Kwon Shim;Yaojian Lin;Seng Guan Chow

  • Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

    Rui Huang;Il Kwon Shim;Seng Guan Chow;Heap Hoe Kuan

  • 3-d package stacking system

    Il Kwon Shim;Byung Joon Han;Seng Guan Chow

  • Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant

    Seng Guan Chow;Il Kwon Shim;Heap Hoe Kuan;Rui Huang

  • Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die

    Reza A. Pagaila;Seng Guan Chow;Seung Uk Yoon

  • Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect

    Reza A. Pagaila;Seng Guan Chow;Seung Uk Yoon

Frequent Co-Authors

Il Kwon Shim
Il Kwon Shim UTAC Group
Byung Tai Do
Byung Tai Do STATS ChipPAC Ltd
Yaojian Lin
Yaojian Lin STATS ChipPAC Ltd
Reza A. Pagaila
Reza A. Pagaila STATS ChipPAC Ltd

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