World's Best Scientists 2026 revealed!
Reza A. Pagaila

Reza A. Pagaila

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
47
Citations
5789
World Ranking
3296
National Ranking
57

Reza A. Pagaila publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Reza A. Pagaila sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 105 publications — 4th percentile

4% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Reza A. Pagaila D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Reza A. Pagaila sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 47 D-Index — 54th percentile

54% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

What is he best known for?

The fields of study he is best known for:

  • Electrical engineering
  • Layer
  • Mechanical engineering

His scientific interests lie mostly in Optoelectronics, Semiconductor device, Electrical conductor, Layer and Die. His Optoelectronics study incorporates themes from Electronic engineering and Electrical engineering. His Electronic engineering research incorporates themes from Integrated circuit packaging, Integrated circuit and Conductor.

His Electrical conductor study integrates concerns from other disciplines, such as Pillar, Wafer and Substrate. His Layer research is multidisciplinary, incorporating perspectives in Active surface and Electromagnetic shielding. The Die study which covers Electrical interconnect that intersects with Heat sink.

His most cited work include:

  • Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps (155 citations)
  • Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP (120 citations)
  • Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die (112 citations)

What are the main themes of his work throughout his whole career to date?

Reza A. Pagaila spends much of his time researching Optoelectronics, Semiconductor device, Electrical conductor, Electronic engineering and Layer. His Optoelectronics study combines topics from a wide range of disciplines, such as Substrate and Electrical engineering, Electromagnetic shielding. Reza A. Pagaila has researched Semiconductor device in several fields, including Active surface, Die, Wafer and Heat sink.

His Electrical conductor research is multidisciplinary, relying on both Trench, Pillar and Semiconductor package. His studies examine the connections between Electronic engineering and genetics, as well as such issues in Integrated circuit, with regards to Quad Flat No-leads package and Mechanical engineering. When carried out as part of a general Layer research project, his work on Contact pad, Adhesive and Substrate is frequently linked to work in Resistor, therefore connecting diverse disciplines of study.

He most often published in these fields:

  • Optoelectronics (75.63%)
  • Semiconductor device (67.23%)
  • Electrical conductor (58.82%)

What were the highlights of his more recent work (between 2012-2016)?

  • Semiconductor device (67.23%)
  • Optoelectronics (75.63%)
  • Electrical conductor (58.82%)

In recent papers he was focusing on the following fields of study:

Semiconductor device, Optoelectronics, Electrical conductor, Layer and Active surface are his primary areas of study. His studies in Semiconductor device integrate themes in fields like Wafer, Electrical engineering, Heat sink, Electromagnetic shielding and Electronic engineering. His studies deal with areas such as Substrate and Interposer as well as Heat sink.

His Electronic engineering study frequently links to related topics such as Electrical interconnect. In his work, Reza A. Pagaila performs multidisciplinary research in Electrical conductor and Noise. His work deals with themes such as Adhesive, Composite material, Chip-scale package and Die, which intersect with Active surface.

Between 2012 and 2016, his most popular works were:

  • Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant (106 citations)
  • Semiconductor device and method of forming a shielding layer between stacked semiconductor die (92 citations)
  • Semiconductor device and method of forming shielding layer over active surface of semiconductor die (21 citations)

Best Publications

  • Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps

    Reza A. Pagaila;Byung Tai Do;Shuangwu Huang;Rajendra D. Pendse

  • Semiconductor device and method of producing the same

    Pagaila Reza A;Hoe Kuan Heap;Merilo Dioscoro A

  • Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

    Reza A. Pagaila;Yaojian Lin;Seung Uk Yoon

  • Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

    Reza A. Pagaila;Byung Tai Do;Shuangwu Huang

  • Semiconductor device and method of shielding semiconductor die from inter-device interference

    Reza A. Pagaila;Byung Tai Do;Heap Hoe Kuan;Rui Huang

  • Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant

    Linda Pei Ee Chua;Byung Tai Do;Reza A. Pagaila

  • Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

    Reza A. Pagaila

  • Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

    Reza A. Pagaila;Yaojian Lin;Seung Wook Yoon

  • Semiconductor device and method of forming a shielding layer between stacked semiconductor die

    Reza A. Pagaila;Byung Tai Do;Nathapong Suthiwongsunthorn

  • Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

    Reza A. Pagaila;Byung Tai Do;Linda Pei Ee Chua

  • Semiconductor device and method of forming through vias with reflowed conductive material

    Reza A. Pagaila;Byung Tai Do;Linda Pei Ee Chua

  • Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

    Reza A. Pagaila;Rui Huang;Yaojian Lin

  • Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

    Reza A. Pagaila;Byung Tai Do;Yaojian Lin;Rui Huang

  • Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers

    Reza A. Pagaila

  • Apparatus for Thermally Enhanced Semiconductor Package

    Reza A. Pagaila;Byung Tai Do;Zigmund R. Camacho

  • Through hole vias at saw streets including protrusions or recesses for interconnection

    Reza A. Pagaila;Zigmund R. Camacho;Lionel Chien Hui Tay;Byung Tai Do

  • Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die

    Reza A. Pagaila;Seng Guan Chow;Seung Uk Yoon

  • Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die

    Reza A. Pagaila;Yaojian Lin;Jun Mo Koo;HeeJo Chi

  • Semiconductor device and method of forming dam material around periphery of die to reduce warpage

    Reza A. Pagaila

  • Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

    Reza A. Pagaila;Byung Tai Do;Rui Huang

  • Integrated circuit packaging system with package stacking and method of manufacture thereof

    Reza Argenty Pagaila;Byung Tai Do

Frequent Co-Authors

Byung Tai Do
Byung Tai Do STATS ChipPAC Ltd
Yaojian Lin
Yaojian Lin STATS ChipPAC Ltd
Seng Guan Chow
Seng Guan Chow STATS ChipPAC Ltd

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