Reza A. Pagaila

What is he best known for?

The fields of study he is best known for:

• Electrical engineering
• Layer
• Mechanical engineering

His scientific interests lie mostly in Optoelectronics, Semiconductor device, Electrical conductor, Layer and Die. His Optoelectronics study incorporates themes from Electronic engineering and Electrical engineering. His Electronic engineering research incorporates themes from Integrated circuit packaging, Integrated circuit and Conductor.

His Electrical conductor study integrates concerns from other disciplines, such as Pillar, Wafer and Substrate. His Layer research is multidisciplinary, incorporating perspectives in Active surface and Electromagnetic shielding. The Die study which covers Electrical interconnect that intersects with Heat sink.

His most cited work include:

• Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps (155 citations)
• Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP (120 citations)
• Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die (112 citations)

What are the main themes of his work throughout his whole career to date?

Reza A. Pagaila spends much of his time researching Optoelectronics, Semiconductor device, Electrical conductor, Electronic engineering and Layer. His Optoelectronics study combines topics from a wide range of disciplines, such as Substrate and Electrical engineering, Electromagnetic shielding. Reza A. Pagaila has researched Semiconductor device in several fields, including Active surface, Die, Wafer and Heat sink.

His Electrical conductor research is multidisciplinary, relying on both Trench, Pillar and Semiconductor package. His studies examine the connections between Electronic engineering and genetics, as well as such issues in Integrated circuit, with regards to Quad Flat No-leads package and Mechanical engineering. When carried out as part of a general Layer research project, his work on Contact pad, Adhesive and Substrate is frequently linked to work in Resistor, therefore connecting diverse disciplines of study.

He most often published in these fields:

• Optoelectronics (75.63%)
• Semiconductor device (67.23%)
• Electrical conductor (58.82%)

What were the highlights of his more recent work (between 2012-2016)?

• Semiconductor device (67.23%)
• Optoelectronics (75.63%)
• Electrical conductor (58.82%)

In recent papers he was focusing on the following fields of study:

Semiconductor device, Optoelectronics, Electrical conductor, Layer and Active surface are his primary areas of study. His studies in Semiconductor device integrate themes in fields like Wafer, Electrical engineering, Heat sink, Electromagnetic shielding and Electronic engineering. His studies deal with areas such as Substrate and Interposer as well as Heat sink.

His Electronic engineering study frequently links to related topics such as Electrical interconnect. In his work, Reza A. Pagaila performs multidisciplinary research in Electrical conductor and Noise. His work deals with themes such as Adhesive, Composite material, Chip-scale package and Die, which intersect with Active surface.

Between 2012 and 2016, his most popular works were:

• Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant (106 citations)
• Semiconductor device and method of forming a shielding layer between stacked semiconductor die (92 citations)
• Semiconductor device and method of forming shielding layer over active surface of semiconductor die (21 citations)