World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
60
Citations
15096
World Ranking
1616
National Ranking
17

Materials Science

D-Index
65
Citations
17924
World Ranking
5553
National Ranking
62

Chen-Hua Yu publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Chen-Hua Yu sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 378 publications — 71st percentile

71% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Chen-Hua Yu D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Chen-Hua Yu sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 60 D-Index — 77th percentile

77% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2013 - IEEE Fellow For leadership in development of interconnect technology for integrated circuits

Overview

What is he best known for?

The fields of study he is best known for:

  • Composite material
  • Mechanical engineering
  • Semiconductor

Optoelectronics, Electronic engineering, Layer, Composite material and Substrate are his primary areas of study. His research integrates issues of Fin, Semiconductor device and Electrical engineering in his study of Optoelectronics. His work carried out in the field of Electronic engineering brings together such families of science as Wafer, Silicon, Passivation, Die and Electrical conductor.

His work in Layer covers topics such as Metal which are related to areas like Chip-scale package, Metal insulator metal capacitor, Capacitor and Polymer. The concepts of his Composite material study are interwoven with issues in Redistribution and Copper. His Substrate research is multidisciplinary, relying on both Die, Structural engineering, Printed circuit board and Dielectric layer.

His most cited work include:

  • Package systems having interposers (400 citations)
  • Package with metal-insulator-metal capacitor and method of manufacturing the same (325 citations)
  • Fan-out interconnect structure and method for forming same (314 citations)

What are the main themes of his work throughout his whole career to date?

Chen-Hua Yu mainly investigates Optoelectronics, Layer, Composite material, Electronic engineering and Substrate. Chen-Hua Yu interconnects Electrical conductor, Die and Semiconductor device in the investigation of issues within Optoelectronics. His Layer research includes elements of Metallurgy and Semiconductor.

His study in Composite material is interdisciplinary in nature, drawing from both Metal and Dielectric. The various areas that Chen-Hua Yu examines in his Electronic engineering study include Gate dielectric, Gate oxide and Three-dimensional integrated circuit. His work deals with themes such as Structural engineering and Light-emitting diode, Electrical engineering, which intersect with Substrate.

He most often published in these fields:

  • Optoelectronics (55.86%)
  • Layer (33.57%)
  • Composite material (29.67%)

What were the highlights of his more recent work (between 2016-2021)?

  • Optoelectronics (55.86%)
  • Electrical conductor (18.23%)
  • Composite material (29.67%)

In recent papers he was focusing on the following fields of study:

The scientist’s investigation covers issues in Optoelectronics, Electrical conductor, Composite material, Die and Semiconductor device. His research in Optoelectronics intersects with topics in Layer, Substrate, Chip and Redistribution. The Layer study combines topics in areas such as Oxide and Cable gland.

His Composite material research integrates issues from Metal and Dielectric. His work deals with themes such as Optical fiber, Semiconductor, Semiconductor package and Integrated circuit, which intersect with Die. His studies in Semiconductor device integrate themes in fields like Terminal and Coupling.

Between 2016 and 2021, his most popular works were:

  • Package structure and method of forming the same (27 citations)
  • Package Structure for Heat Dissipation (21 citations)
  • Semiconductor packages and methods of forming same (20 citations)

In his most recent research, the most cited papers focused on:

  • Composite material
  • Mechanical engineering
  • Semiconductor

Chen-Hua Yu mostly deals with Optoelectronics, Electrical conductor, Die, Composite material and Redistribution layer. The study incorporates disciplines such as Layer, Semiconductor device, Redistribution, Chip and Semiconductor package in addition to Optoelectronics. His Electrical conductor research is multidisciplinary, incorporating elements of Wafer, Wafer dicing, Substrate and Electromagnetic coil.

Chen-Hua Yu interconnects Electrical connector and Integrated circuit in the investigation of issues within Die. In his study, Dielectric, Integrated devices and Patch antenna is inextricably linked to Semiconductor, which falls within the broad field of Integrated circuit. His work in the fields of Molding and Dielectric layer overlaps with other areas such as Tail region.

Best Publications

  • Package systems having interposers

    Yung-Chi Lin;Jing-Cheng Lin;Chen-Hua Yu

  • Package with metal-insulator-metal capacitor and method of manufacturing the same

    Chen-Hua Yu;Shang-Yun Hou;Wen-Chih Chiou;Jui-Pin Hung

  • Fan-out interconnect structure and method for forming same

    Chen-Hua Yu;Yen-Chang Hu;Ching-Wen Hsiao;Mirng-Ji Lii

  • Packaging methods and structures using a die attach film

    Jui-Pin Hung;Jing-Cheng Lin;Nai-Wei Liu;Chin-Chuan Chang

  • Fin Field-Effect Transistors

    Chen-Hua Yu;Yu-Rung Hsu;Chen-Nan Yeh

  • Testing of semiconductor chips with microbumps

    Wei-Cheng Wu;Hsien-Pin Hu;Shang-Yun Hou;Shin-puu Jeng

  • The BES detector

    J.Z. Bai;Q. Bian;G.M. Chen;L.J. Chen

  • Stacked Semiconductor Devices and Methods of Forming Same

    Chen-Hua Yu;Chien-Hsun Lee;Tsung-Ding Wang;Jung Wei Cheng

  • Interconnect structure for wafer level package

    Chen-Hua Yu;Jing-Cheng Lin;Nai-Wei Liu;Jui-Pin Hung

  • Packages with passive devices and methods of forming the same

    Chen-Hua Yu;Shang-Yun Hou;Der-Chyang Yeh;Shuo-Mao Chen

  • Fan-out package structure and methods for forming the same

    Chen-Hua Yu;Der-Chyang Yeh

  • Methods and Apparatus of Wafer Level Package for Heterogeneous Integration Technology

    Chen-Hua Yu;Der-Chyang Yeh

  • Germanium FinFETs having dielectric punch-through stoppers

    Cheng-Hung Chang;Yu-Rung Hsu;Chen-Yi Lee;Shih-Ting Hung

  • Deposit-etch-deposit ozone/teos insulator layer method

    Syun-Ming Jang;Chen-Hua Yu

  • Copper chemical-mechanical-polishing (CMP) dishing

    Chung-Shi Liu;Chung-Long Chang;Chen-Hua Yu

  • Nitride-oxide sidewall spacer for salicide formation

    Chen-Hua Yu

  • Method for selective growth of Cu3 Ge or Cu5 Si for passivation of damascene copper structures and device manufactured thereby

    Chung-Shi Liu;Chen-Hua Yu;Tien-I Bao;Syun-Ming Jang

  • Through-Silicon Via Sidewall Isolation Structure

    Chen-Hua Yu;Wen-Chih Chiou;Weng-Jin Wu

  • Embedded 3D Interposer Structure

    Ying-Ching Shih;Jing-Cheng Lin;Wen-Chih Chiou;Shin-puu Jeng

  • Dielectric Punch-Through Stoppers for Forming FinFETs Having Dual Fin Heights

    Shih-Ting Hung;Cheng-Hung Chang;Chen-Yi Lee;Chen-Nan Yeh

Frequent Co-Authors

Mong-Song Liang
Mong-Song Liang Taiwan Semiconductor Manufacturing Company (United States)
Lain-Jong Li
Lain-Jong Li National University of Singapore

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