World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
60
Citations
15096
World Ranking
1616
National Ranking
17

Materials Science

D-Index
65
Citations
17924
World Ranking
5555
National Ranking
61

Research.com Recognitions

  • 2013 - IEEE Fellow For leadership in development of interconnect technology for integrated circuits

Overview

What is he best known for?

The fields of study he is best known for:

  • Composite material
  • Mechanical engineering
  • Semiconductor

Optoelectronics, Electronic engineering, Layer, Composite material and Substrate are his primary areas of study. His research integrates issues of Fin, Semiconductor device and Electrical engineering in his study of Optoelectronics. His work carried out in the field of Electronic engineering brings together such families of science as Wafer, Silicon, Passivation, Die and Electrical conductor.

His work in Layer covers topics such as Metal which are related to areas like Chip-scale package, Metal insulator metal capacitor, Capacitor and Polymer. The concepts of his Composite material study are interwoven with issues in Redistribution and Copper. His Substrate research is multidisciplinary, relying on both Die, Structural engineering, Printed circuit board and Dielectric layer.

His most cited work include:

  • Package systems having interposers (400 citations)
  • Package with metal-insulator-metal capacitor and method of manufacturing the same (325 citations)
  • Fan-out interconnect structure and method for forming same (314 citations)

What are the main themes of his work throughout his whole career to date?

Chen-Hua Yu mainly investigates Optoelectronics, Layer, Composite material, Electronic engineering and Substrate. Chen-Hua Yu interconnects Electrical conductor, Die and Semiconductor device in the investigation of issues within Optoelectronics. His Layer research includes elements of Metallurgy and Semiconductor.

His study in Composite material is interdisciplinary in nature, drawing from both Metal and Dielectric. The various areas that Chen-Hua Yu examines in his Electronic engineering study include Gate dielectric, Gate oxide and Three-dimensional integrated circuit. His work deals with themes such as Structural engineering and Light-emitting diode, Electrical engineering, which intersect with Substrate.

He most often published in these fields:

  • Optoelectronics (55.86%)
  • Layer (33.57%)
  • Composite material (29.67%)

What were the highlights of his more recent work (between 2016-2021)?

  • Optoelectronics (55.86%)
  • Electrical conductor (18.23%)
  • Composite material (29.67%)

In recent papers he was focusing on the following fields of study:

The scientist’s investigation covers issues in Optoelectronics, Electrical conductor, Composite material, Die and Semiconductor device. His research in Optoelectronics intersects with topics in Layer, Substrate, Chip and Redistribution. The Layer study combines topics in areas such as Oxide and Cable gland.

His Composite material research integrates issues from Metal and Dielectric. His work deals with themes such as Optical fiber, Semiconductor, Semiconductor package and Integrated circuit, which intersect with Die. His studies in Semiconductor device integrate themes in fields like Terminal and Coupling.

Between 2016 and 2021, his most popular works were:

  • Package structure and method of forming the same (27 citations)
  • Package Structure for Heat Dissipation (21 citations)
  • Semiconductor packages and methods of forming same (20 citations)

In his most recent research, the most cited papers focused on:

  • Composite material
  • Mechanical engineering
  • Semiconductor

Chen-Hua Yu mostly deals with Optoelectronics, Electrical conductor, Die, Composite material and Redistribution layer. The study incorporates disciplines such as Layer, Semiconductor device, Redistribution, Chip and Semiconductor package in addition to Optoelectronics. His Electrical conductor research is multidisciplinary, incorporating elements of Wafer, Wafer dicing, Substrate and Electromagnetic coil.

Chen-Hua Yu interconnects Electrical connector and Integrated circuit in the investigation of issues within Die. In his study, Dielectric, Integrated devices and Patch antenna is inextricably linked to Semiconductor, which falls within the broad field of Integrated circuit. His work in the fields of Molding and Dielectric layer overlaps with other areas such as Tail region.

Best Publications

  • Package systems having interposers

    Yung-Chi Lin;Jing-Cheng Lin;Chen-Hua Yu

  • Package with metal-insulator-metal capacitor and method of manufacturing the same

    Chen-Hua Yu;Shang-Yun Hou;Wen-Chih Chiou;Jui-Pin Hung

  • Fan-out interconnect structure and method for forming same

    Chen-Hua Yu;Yen-Chang Hu;Ching-Wen Hsiao;Mirng-Ji Lii

  • Packaging methods and structures using a die attach film

    Jui-Pin Hung;Jing-Cheng Lin;Nai-Wei Liu;Chin-Chuan Chang

  • Fin Field-Effect Transistors

    Chen-Hua Yu;Yu-Rung Hsu;Chen-Nan Yeh

  • Testing of semiconductor chips with microbumps

    Wei-Cheng Wu;Hsien-Pin Hu;Shang-Yun Hou;Shin-puu Jeng

  • The BES detector

    J.Z. Bai;Q. Bian;G.M. Chen;L.J. Chen

  • Stacked Semiconductor Devices and Methods of Forming Same

    Chen-Hua Yu;Chien-Hsun Lee;Tsung-Ding Wang;Jung Wei Cheng

  • Interconnect structure for wafer level package

    Chen-Hua Yu;Jing-Cheng Lin;Nai-Wei Liu;Jui-Pin Hung

  • Packages with passive devices and methods of forming the same

    Chen-Hua Yu;Shang-Yun Hou;Der-Chyang Yeh;Shuo-Mao Chen

  • Fan-out package structure and methods for forming the same

    Chen-Hua Yu;Der-Chyang Yeh

  • Methods and Apparatus of Wafer Level Package for Heterogeneous Integration Technology

    Chen-Hua Yu;Der-Chyang Yeh

  • Germanium FinFETs having dielectric punch-through stoppers

    Cheng-Hung Chang;Yu-Rung Hsu;Chen-Yi Lee;Shih-Ting Hung

  • Deposit-etch-deposit ozone/teos insulator layer method

    Syun-Ming Jang;Chen-Hua Yu

  • Copper chemical-mechanical-polishing (CMP) dishing

    Chung-Shi Liu;Chung-Long Chang;Chen-Hua Yu

  • Nitride-oxide sidewall spacer for salicide formation

    Chen-Hua Yu

  • Method for selective growth of Cu3 Ge or Cu5 Si for passivation of damascene copper structures and device manufactured thereby

    Chung-Shi Liu;Chen-Hua Yu;Tien-I Bao;Syun-Ming Jang

  • Through-Silicon Via Sidewall Isolation Structure

    Chen-Hua Yu;Wen-Chih Chiou;Weng-Jin Wu

  • Embedded 3D Interposer Structure

    Ying-Ching Shih;Jing-Cheng Lin;Wen-Chih Chiou;Shin-puu Jeng

  • Dielectric Punch-Through Stoppers for Forming FinFETs Having Dual Fin Heights

    Shih-Ting Hung;Cheng-Hung Chang;Chen-Yi Lee;Chen-Nan Yeh

Frequent Co-Authors

Mong-Song Liang
Mong-Song Liang Taiwan Semiconductor Manufacturing Company (United States)
Lain-Jong Li
Lain-Jong Li National University of Singapore

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