What is he best known for?
The fields of study he is best known for:
- Electrical engineering
- Composite material
- Mechanical engineering
His scientific interests lie mostly in Microelectronics, Optoelectronics, Electrical conductor, Electrical engineering and Chip.
His research integrates issues of Substrate, Structural engineering, Dielectric layer, Dielectric and Electronic engineering in his study of Microelectronics.
His work in Dielectric covers topics such as Composite material which are related to areas like Chip carrier.
His biological study spans a wide range of topics, including Surface and Edge.
He interconnects Layer, Integrated circuit packaging and Semiconductor in the investigation of issues within Electrical conductor.
His work on Integrated circuit, Wire bonding and Stub as part of general Electrical engineering study is frequently linked to USable, therefore connecting diverse disciplines of science.
His most cited work include:
- Microelectronic packages and methods therefor (376 citations)
- Chips having rear contacts connected by through vias to front contacts (204 citations)
- Microelectronic elements with post-assembly planarization (170 citations)
What are the main themes of his work throughout his whole career to date?
His primary scientific interests are in Microelectronics, Optoelectronics, Electrical conductor, Electrical engineering and Electronic engineering.
The various areas that Belgacem Haba examines in his Microelectronics study include Substrate, Structural engineering, Dielectric, Semiconductor chip and Composite material.
Belgacem Haba has researched Optoelectronics in several fields, including Edge and Chip.
In his study, which falls under the umbrella issue of Electrical conductor, Coating is strongly linked to Layer.
His Wire bonding study, which is part of a larger body of work in Electrical engineering, is frequently linked to Central region, bridging the gap between disciplines.
His work deals with themes such as Terminal and Dielectric layer, which intersect with Electronic engineering.
He most often published in these fields:
- Microelectronics (64.47%)
- Optoelectronics (45.42%)
- Electrical conductor (37.00%)
What were the highlights of his more recent work (between 2014-2021)?
- Microelectronics (64.47%)
- Optoelectronics (45.42%)
- Electrical conductor (37.00%)
In recent papers he was focusing on the following fields of study:
His main research concerns Microelectronics, Optoelectronics, Electrical conductor, Substrate and Composite material.
His Microelectronics study is focused on Electrical engineering in general.
His studies in Optoelectronics integrate themes in fields like Die and Chip.
His Electrical conductor research is multidisciplinary, incorporating perspectives in Layer, Electronic engineering and Dielectric.
His Substrate study integrates concerns from other disciplines, such as Computer hardware, NAND gate, Signal, Grid and Direct bonding.
The various areas that Belgacem Haba examines in his Composite material study include Surface, Metal and Semiconductor.
Between 2014 and 2021, his most popular works were:
- Multi-chip module with stacked face-down connected dies (65 citations)
- Multiple die stacking for two or more die (26 citations)
- Batch process fabrication of package-on-package microelectronic assemblies (16 citations)
In his most recent research, the most cited papers focused on:
- Electrical engineering
- Mechanical engineering
- Composite material
His primary areas of study are Microelectronics, Optoelectronics, Electrical conductor, Mechanical engineering and Substrate.
His Microelectronics study combines topics from a wide range of disciplines, such as Composite material, Metal, Package on package and Dielectric.
His Optoelectronics research includes elements of Layer, Die, Chip and Host.
As part of his studies on Electrical conductor, Belgacem Haba often connects relevant areas like Electronic engineering.
His research in Mechanical engineering tackles topics such as Structural engineering which are related to areas like Connection, Solder ball and Cable gland.
His Substrate study combines topics in areas such as NAND gate, Fold, Folding and Contactor.
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