World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
50
Citations
5711
World Ranking
2873
National Ranking
1083

Overview

Belgacem Haba is affiliated with Stanford University in the United States. Their academic profile does not list specific publications, co-authors, or detailed research topics currently available.

While recent papers, including titles, publication venues, and citation counts, are not provided, the affiliation with Stanford University suggests involvement in research activities at a leading institution.

No records specify main fields or subfields of study, limiting detailed insights into particular academic domains or topics of work associated with Belgacem Haba.

Similarly, information about frequent publication venues, co-authorship networks, book publications, or awards received is not available. This absence of data restricts further elaboration on the scientist's research impact or collaborations.

Belgacem Haba is an active scholar and not deceased, indicating ongoing potential contributions to their field.

Best Publications

  • Packaged acoustic and electromagnetic transducer chips

    Giles Humpston;Philip R. Osborn;Jesse Burl Thompson;Yoichi Kubota

  • Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths

    Joseph C. Fjelstad;Para K. Segaram;Belgacem Haba

  • Laminated chip having microelectronic element embedded therein

    Vage Oganesian;Ilyas Mohammed;Craig Mitchell;Belgacem Haba

  • Connection component with peelable leads

    Thomas H. DiStefano;Joseph Fjelstad;Belgacem Haba;Owais Jamil

  • Wafer level packages for rear-face illuminated solid state image sensors

    Richard DeWitt Crisp;Belgacem Haba;Vage Oganesian

  • Packaged semiconductor chips

    Andrey Grinman;David Ovrutsky;Charles Rosenstein;Belgacem Haba

  • Micro pin grid array with pin motion isolation

    Philip Damberg;Belgacem Haba;David B. Tuckerman;Teck-Gyu Kang

  • Image sensor package and fabrication method

    Teck-Gyu Kang;Michael Estrella;Jae M. Park;Kenneth Robert Thompson

  • Reconstituted wafer stack packaging with after-applied pad extensions

    Belgacem Haba;Giles Humpston;David Ovrutsky;Laura Wills Mirkarimi

  • Wafer level compliant packages for rear-face illuminated solid state image sensors

    Richard Dewitt Crisp;Belgacem Haba;Vage Oganesian

  • Method of making assemblies having stacked semiconductor chips

    Belgacem Haba;Masud Beroz

  • Components with posts and pads

    Yoichi Kubota;Teck-Gyu Kang;Jae M. Park;Belgacem Haba

  • Multi-chip module with stacked face-down connected dies

    Belgacem Haba;Ilyas Mohammed;Piyush Savalia

  • IMPROVEMENT OF LAMINATED PACKAGING

    Belgacem Haba;Craig S Mitchell;Masud Beroz

  • MICROELECTRONIC SUBSTRATE HAVING METAL POST CONNECTED WITH SUBSTRATE BY USING BONDING LAYER

    Belgacem Haba;Ryu Chang Myung;Endo Kimiyoshi;Christopher Paul Wade

  • Stub minimization for multi-die wirebond assemblies with parallel windows

    Richard DeWitt Crisp;Wael Zohni;Belgacem Haba;Frank Lambrecht

  • Stacked microelectronic assemblies having vias extending through bond pads

    Moshe Kriman;Osher Avsian;Belgacem Haba;Giles Humpston

  • Staged via formation from both sides of chip

    Vage Oganesian;Belgacem Haba;Ilyas Mohammed;Craig Mitchell

  • Microelectronic unit and system

    Ogunsan;Haba B;Zaballa P;Mohammad I

  • Non-lithographic formation of three-dimensional conductive elements

    Vage Oganesian;Belgacem Haba;Ilyas Mohammed;Craig Mitchell

Frequent Co-Authors

Joseph Fjelstad
Joseph Fjelstad Verdant Electronics
Thomas H. DiStefano
Thomas H. DiStefano Centipede Systems

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Related Online Degrees & Career Pathways

For those interested in Electronics and Electrical Engineering, exploring related online degrees can open up diverse career pathways. Many programs offer accelerated online degree programs, designed specifically to help working adults balance education with professional commitments. This flexibility makes further specialization or career advancement more accessible.

In addition, fields like instructional design intersect with engineering education, especially for creating effective training modules and technical learning materials. The instructional design master’s programs provide valuable skills for engineers interested in education technology or corporate training roles.

Many online degrees are now competency-based, focusing on skill mastery rather than time spent in class. Competency-based programs can accelerate your progress by allowing you to demonstrate knowledge and move quickly through familiar material, a major advantage for experienced professionals.

Additionally, online education options tailored for military families are increasing. Online universities for military spouses and dependents prioritize flexibility and support, making it easier for this community to pursue engineering degrees regardless of frequent relocations or deployments.

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