D-Index & Metrics Best Publications

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Electronics and Electrical Engineering D-index 82 Citations 20,502 149 World Ranking 239 National Ranking 125

Overview

What is he best known for?

The fields of study he is best known for:

  • Integrated circuit
  • Mechanical engineering
  • Electrical engineering

Die, Electrical conductor, Optoelectronics, Electronic engineering and Substrate are his primary areas of study. His work carried out in the field of Die brings together such families of science as Semiconductor, Electrical connection, Semiconductor package and Wire bonding. His Electrical conductor research is multidisciplinary, incorporating elements of Layer, Electrical contacts and Soldering.

His Optoelectronics research focuses on Nanotechnology and how it connects with Ball. His Electronic engineering research incorporates elements of Etching, Wafer, Chip and Flip chip. His study looks at the intersection of Substrate and topics like Machining with Laser, Laser beams and Deposition.

His most cited work include:

  • Single piece package for semiconductor die (387 citations)
  • Semiconductor package including flex circuit, interconnects and dense array external contacts (314 citations)
  • Stacked semiconductor package and method of fabrication (313 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of investigation include Optoelectronics, Electrical conductor, Electronic engineering, Die and Substrate. His work deals with themes such as Layer and Substrate, which intersect with Optoelectronics. His research on Electrical conductor also deals with topics like

  • Semiconductor device and related Conductive materials,
  • Fixture most often made with reference to Electrical contacts.

His Electronic engineering study combines topics from a wide range of disciplines, such as Soldering, Mechanical engineering, Chip, Wire bonding and Terminal. His Die research integrates issues from Composite material, Electrical connection, Electrical engineering and Semiconductor package. His Substrate study integrates concerns from other disciplines, such as Structural engineering, Base, Microelectronics and Conductor.

He most often published in these fields:

  • Optoelectronics (56.79%)
  • Electrical conductor (43.62%)
  • Electronic engineering (41.98%)

What were the highlights of his more recent work (between 2004-2014)?

  • Optoelectronics (56.79%)
  • Semiconductor (34.98%)
  • Substrate (15.23%)

In recent papers he was focusing on the following fields of study:

His primary areas of study are Optoelectronics, Semiconductor, Substrate, Electronic engineering and Electrical conductor. The various areas that Alan G. Wood examines in his Optoelectronics study include Terminal, Electrical engineering and Substrate. The concepts of his Semiconductor study are interwoven with issues in Layer and Engineering drawing.

His Electronic engineering research includes themes of Wafer, Microelectronics, Electrically conductive, Chip and Dielectric. His Wafer research is multidisciplinary, relying on both Electronic component, Die and Doping. His Die research incorporates themes from Semiconductor package and Flip chip.

Between 2004 and 2014, his most popular works were:

  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Method of fabricating semiconductor components with through interconnects (137 citations)
  • Semiconductor components having through wire interconnects (TWI) (99 citations)

In his most recent research, the most cited papers focused on:

  • Electrical engineering
  • Mechanical engineering
  • Integrated circuit

Alan G. Wood focuses on Optoelectronics, Electronic engineering, Semiconductor, Electrical conductor and Substrate. His Optoelectronics research includes elements of Terminal, Electrical engineering and Substrate. His study in Electronic engineering is interdisciplinary in nature, drawing from both Layer, Wafer, Dielectric and Wire bonding.

The study incorporates disciplines such as Die and Aperture in addition to Wafer. His Die study incorporates themes from Base, Semiconductor package and Flip chip. His Electrical conductor study combines topics in areas such as Laser ablation, Dry etching, Engineering drawing and Active surface.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Semiconductor component having plate, stacked dice and conductive vias

Warren M. Farnworth;Alan G. Wood;William M. Hiatt;James M. Wark.
(2007)

942 Citations

Method for fabricating stackable chip scale semiconductor package

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1999)

863 Citations

Single piece package for semiconductor die

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1996)

766 Citations

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1998)

558 Citations

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Warren M. Farnworth;Alan G. Wood;William M. Hiatt;James M. Wark.
(2003)

549 Citations

Method of producing a single piece package for semiconductor die

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1995)

501 Citations

Method for fabricating semiconductor components using focused laser beam

Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1999)

490 Citations

Stacked semiconductor package and method of fabrication

Warren M. Farnworth;Alan G. Wood;Mike Brooks.
(1998)

486 Citations

Semiconductor package including flex circuit, interconnects and dense array external contacts

Warren M. Farnworth;Alan G. Wood;Mike Brooks.
(2000)

481 Citations

Stackable semiconductor package having conductive layer and insulating layers

Warren M. Farnworth;Alan G. Wood;Mike Brooks.
(2002)

435 Citations

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