Salman Akram mainly focuses on Optoelectronics, Die, Electronic engineering, Substrate and Electrical conductor. His Optoelectronics study combines topics from a wide range of disciplines, such as Etching, Semiconductor device and Interconnection. His work deals with themes such as Wire bonding, Structural engineering, Composite material, Electrical engineering and Semiconductor package, which intersect with Die.
Salman Akram combines subjects such as Quad Flat No-leads package, Silicon, Chip, Electrical contacts and Flip chip with his study of Electronic engineering. His research investigates the link between Substrate and topics such as Penetration depth that cross with problems in Integrally closed. His Electrical conductor study integrates concerns from other disciplines, such as Machining, Terminal, Soldering and Integrated circuit.
His primary scientific interests are in Optoelectronics, Substrate, Electronic engineering, Electrical conductor and Wafer. His Optoelectronics research is multidisciplinary, relying on both Layer, Semiconductor device, Die and Interconnection. His Substrate study incorporates themes from Structural engineering and Electrical engineering.
His Electronic engineering study also includes
His primary areas of study are Optoelectronics, Substrate, Wafer, Semiconductor device and Electronic engineering. The study incorporates disciplines such as Electrical conductor and Interconnection in addition to Optoelectronics. The concepts of his Electrical conductor study are interwoven with issues in Line and Dielectric.
Salman Akram has included themes like Passivation and Electrical engineering in his Substrate study. His studies deal with areas such as Etching, Chip and Soldering as well as Wafer. His Electronic engineering research includes themes of Transmission line and Integrated circuit.
His primary areas of investigation include Optoelectronics, Substrate, Interconnection, Integrated circuit and Microelectronics. His Optoelectronics study combines topics in areas such as Die, Electrical conductor and Image sensor. His study on Substrate is covered under Layer.
His Integrated circuit research is multidisciplinary, incorporating perspectives in Mechanical engineering, Die, Electrical contacts and Electronic engineering. His research investigates the connection with Microelectronics and areas like Electrically conductive which intersect with concerns in Line. His research integrates issues of Etching and Dielectric in his study of Wafer.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
Single piece package for semiconductor die
Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1996)
Stackable chip scale semiconductor package with mating contacts on opposed surfaces
Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1998)
Stacked leads-over chip multi-chip module
Salman Akram.
(1999)
Method of producing a single piece package for semiconductor die
Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1995)
Method for fabricating stackable chip scale semiconductor package
Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1999)
Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice
Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1994)
Method for forming contact pins for semiconductor dice and interconnects
Warren M. Farnworth;Salman Akram;Alan G. Wood.
(1994)
Method for fabricating semiconductor components using focused laser beam
Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1999)
Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate
Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1997)
Method of constructing stacked packages
Salman Akram;Jerry M. Brooks.
(1999)
Profile was last updated on December 6th, 2021.
Research.com Ranking is based on data retrieved from the Microsoft Academic Graph (MAG).
The ranking h-index is inferred from publications deemed to belong to the considered discipline.
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