H-Index & Metrics Top Publications

H-Index & Metrics

Discipline name H-index Citations Publications World Ranking National Ranking
Electronics and Electrical Engineering H-index 96 Citations 24,318 201 World Ranking 58 National Ranking 36

Overview

What is he best known for?

The fields of study he is best known for:

  • Mechanical engineering
  • Composite material
  • Semiconductor

Salman Akram mainly focuses on Optoelectronics, Die, Electronic engineering, Substrate and Electrical conductor. His Optoelectronics study combines topics from a wide range of disciplines, such as Etching, Semiconductor device and Interconnection. His work deals with themes such as Wire bonding, Structural engineering, Composite material, Electrical engineering and Semiconductor package, which intersect with Die.

Salman Akram combines subjects such as Quad Flat No-leads package, Silicon, Chip, Electrical contacts and Flip chip with his study of Electronic engineering. His research investigates the link between Substrate and topics such as Penetration depth that cross with problems in Integrally closed. His Electrical conductor study integrates concerns from other disciplines, such as Machining, Terminal, Soldering and Integrated circuit.

His most cited work include:

  • Single piece package for semiconductor die (387 citations)
  • Stacked leads-over chip multi-chip module (350 citations)
  • Method for fabricating stackable chip scale semiconductor package (310 citations)

What are the main themes of his work throughout his whole career to date?

His primary scientific interests are in Optoelectronics, Substrate, Electronic engineering, Electrical conductor and Wafer. His Optoelectronics research is multidisciplinary, relying on both Layer, Semiconductor device, Die and Interconnection. His Substrate study incorporates themes from Structural engineering and Electrical engineering.

His Electronic engineering study also includes

  • Chip, which have a strong connection to Semiconductor chip,
  • Mechanical engineering that intertwine with fields like Quad Flat No-leads package. His Electrical conductor research incorporates elements of Soldering, Electrically conductive, Line, Conductor and Semiconductor package. His Wafer study combines topics from a wide range of disciplines, such as Electronic component and Engineering drawing.

He most often published in these fields:

  • Optoelectronics (63.41%)
  • Substrate (42.86%)
  • Electronic engineering (40.60%)

What were the highlights of his more recent work (between 2004-2012)?

  • Optoelectronics (63.41%)
  • Substrate (42.86%)
  • Wafer (28.82%)

In recent papers he was focusing on the following fields of study:

His primary areas of study are Optoelectronics, Substrate, Wafer, Semiconductor device and Electronic engineering. The study incorporates disciplines such as Electrical conductor and Interconnection in addition to Optoelectronics. The concepts of his Electrical conductor study are interwoven with issues in Line and Dielectric.

Salman Akram has included themes like Passivation and Electrical engineering in his Substrate study. His studies deal with areas such as Etching, Chip and Soldering as well as Wafer. His Electronic engineering research includes themes of Transmission line and Integrated circuit.

Between 2004 and 2012, his most popular works were:

  • Through-wafer interconnects for photoimager and memory wafers (190 citations)
  • Methods of forming blind wafer interconnects, and related structures and assemblies (120 citations)
  • Microelectronic devices and methods for forming interconnects in microelectronic devices (111 citations)

In his most recent research, the most cited papers focused on:

  • Mechanical engineering
  • Composite material
  • Integrated circuit

His primary areas of investigation include Optoelectronics, Substrate, Interconnection, Integrated circuit and Microelectronics. His Optoelectronics study combines topics in areas such as Die, Electrical conductor and Image sensor. His study on Substrate is covered under Layer.

His Integrated circuit research is multidisciplinary, incorporating perspectives in Mechanical engineering, Die, Electrical contacts and Electronic engineering. His research investigates the connection with Microelectronics and areas like Electrically conductive which intersect with concerns in Line. His research integrates issues of Etching and Dielectric in his study of Wafer.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Top Publications

Single piece package for semiconductor die

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1996)

594 Citations

Stackable chip scale semiconductor package with mating contacts on opposed surfaces

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1998)

558 Citations

Stacked leads-over chip multi-chip module

Salman Akram.
(1999)

533 Citations

Method of producing a single piece package for semiconductor die

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1995)

501 Citations

Method for fabricating stackable chip scale semiconductor package

Salman Akram;Alan G. Wood;Warren M. Farnworth.
(1999)

462 Citations

Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice

Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1994)

413 Citations

Method for forming contact pins for semiconductor dice and interconnects

Warren M. Farnworth;Salman Akram;Alan G. Wood.
(1994)

399 Citations

Method for fabricating semiconductor components using focused laser beam

Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1999)

394 Citations

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Salman Akram;Warren M. Farnworth;Alan G. Wood.
(1997)

387 Citations

Method of constructing stacked packages

Salman Akram;Jerry M. Brooks.
(1999)

369 Citations

Profile was last updated on December 6th, 2021.
Research.com Ranking is based on data retrieved from the Microsoft Academic Graph (MAG).
The ranking h-index is inferred from publications deemed to belong to the considered discipline.

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