What is he best known for?
The fields of study he is best known for:
- Mechanical engineering
- Composite material
- Semiconductor
Salman Akram mainly focuses on Optoelectronics, Die, Electronic engineering, Substrate and Electrical conductor.
His Optoelectronics study combines topics from a wide range of disciplines, such as Etching, Semiconductor device and Interconnection.
His work deals with themes such as Wire bonding, Structural engineering, Composite material, Electrical engineering and Semiconductor package, which intersect with Die.
Salman Akram combines subjects such as Quad Flat No-leads package, Silicon, Chip, Electrical contacts and Flip chip with his study of Electronic engineering.
His research investigates the link between Substrate and topics such as Penetration depth that cross with problems in Integrally closed.
His Electrical conductor study integrates concerns from other disciplines, such as Machining, Terminal, Soldering and Integrated circuit.
His most cited work include:
- Single piece package for semiconductor die (387 citations)
- Stacked leads-over chip multi-chip module (350 citations)
- Method for fabricating stackable chip scale semiconductor package (310 citations)
What are the main themes of his work throughout his whole career to date?
His primary scientific interests are in Optoelectronics, Substrate, Electronic engineering, Electrical conductor and Wafer.
His Optoelectronics research is multidisciplinary, relying on both Layer, Semiconductor device, Die and Interconnection.
His Substrate study incorporates themes from Structural engineering and Electrical engineering.
His Electronic engineering study also includes
- Chip, which have a strong connection to Semiconductor chip,
- Mechanical engineering that intertwine with fields like Quad Flat No-leads package.
His Electrical conductor research incorporates elements of Soldering, Electrically conductive, Line, Conductor and Semiconductor package.
His Wafer study combines topics from a wide range of disciplines, such as Electronic component and Engineering drawing.
He most often published in these fields:
- Optoelectronics (63.41%)
- Substrate (42.86%)
- Electronic engineering (40.60%)
What were the highlights of his more recent work (between 2004-2012)?
- Optoelectronics (63.41%)
- Substrate (42.86%)
- Wafer (28.82%)
In recent papers he was focusing on the following fields of study:
His primary areas of study are Optoelectronics, Substrate, Wafer, Semiconductor device and Electronic engineering.
The study incorporates disciplines such as Electrical conductor and Interconnection in addition to Optoelectronics.
The concepts of his Electrical conductor study are interwoven with issues in Line and Dielectric.
Salman Akram has included themes like Passivation and Electrical engineering in his Substrate study.
His studies deal with areas such as Etching, Chip and Soldering as well as Wafer.
His Electronic engineering research includes themes of Transmission line and Integrated circuit.
Between 2004 and 2012, his most popular works were:
- Through-wafer interconnects for photoimager and memory wafers (190 citations)
- Methods of forming blind wafer interconnects, and related structures and assemblies (120 citations)
- Microelectronic devices and methods for forming interconnects in microelectronic devices (111 citations)
In his most recent research, the most cited papers focused on:
- Mechanical engineering
- Composite material
- Integrated circuit
His primary areas of investigation include Optoelectronics, Substrate, Interconnection, Integrated circuit and Microelectronics.
His Optoelectronics study combines topics in areas such as Die, Electrical conductor and Image sensor.
His study on Substrate is covered under Layer.
His Integrated circuit research is multidisciplinary, incorporating perspectives in Mechanical engineering, Die, Electrical contacts and Electronic engineering.
His research investigates the connection with Microelectronics and areas like Electrically conductive which intersect with concerns in Line.
His research integrates issues of Etching and Dielectric in his study of Wafer.
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