What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Mechanical engineering
His primary areas of study are Substrate, Optoelectronics, Electronic component, Structural engineering and Interconnection.
His Substrate research includes elements of Semiconductor chip, Semiconductor, Spring and Plating.
The concepts of his Optoelectronics study are interwoven with issues in Soldering, Electrical conductor, Electronic engineering and Interposer.
His Electronic component research is multidisciplinary, relying on both Microelectronics and Wire bonding.
Igor Y. Khandros combines subjects such as Mechanical engineering, Terminal, Printed circuit board and Composite material, Contact area with his study of Structural engineering.
Igor Y. Khandros studied Interconnection and Nanotechnology that intersect with Core.
His most cited work include:
- Semiconductor chip assemblies with fan-in leads (565 citations)
- Semiconductor chip assemblies having interposer and flexible lead (453 citations)
- Semiconductor chip assemblies, methods of making same and components for same (310 citations)
What are the main themes of his work throughout his whole career to date?
His primary areas of investigation include Electronic component, Optoelectronics, Interconnection, Substrate and Semiconductor device.
His Electronic component research is multidisciplinary, incorporating perspectives in Layer, Electrical conductor, Composite material, Terminal and Structural engineering.
His research integrates issues of Semiconductor chip, Electronic engineering and Chip in his study of Optoelectronics.
His research investigates the link between Interconnection and topics such as Printed circuit board that cross with problems in Semiconductor package.
His research investigates the connection between Substrate and topics such as Microelectronics that intersect with problems in Contact element.
His work on Semiconductor device is being expanded to include thematically relevant topics such as Electrical engineering.
He most often published in these fields:
- Electronic component (41.28%)
- Optoelectronics (37.16%)
- Interconnection (35.32%)
What were the highlights of his more recent work (between 2003-2021)?
- Substrate (31.65%)
- Optoelectronics (37.16%)
- Electronic component (41.28%)
In recent papers he was focusing on the following fields of study:
His main research concerns Substrate, Optoelectronics, Electronic component, Electrical engineering and Test data.
His biological study spans a wide range of topics, including Mechanical engineering, Spring, Interconnection and Plating.
His work carried out in the field of Optoelectronics brings together such families of science as Structural engineering, Surface and Interposer.
The concepts of his Electronic component study are interwoven with issues in Layer, Electrical conductor, Composite material, Semiconductor device and Terminal.
In Electronics, Igor Y. Khandros works on issues like Computer hardware, which are connected to Electronic engineering.
He works mostly in the field of Wafer, limiting it down to concerns involving Semiconductor and, occasionally, Production cost and Automotive engineering.
Between 2003 and 2021, his most popular works were:
- Test assembly including a test die for testing a semiconductor product die (149 citations)
- Connection components with frangible leads and bus (108 citations)
- Microelectronic contact structure, and method of making same. (92 citations)
In his most recent research, the most cited papers focused on:
- Electrical engineering
- Composite material
- Mechanical engineering
Igor Y. Khandros mostly deals with Electronics, Test data, Optoelectronics, Computer hardware and Structural engineering.
His Electronics study combines topics in areas such as Transmission, Computer network and Embedded system.
The study incorporates disciplines such as Die, Substrate and Coupling in addition to Optoelectronics.
His study on Interposer is often connected to Process as part of broader study in Substrate.
His research combines Simulation and Computer hardware.
His Structural engineering research integrates issues from Mechanical engineering, Semiconductor chip and Plating.
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