World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
61
Citations
15488
World Ranking
1521
National Ranking
620

Overview

Igor Y. Khandros is affiliated with Nutcracker Therapeutics, located in the United States. The scientist's work is associated with this institution, which is involved in research and development within the biotechnology or therapeutic sectors.

There are no available records of recent papers authored or co-authored by Igor Y. Khandros, and no information is provided regarding frequent collaborators or co-authors.

Data about common publication venues or book publications tied to Igor Y. Khandros is not present. Similarly, there is no detailed information about the main fields or subfields of study associated with this scientist's research activities.

No specific main topics of work or thematic areas connected to their research output have been identified from the data provided.

There are no awards or honors recorded, and there is no indication that the scientist is deceased.

Best Publications

  • Component for connecting a semiconductor chip to a substrate

    Igor Y. Khandros;Thomas H. DiStefano

  • Semiconductor chip assemblies with fan-in leads

    Igor Y. Khandros;Thomas H. DiStefano

  • Semiconductor package assembly

    L Matthew Getan;Igor Y Khandros;アイゴアー・ワイ・カンドロス;ゲタン・エル・マシュー

  • Interposer, socket and assembly for socketing an electronic component and method of making and using same

    H. Dozier Ii Thomas;Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros

  • Resilient contact structures formed and then attached to a substrate

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Semiconductor chip assemblies, methods of making same and components for same

    Igor Y. Khandros;Thomas H. Distefano

  • Method and apparatus for burning-in semiconductor devices in wafer form

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Contact carriers (tiles) for populating larger substrates with spring contacts

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetan L. Mathieu;II Thomas H. Dozier

  • Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Probe card assembly and kit, and methods of making same

    Benjamin Niles Eldridge;Gary William Grube;Igor Yan Khandros;Gaetan L. Mathieu

  • Method of planarizing tips of probe elements of a probe card assembly

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Wafer-level burn-in and test

    Igor Y. Khandros;David V. Pedersen

  • Semiconductor connection components and methods with releasable lead support

    Thomas H. DiStefano;Gary W. Grube;Igor Y. Khandros;Gaetan Mathiew

  • Multi-Layer circuit construction method and structure

    Thomas H. DiStefano;Igor Y. Khandros;Gary W. Grube

  • Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

    Benjamin N. Eldridge;Gary W. Grube;Igor Y Khandros;Gaetan L. Mathieu

  • Fabricating interconnects and tips using sacrificial substrates

    Igor Y. Khandros;Benjamin N. Eldridge;Gaetean L. Mathieu

  • Composite interconnection element for microelectronic components, and method of making same

    Igor Y. Khandros;Gaetan L. Mathieu

  • Special contact points for accessing internal circuitry of an integrated circuit

    Benjamin N. Eldridge;Igor Y. Khandros;David V. Pedersen;Ralph G. Whitten

  • Mounting spring elements on semiconductor devices

    Benjamin N. Eldridge;Gary W. Grube;Igor Y. Khandros;Gaetan L. Mathieu

  • Probe card assembly

    Igor Y. Khandros;A. Nicholas Sporck;Benjamin N. Eldridge

  • Stacking semiconductor devices, particularly memory chips

    Igor Y. Khandros;David V. Pedersen

Frequent Co-Authors

benjamin n eldridge
benjamin n eldridge Nutcracker Therapeutics
Thomas H. DiStefano
Thomas H. DiStefano Centipede Systems
Gary W. Grube
Gary W. Grube Motorola (United States)
Charles A. Miller
Charles A. Miller University of Iowa
Ming C. Wu
Ming C. Wu University of California, Berkeley
Gerald S. Frankel
Gerald S. Frankel The Ohio State University
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)

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