World's Best Scientists 2026 revealed!
John U. Knickerbocker

John U. Knickerbocker

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
48
Citations
7707
World Ranking
3116
National Ranking
1169

Overview

John U. Knickerbocker is affiliated with IBM in the United States. Their research spans multiple domains within engineering, with a focus on electrical and electronic engineering, biomedical engineering, human-computer interaction, cognitive neuroscience, and media technology.

Their work often concentrates on topics such as 3D IC and TSV technologies, electronic packaging and soldering technologies, advanced surface polishing techniques, hand gesture recognition systems, interactive and immersive displays, tactile and sensory interactions, and advanced sensor and energy harvesting materials.

The scientist has contributed several recent papers, including:

  • Surface Energy Characterization for Die-Level Cu Hybrid Bonding, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing, 2020, IEEE Access
  • Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails, 2023, Micromachines
  • Next generation Co-Packaged Optics Technology to Train & Run Generative AI Models in Data Centers and Other Computing Applications, 2024, arXiv (Cornell University)

Frequent coauthors of John U. Knickerbocker include Katsuyuki Sakuma, Roy Yu, Michael Belyansky, Marc A Bergendahl, and Juan-Manuel Gomez. Katsuyuki Sakuma in particular has coauthored multiple publications with the scientist.

Their research outputs have appeared in a variety of venues such as the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), IEEE Access, Micromachines, and arXiv (Cornell University).

Best Publications

  • Three-dimensional silicon integration

    J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton

  • Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

    J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch

  • An overview of through-silicon-via technology and manufacturing challenges

    Jeffrey P. Gambino;Shawn A. Adderly;John U. Knickerbocker

  • 3D silicon integration

    J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton

  • 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

    J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang

  • Physically highly secure multi-chip assembly

    Vincenzo Condorelli;Claudius Feger;Kevin C. Gotze;Nihad Hadzic

  • 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

    K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright

  • Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

    Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang

  • Rolling ball connector

    Joseph A. Benenati;Claude L. Bertin;William T. Chen;Thomas E. Dinan

  • A CMOS-compatible process for fabricating electrical through-vias in silicon

    P.S. Andry;C. Tsang;E. Sprogis;C. Patel

  • Interconnection in multi-chip with interposers and bridges

    Douglas James Joseph;John Ulrich Knickerbocker

  • Characterization of micro-bump C4 interconnects for Si-carrier SOP applications

    S.L. Wright;R. Polastre;H. Gan;L.P. Buchwalter

  • Si-based packaging with integrated passive components

    Michael Cotte John;Paul Gaucher Brian;Janusz Grzyb;Deneke Hoivik Nils

  • 2.5D and 3D technology challenges and test vehicle demonstrations

    J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  • Small area, robust silicon via structure and process

    Paul S. Andry;John M. Cotte;John Ulrich Knickerbocker;Cornelia K. Tsang

  • Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

    F. E. Doany;C. L. Schow;B. G. Lee;R. A. Budd

  • Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof

    Jon A. Casey;David B. Goland;Dinesh Gupta;Lester W. Herron

  • Method of testing using a temporary chip attach carrier

    John Ulrich Knickerbocker

  • Z-axis compressible polymer with fine metal matrix suspension

    Peter J. Brofman;John U. Knickerbocker;Sudipta K. Ray;Kathleen A. Stalter

  • Methods for fabricating silicon carriers with conductive through-vias and its produced semiconductor

    Kwietniak Keith T;Basker Veeraraghaven S;Ulrich Knickerbocker John;Michael Cotte John

Frequent Co-Authors

Cornelia K. Tsang
Cornelia K. Tsang IBM Thomas J. Watson Research Center
Paul S. Andry
Paul S. Andry IBM (United States)
Edmund J. Sprogis
Edmund J. Sprogis IBM (United States)
Fuad E. Doany
Fuad E. Doany IBM (United States)
Xiaoxiong Gu
Xiaoxiong Gu IBM (United States)
Christian W. Baks
Christian W. Baks IBM (United States)
Clint L. Schow
Clint L. Schow University of California, Santa Barbara
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
David R. Clarke
David R. Clarke Harvard University
Zheng Xu
Zheng Xu Beijing Jiaotong University

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

For those interested in Electronics and Electrical Engineering, exploring flexible educational options is crucial. Many students benefit from online colleges starting this month, which offer rolling admissions and allow learners to begin their studies without delay.

Short-term credentials can also boost career prospects quickly. For example, 6 month certificate programs that pay well can equip students with focused technical skills, providing pathways into high-demand roles within the engineering field.

Recognizing personal work preferences is equally important; many engineers thrive in environments suited for introverts. Exploring high paying careers for introverts can help identify positions that maximize productivity and job satisfaction.

Additionally, combining engineering expertise with leadership skills can open doors to management roles. Prospective students may consider best accelerated project management degree programs online, enabling them to fast-track their qualifications and career advancement.

Best Scientists Citing John U. Knickerbocker

Trending Scientists