John U. Knickerbocker

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name Citations Publications World Ranking National Ranking

Electronics and Electrical Engineering D-index 47 Citations 7,035 221 World Ranking 2017 National Ranking 854

Three-dimensional silicon integration

J. U. Knickerbocker;P. S. Andry;B. Dang;R. R. Horton.
Journal of Reproduction and Development (2008)

537 Citations

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

J. U. Knickerbocker;P. S. Andry;L. P. Buchwalter;A. Deutsch.
Ibm Journal of Research and Development (2005)

303 Citations

3D silicon integration

J.U. Knickerbocker;P.S. Andry;B. Dang;R.R. Horton.
electronic components and technology conference (2008)

289 Citations

Physically highly secure multi-chip assembly

Vincenzo Condorelli;Claudius Feger;Kevin C. Gotze;Nihad Hadzic.
(2005)

246 Citations

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

J.U. Knickerbocker;C.S. Patel;P.S. Andry;C.K. Tsang.
IEEE Journal of Solid-state Circuits (2006)

242 Citations

Password control via the web

Edward E. Kelley;Norman J. Dauerer;John U. Knickerbocker.
(1997)

208 Citations

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Paul S. Andry;John M. Cotte;John U. Knickerbocker;Cornelia K. Tsang.
(2009)

190 Citations

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

K. Sakuma;P. S. Andry;C. K. Tsang;S. L. Wright.
Journal of Reproduction and Development (2008)

187 Citations

An overview of through-silicon-via technology and manufacturing challenges

Jeffrey P. Gambino;Shawn A. Adderly;John U. Knickerbocker.
Microelectronic Engineering (2015)

184 Citations

Rolling ball connector

Joseph A. Benenati;Claude L. Bertin;William T. Chen;Thomas E. Dinan.
(2001)

171 Citations

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