World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
31
Citations
4632
World Ranking
6525
National Ranking
2135

Overview

Xiaoxiong Gu is a researcher affiliated with IBM in the United States, specializing in engineering with a focus on electrical and electronic engineering. Their work encompasses a range of subfields including aerospace engineering and computer networks and communications.

The primary topics of Xiaoxiong Gu's research include:

  • Microwave Engineering and Waveguides
  • Millimeter-Wave Propagation and Modeling
  • Antenna Design and Analysis
  • Advanced MIMO Systems Optimization
  • Full-Duplex Wireless Communications
  • Advanced Antenna and Metasurface Technologies
  • 3D IC and TSV technologies

Xiaoxiong Gu's frequent collaborators include Bodhisatwa Sadhu, Duixian Liu, Arun Paidimarri, Ning Guan, and Alberto Valdes-Garcia.

The venues where Xiaoxiong Gu has published include:

  • IEEE Journal of Microwaves
  • IEEE Journal of Solid-State Circuits
  • IEEE Microwave and Wireless Components Letters
  • 2022 IEEE International Solid-State Circuits Conference (ISSCC)
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Recent publications authored or co-authored by Xiaoxiong Gu are:

  • Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond, 2021, IEEE Journal of Microwaves
  • Antenna-in-Package Integration for a Wideband Scalable 5G Millimeter-Wave Phased-Array Module, 2021, IEEE Microwave and Wireless Components Letters

Other papers where Xiaoxiong Gu participated as a co-author include works primarily led by Bodhisatwa Sadhu and others, such as:

  • A 24-30-GHz 256-Element Dual-Polarized 5G Phased Array Using Fast On-Chip Beam Calculators and Magnetoelectric Dipole Antennas, 2022, IEEE Journal of Solid-State Circuits
  • A 24-to-30GHz 256-Element Dual-Polarized 5G Phased Array with Fast Beam-Switching Support for >30,000 Beams, 2022, 2022 IEEE International Solid-State Circuits Conference (ISSCC)
  • Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

Best Publications

  • A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications

    Bodhisatwa Sadhu;Yahya Tousi;Joakim Hallin;Stefan Sahl

  • 7.2 A 28GHz 32-element phased-array transceiver IC with concurrent dual polarized beams and 1.4 degree beam-steering resolution for 5G communication

    Bodhisatwa Sadhu;Yahya Tousi;Joakim Hallin;Stefan Sahl

  • Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

    Duixian Liu;Xiaoxiong Gu;Christian W. Baks;Alberto Valdes-Garcia

  • A 90nm CMOS integrated Nano-Photonics technology for 25Gbps WDM optical communications applications

    Solomon Assefa;Steven Shank;William Green;Marwan Khater

  • Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

    R. Rimolo-Donadio;Xiaoxiong Gu;Y.H. Kwark;M.B. Ritter

  • Antenna-in-package structures with broadside and end-fire radiations

    Alberto V. Garcia;Xiaoxiong Gu;Duixian Liu

  • Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications

    Xiaoxiong Gu;Duixian Liu;Christian Baks;Ola Tageman

  • The More (Antennas), the Merrier: A Survey of Silicon-Based mm-Wave Phased Arrays Using Multi-IC Scaling

    Bodhisatwa Sadhu;Xiaoxiong Gu;Alberto Valdes-Garcia

  • Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

    Xiaoxiong Gu;Duixian Liu;Bodhisatwa Sadhu

  • A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

    F. Liu;R.R. Yu;A.M. Young;J.P. Doyle

  • Challenge: COSMOS: A city-scale programmable testbed for experimentation with advanced wireless

    Dipankar Raychaudhuri;Ivan Seskar;Gil Zussman;Thanasis Korakis

  • 2.5D and 3D technology challenges and test vehicle demonstrations

    J. U. Knickerbocker;P. S. Andry;E. Colgan;B. Dang

  • Effects of random rough surface on absorption by conductors at microwave frequencies

    Leung Tsang;Xiaoxiong Gu;H. Braunisch

  • A multilayer organic package with 64 dual-polarized antennas for 28GHz 5G communication

    Xiaoxiong Gu;Duixian Liu;Christian Baks;Ola Tageman

  • W-band scalable phased arrays for imaging and communications

    Xiaoxiong Gu;Alberto Valdes-Garcia;Arun Natarajan;Bodhisatwa Sadhu

  • Is 25 Gb/s On-Board Signaling Viable?

    D.G. Kam;M.B. Ritter;T.J. Beukema;J.F. Bulzacchelli

  • A 24–30-GHz 256-Element Dual-Polarized 5G Phased Array Using Fast On-Chip Beam Calculators and Magnetoelectric Dipole Antennas

    Unknown

  • Wireless communications package with integrated antennas and air cavity

    Christian Wilhelmus Baks;Xiaoxiong Gu;Duixian Liu;Alberto Valdes-Garcia

  • RF distortion analysis with compact MOSFET models

    P. Bendix;P. Rakers;P. Wagh;L. Lemaitre

  • An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects

    T. O. Dickson;Yong Liu;S. V. Rylov;Bing Dang

  • Millimeter-wave radio frequency integrated circuit packages with integrated antennas

    Christian W. Baks;Xiaoxiong Gu;Md. Rashidul Islam;Duixian Liu

  • A fully-integrated dual-polarization 16-element W-band phased-array transceiver in SiGe BiCMOS

    Alberto Valdes-Garcia;Arun Natarajan;Duixian Liu;Mihai Sanduleanu

  • A 24-to-30GHz 256-Element Dual-Polarized 5G Phased Array with Fast Beam-Switching Support for >30,000 Beams

    Unknown

Frequent Co-Authors

Christian W. Baks
Christian W. Baks IBM (United States)
Duixian Liu
Duixian Liu IBM (United States)
Alberto Valdes-Garcia
Alberto Valdes-Garcia IBM (United States)
Leung Tsang
Leung Tsang University of Michigan–Ann Arbor
John U. Knickerbocker
John U. Knickerbocker IBM (United States)
Jun Fan
Jun Fan Missouri University of Science and Technology
Daniel J. Friedman
Daniel J. Friedman IBM (United States)
Jean-Olivier Plouchart
Jean-Olivier Plouchart IBM (United States)
Scott K. Reynolds
Scott K. Reynolds IBM (United States)
Zheng Xu
Zheng Xu Beijing Jiaotong University

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