The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Rao Tummala sits on this spectrum.
This scientist: 644 publications — 92nd percentile
92% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,065 publications or more.
The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Rao Tummala sits on this spectrum.
This scientist: 50 D-Index — 60th percentile
60% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 111 D-Index or more.
Rao Tummala is affiliated with the Georgia Institute of Technology in the United States, with a primary focus on engineering, particularly in electrical and electronic engineering. Their research spans multiple areas including 3D IC and through-silicon via (TSV) technologies, electronic packaging and soldering technologies, microwave engineering and waveguides, electromagnetic compatibility and noise suppression, millimeter-wave propagation and modeling, copper interconnects and reliability, as well as semiconductor materials and devices.
The scientist has contributed to engineering fields through publications in notable venues such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Microwave Theory and Techniques, Polymers, IEEE Antennas and Wireless Propagation Letters, and the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Key recurring venues where they have published extensively include:
Their recent papers illustrate specific focus areas, including millimeter-wave package design, antenna integration, and polymer dielectrics in packaging. Notable publications are:
Frequent collaborators include Madhavan Swaminathan, P. Markondeya Raj, Atom O. Watanabe, Mohanalingam Kathaperumal, and Pratik Nimbalkar. Co-authorship has been significant in advancing research in their areas of expertise.
Throughout their career, the scientist has received recognition in the form of several awards including the IEEE Fellow designation in 1994 for contributions to multichip packages for high-performance computers. Earlier recognitions include the IEEE David Sarnoff Award in 1993 for developing high-density multichip packages for computer applications and election to the United States National Academy of Engineering in 1991 for pioneering work on glass and ceramic/copper multilevel packages for computers.
Rao R. Tummala;Eugene J. Rymaszewski;Y. C. Lee
Rao R. Tummala
Rao R. Tummala
Chang Shi Lao;Jin Liu;Puxian Gao;Liyuan Zhang
Haksun Lee;Vanessa Smet;Rao Tummala
R.R. Tummala
Swapan K. Bhattacharya;Rao R. Tummala
V. Sukumaran;T. Bandyopadhyay;V. Sundaram;R. Tummala
Kyutae Lim;S. Pinel;M. Davis;A. Sutono
Xi Liu;Qiao Chen;Pradeep Dixit;Ritwik Chatterjee
R.R. Tummala;M. Swaminathan;M.M. Tentzeris;J. Laskar
Jin Liu;Peng Fei;Jinhui Song;Xudong Wang
Bernt Narken;Tummala Rao Ramamahara
S.K Bhattacharya;R.R Tummala
Ananda H. Kumar;Peter W. McMillan;Rao R. Tummala
Atom O. Watanabe;Muhammad Ali;Sk Yeahia Been Sayeed;Rao R. Tummala
R.R. Tummala;V.K. Madisetti
Vijay Sukumaran;Gokul Kumar;Koushik Ramachandran;Yuya Suzuki
P. Chahal;R.R. Tummala;M.G. Allen;M. Swaminathan
Vijay Sukumaran;Qiao Chen;Fuhan Liu;Nitesh Kumbhat
Tapobrata Bandyopadhyay;Ritwik Chatterjee;Daehyun Chung;Madhavan Swaminathan
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