What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Semiconductor
Rao Tummala mostly deals with Electronic engineering, Electrical engineering, Optoelectronics, Composite material and Capacitor.
Rao Tummala has included themes like Electronic component, Integrated circuit packaging, Chip, Integrated circuit and Interposer in his Electronic engineering study.
His studies in Optoelectronics integrate themes in fields like Substrate and Printed circuit board.
His Composite material study frequently draws connections to other fields, such as Permittivity.
His Capacitor research incorporates themes from Capacitance, Ceramic, Decoupling and Dielectric.
His study in Nanotechnology is interdisciplinary in nature, drawing from both Nanolithography and Electrical testing.
His most cited work include:
- Microelectronics packaging handbook (1219 citations)
- Ceramic and Glass‐Ceramic Packaging in the 1990s (648 citations)
- Fundamentals of Microsystems Packaging (604 citations)
What are the main themes of his work throughout his whole career to date?
Optoelectronics, Electronic engineering, Composite material, Interposer and Electrical engineering are his primary areas of study.
His work carried out in the field of Optoelectronics brings together such families of science as Thin film and Printed circuit board.
His Electronic engineering research incorporates elements of Wafer, Electronic component, Integrated circuit packaging, Chip and Capacitor.
His Capacitor research is multidisciplinary, relying on both High-κ dielectric, Capacitance and Decoupling.
His studies in Composite material integrate themes in fields like Temperature cycling and Reliability.
The Interposer study combines topics in areas such as Ball grid array, Lithography, Bandwidth, Redistribution layer and Substrate.
He most often published in these fields:
- Optoelectronics (31.99%)
- Electronic engineering (30.29%)
- Composite material (26.12%)
What were the highlights of his more recent work (between 2015-2021)?
- Optoelectronics (31.99%)
- Interposer (18.39%)
- Composite material (26.12%)
In recent papers he was focusing on the following fields of study:
His primary areas of study are Optoelectronics, Interposer, Composite material, Dielectric and Electronic engineering.
His studies deal with areas such as Microvia, Bandwidth and Capacitor as well as Optoelectronics.
His Interposer research is multidisciplinary, incorporating elements of Die, Lithography, Trench, Redistribution layer and Electrical engineering.
His work deals with themes such as Temperature cycling and Copper, which intersect with Composite material.
His Dielectric study combines topics from a wide range of disciplines, such as Layer, Substrate and Material properties.
His study ties his expertise on Radio frequency together with the subject of Electronic engineering.
Between 2015 and 2021, his most popular works were:
- Magneto-Dielectric Nanocomposite for Antenna Miniaturization and SAR Reduction (28 citations)
- Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes (24 citations)
- First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules (24 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Electrical engineering
- Semiconductor
Rao Tummala spends much of his time researching Optoelectronics, Interposer, Insertion loss, Electronic engineering and Composite material.
Rao Tummala is studying Dielectric, which is a component of Optoelectronics.
His Interposer study integrates concerns from other disciplines, such as Silicon, Copper interconnect, Trench, Redistribution layer and Electrical engineering.
Rao Tummala interconnects Inductor, Band-pass filter, Topology and Filter in the investigation of issues within Insertion loss.
His Electronic engineering research incorporates themes from Parasitic capacitance, Radio frequency, Substrate and Embedding.
His Composite material research includes elements of Nanostructure, Temperature cycling and Copper.
This overview was generated by a machine learning system which analysed the scientist’s
body of work. If you have any feedback, you can
contact us
here.
