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Rao Tummala

D-Index & Metrics

Discipline name D-Index World Ranking Current World Ranking National Ranking Current National Ranking Publications Citations
Electronics and Electrical Engineering 50 2735 2622 1040 970 644 17486
Materials Science 42 12445 12035 2850 2649 602 15152

Rao Tummala publications per year

The chart shows the history of publications by Rao Tummala between 1970 and 2025, highlighting the no. of papers published in each year and offering an overview of the publication velocity of this scholar. Rao Tummala published across 56 years, from 1970 to 2025, averaging 12.3 papers a year. Output peaked at 47 publications in 2015. 6 of the 686 publications appeared in the last two years.

No. of publications
10 20 30 40
Bar chart. Horizontal axis: year, 1970 to 2025. Vertical axis: number of publications, 0 to 47. Peak 47 publications in 2015. 1970: 1 publication 1971: 0 publications 1972: 0 publications 1973: 1 publication 1974: 4 publications 1975: 7 publications 1976: 8 publications 1977: 2 publications 1978: 6 publications 1979: 1 publication 1980: 2 publications 1981: 0 publications 1982: 0 publications 1983: 0 publications 1984: 2 publications 1985: 1 publication 1986: 1 publication 1987: 1 publication 1988: 1 publication 1989: 3 publications 1990: 4 publications 1991: 6 publications 1992: 6 publications 1993: 2 publications 1994: 2 publications 1995: 5 publications 1996: 3 publications 1997: 8 publications 1998: 8 publications 1999: 5 publications 2000: 14 publications 2001: 22 publications 2002: 23 publications 2003: 14 publications 2004: 43 publications 2005: 25 publications 2006: 24 publications 2007: 24 publications 2008: 23 publications 2009: 12 publications 2010: 18 publications 2011: 26 publications 2012: 29 publications 2013: 22 publications 2014: 35 publications 2015: 47 publications 2016: 45 publications 2017: 45 publications 2018: 36 publications 2019: 23 publications 2020: 24 publications 2021: 7 publications 2022: 5 publications 2023: 4 publications 2024: 3 publications 2025: 3 publications
1970 2025

686 publications in total across all disciplines

View publications per year as a table
Rao Tummala: publications per year, 1970 to 2025
Year Publications
1970 1
1971 0
1972 0
1973 1
1974 4
1975 7
1976 8
1977 2
1978 6
1979 1
1980 2
1981 0
1982 0
1983 0
1984 2
1985 1
1986 1
1987 1
1988 1
1989 3
1990 4
1991 6
1992 6
1993 2
1994 2
1995 5
1996 3
1997 8
1998 8
1999 5
2000 14
2001 22
2002 23
2003 14
2004 43
2005 25
2006 24
2007 24
2008 23
2009 12
2010 18
2011 26
2012 29
2013 22
2014 35
2015 47
2016 45
2017 45
2018 36
2019 23
2020 24
2021 7
2022 5
2023 4
2024 3
2025 3
Total 686
Download as CSV

Rao Tummala publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Rao Tummala sits on this spectrum.

No. of scientists
100 200 300 400
Bar chart with 53 bars. Horizontal axis: publications, 34–53 to 1,065+. Vertical axis: number of scientists, 0 to 445. Most scientists, 445, have 174–193 publications. The last bar groups every scientist with 1,065 publications or more. The highlighted bar, 634–653 publications, is where this scientist sits. 34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34–53 publications 1,065+

This scientist: 644 publications — 92nd percentile

92% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

View publications distribution as a table
Number of Electronics and Electrical Engineering scientists by publication count, Research.com 2026 ranking edition. Based on 6,875 ranked scientists.
Publications Scientists This scientist
34–53 24
54–73 52
74–93 114
94–113 203
114–133 269
134–153 355
154–173 403
174–193 445
194–213 430
214–233 431
234–253 399
254–273 366
274–293 335
294–313 300
314–333 276
334–353 250
354–373 214
374–393 187
394–413 152
414–433 169
434–453 147
454–473 111
474–493 117
494–513 103
514–533 99
534–553 92
554–573 75
574–593 58
594–613 69
614–633 50
634–653 62 644
654–673 54
674–693 44
694–713 37
714–733 28
734–753 26
754–773 26
774–793 19
794–813 23
814–833 20
834–853 16
854–873 20
874–893 11
894–913 11
914–933 16
934–953 13
954–973 10
974–993 11
994–1,013 9
1,014–1,033 9
1,034–1,053 10
1,054–1,064 6
1,065+ 99
Download as CSV

Rao Tummala D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Rao Tummala sits on this spectrum.

No. of scientists
50 100 150 200 250
Bar chart with 82 bars. Horizontal axis: D-Index, 30 to 111+. Vertical axis: number of scientists, 0 to 263. Most scientists, 263, have 32 D-Index. The last bar groups every scientist with 111 D-Index or more. The highlighted bar, 50 D-Index, is where this scientist sits. 30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 50 D-Index — 60th percentile

60% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

View D-Index distribution as a table
Number of Electronics and Electrical Engineering scientists by D-index, Research.com 2026 ranking edition. Based on 6,875 ranked scientists.
D-Index Scientists This scientist
30 178
31 257
32 263
33 262
34 244
35 236
36 211
37 220
38 214
39 214
40 205
41 187
42 194
43 201
44 155
45 189
46 148
47 160
48 134
49 130
50 141 50
51 156
52 108
53 130
54 112
55 97
56 111
57 102
58 108
59 120
60 103
61 93
62 92
63 74
64 77
65 73
66 64
67 69
68 60
69 39
70 57
71 59
72 46
73 49
74 38
75 35
76 32
77 35
78 31
79 22
80 34
81 31
82 34
83 23
84 18
85 30
86 19
87 19
88 20
89 8
90 17
91 7
92 14
93 9
94 15
95 10
96 12
97 10
98 10
99 12
100 16
101 5
102 7
103 7
104 8
105 9
106 13
107 4
108 5
109 10
110 8
111+ 96
Download as CSV

Research.com Recognitions

  • 1994 - IEEE Fellow For contributions to the development of multichip packages for high-performance computers.
  • 1993 - IEEE David Sarnoff Award "For development of high density, high performance multichip packages for computer applications."
  • 1991 - Member of the National Academy of Engineering For pioneering contributions in developing glass, ceramic/copper multilevel packages for computers.

Overview

Rao Tummala is affiliated with the Georgia Institute of Technology in the United States, with a primary focus on engineering, particularly in electrical and electronic engineering. Their research spans multiple areas including 3D IC and through-silicon via (TSV) technologies, electronic packaging and soldering technologies, microwave engineering and waveguides, electromagnetic compatibility and noise suppression, millimeter-wave propagation and modeling, copper interconnects and reliability, as well as semiconductor materials and devices.

The scientist has contributed to engineering fields through publications in notable venues such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Microwave Theory and Techniques, Polymers, IEEE Antennas and Wireless Propagation Letters, and the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Key recurring venues where they have published extensively include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Microwave Theory and Techniques
  • Polymers
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IEEE Antennas and Wireless Propagation Letters

Their recent papers illustrate specific focus areas, including millimeter-wave package design, antenna integration, and polymer dielectrics in packaging. Notable publications are:

  • "Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias" (2020) in IEEE Transactions on Microwave Theory and Techniques
  • "Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications" (2020) in IEEE Antennas and Wireless Propagation Letters
  • "Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications" (2020) in IEEE Transactions on Components Packaging and Manufacturing Technology
  • "A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates" (2023) in Polymers
  • "Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands" (2020) in IEEE Transactions on Components Packaging and Manufacturing Technology

Frequent collaborators include Madhavan Swaminathan, P. Markondeya Raj, Atom O. Watanabe, Mohanalingam Kathaperumal, and Pratik Nimbalkar. Co-authorship has been significant in advancing research in their areas of expertise.

Throughout their career, the scientist has received recognition in the form of several awards including the IEEE Fellow designation in 1994 for contributions to multichip packages for high-performance computers. Earlier recognitions include the IEEE David Sarnoff Award in 1993 for developing high-density multichip packages for computer applications and election to the United States National Academy of Engineering in 1991 for pioneering work on glass and ceramic/copper multilevel packages for computers.

Best Publications

  • Microelectronics Packaging Handbook

    Rao R. Tummala;Eugene J. Rymaszewski;Y. C. Lee

  • Fundamentals of Microsystems Packaging

    Rao R. Tummala

  • Ceramic and Glass‐Ceramic Packaging in the 1990s

    Rao R. Tummala

  • ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across au electrodes.

    Chang Shi Lao;Jin Liu;Puxian Gao;Liyuan Zhang

  • A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

    Haksun Lee;Vanessa Smet;Rao Tummala

  • SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade

    R.R. Tummala

  • Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates

    Swapan K. Bhattacharya;Rao R. Tummala

  • Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

    V. Sukumaran;T. Bandyopadhyay;V. Sundaram;R. Tummala

  • RF-system-on-package (SOP) for wireless communications

    Kyutae Lim;S. Pinel;M. Davis;A. Sutono

  • Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

    Xi Liu;Qiao Chen;Pradeep Dixit;Ritwik Chatterjee

  • The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

    R.R. Tummala;M. Swaminathan;M.M. Tentzeris;J. Laskar

  • Carrier density and Schottky barrier on the performance of DC nanogenerator.

    Jin Liu;Peng Fei;Jinhui Song;Xudong Wang

  • SUBSTRATO VETROCERAMICA A PIU' STRATI PER IL MONTAGGIO DI UN DISPOSITIVO SEMICONDUTTORE

    Bernt Narken;Tummala Rao Ramamahara

  • Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors

    S.K Bhattacharya;R.R Tummala

  • Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper

    Ananda H. Kumar;Peter W. McMillan;Rao R. Tummala

  • A Review of 5G Front-End Systems Package Integration

    Atom O. Watanabe;Muhammad Ali;Sk Yeahia Been Sayeed;Rao R. Tummala

  • System on chip or system on package

    R.R. Tummala;V.K. Madisetti

  • Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

    Vijay Sukumaran;Gokul Kumar;Koushik Ramachandran;Yuya Suzuki

  • A novel integrated decoupling capacitor for MCM-L technology

    P. Chahal;R.R. Tummala;M.G. Allen;M. Swaminathan

  • Through-package-via formation and metallization of glass interposers

    Vijay Sukumaran;Qiao Chen;Fuhan Liu;Nitesh Kumbhat

  • Electrical modeling of Through Silicon and Package Vias

    Tapobrata Bandyopadhyay;Ritwik Chatterjee;Daehyun Chung;Madhavan Swaminathan

Frequent Co-Authors

Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
Manos M. Tentzeris
Manos M. Tentzeris Georgia Institute of Technology
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology
Gee-Kung Chang
Gee-Kung Chang Georgia Institute of Technology
J. Laskar
J. Laskar Maja Systems
Zhong Lin Wang
Zhong Lin Wang Georgia Institute of Technology
Ali Adibi
Ali Adibi Georgia Institute of Technology
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Mark G. Allen
Mark G. Allen University of Pennsylvania
Ashok Saxena
Ashok Saxena University of Arkansas at Fayetteville

External Links

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Related Online Degrees & Career Pathways

For students pursuing Electronics and Electrical Engineering in the USA, exploring complementary online degrees can broaden career opportunities. Many professionals consider combining their technical skills with management expertise. Programs like project management degree online fast offer accelerated pathways to quickly develop leadership competencies.

Those seeking a more traditional route may find value in a bachelor of project management online. This degree equips students with essential skills to oversee complex engineering projects, enhancing their potential in multidisciplinary teams.

Balancing work and study is a common challenge, so many opt for accelerated degree programs for working adults. These are tailored to fit busy schedules, allowing continuous professional development without putting careers on hold.

Additionally, integrating knowledge from areas like design and education can be beneficial. An online masters in instructional design helps engineers develop training programs or technical documentation effectively, supporting roles beyond traditional engineering tasks.

Best Scientists Citing Rao Tummala

Madhavan Swaminathan

Madhavan Swaminathan

Pennsylvania State University

Publications: 82

Joungho Kim

Joungho Kim

Korea Advanced Institute of Science and Technology

Publications: 75

Zhong Lin Wang

Zhong Lin Wang

Georgia Institute of Technology

Publications: 50

Ching-Ping Wong

Ching-Ping Wong

Georgia Institute of Technology

Publications: 48

Manos M. Tentzeris

Manos M. Tentzeris

Georgia Institute of Technology

Publications: 39

J. Laskar

J. Laskar

Maja Systems

Publications: 39

Sung Kyu Lim

Sung Kyu Lim

Georgia Institute of Technology

Publications: 36

John Papapolymerou

John Papapolymerou

Michigan State University

Publications: 35

Mailadil Thomas Sebastian

Mailadil Thomas Sebastian

Council of Scientific and Industrial Research

Publications: 35

John H. Lau

John H. Lau

ASM International

Publications: 29

Muhannad S. Bakir

Muhannad S. Bakir

Georgia Institute of Technology

Publications: 27

Johan Liu

Johan Liu

Chalmers University of Technology

Publications: 26

Sahn Nahm

Sahn Nahm

Korea University

Publications: 20

Hannu Tenhunen

Hannu Tenhunen

Royal Institute of Technology

Publications: 20

Paul A. Kohl

Paul A. Kohl

Georgia Institute of Technology

Publications: 20

Kyoung-Sik Moon

Kyoung-Sik Moon

Georgia Institute of Technology

Publications: 20

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