World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
50
Citations
17486
World Ranking
2735
National Ranking
1039

Materials Science

D-Index
42
Citations
15152
World Ranking
12449
National Ranking
2853

Research.com Recognitions

  • 1994 - IEEE Fellow For contributions to the development of multichip packages for high-performance computers.
  • 1993 - IEEE David Sarnoff Award "For development of high density, high performance multichip packages for computer applications."
  • 1991 - Member of the National Academy of Engineering For pioneering contributions in developing glass, ceramic/copper multilevel packages for computers.

Overview

Rao Tummala is affiliated with the Georgia Institute of Technology in the United States, with a primary focus on engineering, particularly in electrical and electronic engineering. Their research spans multiple areas including 3D IC and through-silicon via (TSV) technologies, electronic packaging and soldering technologies, microwave engineering and waveguides, electromagnetic compatibility and noise suppression, millimeter-wave propagation and modeling, copper interconnects and reliability, as well as semiconductor materials and devices.

The scientist has contributed to engineering fields through publications in notable venues such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Microwave Theory and Techniques, Polymers, IEEE Antennas and Wireless Propagation Letters, and the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Key recurring venues where they have published extensively include:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Microwave Theory and Techniques
  • Polymers
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IEEE Antennas and Wireless Propagation Letters

Their recent papers illustrate specific focus areas, including millimeter-wave package design, antenna integration, and polymer dielectrics in packaging. Notable publications are:

  • "Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias" (2020) in IEEE Transactions on Microwave Theory and Techniques
  • "Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications" (2020) in IEEE Antennas and Wireless Propagation Letters
  • "Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications" (2020) in IEEE Transactions on Components Packaging and Manufacturing Technology
  • "A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates" (2023) in Polymers
  • "Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands" (2020) in IEEE Transactions on Components Packaging and Manufacturing Technology

Frequent collaborators include Madhavan Swaminathan, P. Markondeya Raj, Atom O. Watanabe, Mohanalingam Kathaperumal, and Pratik Nimbalkar. Co-authorship has been significant in advancing research in their areas of expertise.

Throughout their career, the scientist has received recognition in the form of several awards including the IEEE Fellow designation in 1994 for contributions to multichip packages for high-performance computers. Earlier recognitions include the IEEE David Sarnoff Award in 1993 for developing high-density multichip packages for computer applications and election to the United States National Academy of Engineering in 1991 for pioneering work on glass and ceramic/copper multilevel packages for computers.

Best Publications

  • Microelectronics Packaging Handbook

    Rao R. Tummala;Eugene J. Rymaszewski;Y. C. Lee

  • Fundamentals of Microsystems Packaging

    Rao R. Tummala

  • Ceramic and Glass‐Ceramic Packaging in the 1990s

    Rao R. Tummala

  • ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across au electrodes.

    Chang Shi Lao;Jin Liu;Puxian Gao;Liyuan Zhang

  • A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues

    Haksun Lee;Vanessa Smet;Rao Tummala

  • SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade

    R.R. Tummala

  • Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates

    Swapan K. Bhattacharya;Rao R. Tummala

  • Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

    V. Sukumaran;T. Bandyopadhyay;V. Sundaram;R. Tummala

  • RF-system-on-package (SOP) for wireless communications

    Kyutae Lim;S. Pinel;M. Davis;A. Sutono

  • Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

    Xi Liu;Qiao Chen;Pradeep Dixit;Ritwik Chatterjee

  • The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

    R.R. Tummala;M. Swaminathan;M.M. Tentzeris;J. Laskar

  • Carrier density and Schottky barrier on the performance of DC nanogenerator.

    Jin Liu;Peng Fei;Jinhui Song;Xudong Wang

  • SUBSTRATO VETROCERAMICA A PIU' STRATI PER IL MONTAGGIO DI UN DISPOSITIVO SEMICONDUTTORE

    Bernt Narken;Tummala Rao Ramamahara

  • Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors

    S.K Bhattacharya;R.R Tummala

  • Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper

    Ananda H. Kumar;Peter W. McMillan;Rao R. Tummala

  • A Review of 5G Front-End Systems Package Integration

    Atom O. Watanabe;Muhammad Ali;Sk Yeahia Been Sayeed;Rao R. Tummala

  • System on chip or system on package

    R.R. Tummala;V.K. Madisetti

  • Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

    Vijay Sukumaran;Gokul Kumar;Koushik Ramachandran;Yuya Suzuki

  • A novel integrated decoupling capacitor for MCM-L technology

    P. Chahal;R.R. Tummala;M.G. Allen;M. Swaminathan

  • Through-package-via formation and metallization of glass interposers

    Vijay Sukumaran;Qiao Chen;Fuhan Liu;Nitesh Kumbhat

  • Electrical modeling of Through Silicon and Package Vias

    Tapobrata Bandyopadhyay;Ritwik Chatterjee;Daehyun Chung;Madhavan Swaminathan

Frequent Co-Authors

Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
Manos M. Tentzeris
Manos M. Tentzeris Georgia Institute of Technology
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology
Gee-Kung Chang
Gee-Kung Chang Georgia Institute of Technology
J. Laskar
J. Laskar Maja Systems
Zhong Lin Wang
Zhong Lin Wang Georgia Institute of Technology
Ali Adibi
Ali Adibi Georgia Institute of Technology
Yogendra Joshi
Yogendra Joshi Georgia Institute of Technology
Mark G. Allen
Mark G. Allen University of Pennsylvania
Ashok Saxena
Ashok Saxena University of Arkansas at Fayetteville

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