World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
54
Citations
10433
World Ranking
2305
National Ranking
899

Sung Kyu Lim publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Sung Kyu Lim sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 459 publications — 81st percentile

81% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Sung Kyu Lim D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Sung Kyu Lim sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 54 D-Index — 68th percentile

68% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Sung Kyu Lim is affiliated with Georgia Institute of Technology in the United States. Their research contributions predominantly lie within the fields of Engineering and Computer Science, with a focus on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Computer Vision and Pattern Recognition, and Artificial Intelligence.

Their work addresses various key topics including 3D IC and TSV technologies, VLSI and FPGA design techniques, advanced memory and neural computing, ferroelectric and negative capacitance devices, semiconductor materials and devices, VLSI and analog circuit testing, and advancements in photolithography techniques.

Recent papers by Sung Kyu Lim highlight developments in chip design and electronic device technologies. These include:

  • "Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse" (2020), published in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • "Antiferroelectric negative capacitance from a structural phase transition in zirconia" (2022), published in Nature Communications
  • "Heterogeneous Mixed-Signal Monolithic 3-D In-Memory Computing Using Resistive RAM" (2020), published in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • "Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs" (2021), published in IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Performance, Power, and Area of Standard Cells in Sub 3 nm Node Using Buried Power Rail" (2022), published in IEEE Transactions on Electron Devices

Sung Kyu Lim has frequently collaborated with several researchers, notably Jinwoo Kim, Gauthaman Murali, Anthony Agnesina, Sai Pentapati, and Yi-Chen Lu, reflecting ongoing partnerships in their research activities.

The primary publication venues where Sung Kyu Lim has contributed extensively include:

  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • ACM Transactions on Design Automation of Electronic Systems
  • arXiv (Cornell University)
  • IEEE Transactions on Components Packaging and Manufacturing Technology

Best Publications

  • TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC

    Moongon Jung;Joydeep Mitra;David Z. Pan;Sung Kyu Lim

  • Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout

    Dae Hyun Kim;K. Athikulwongse;Sung Kyu Lim

  • A study of Through-Silicon-Via impact on the 3D stacked IC layout

    Dae Hyun Kim;Krit Athikulwongse;Sung Kyu Lim

  • 3D-MAPS: 3D Massively parallel processor with stacked memory

    Dae Hyun Kim;Krit Athikulwongse;Michael Healy;Mohammad Hossain

  • TSV stress aware timing analysis with applications to 3D-IC layout optimization

    Jae-Seok Yang;Krit Athikulwongse;Young-Joon Lee;Sung Kyu Lim

  • Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

    Yoon Jo Kim;Yogendra K. Joshi;Andrei G. Fedorov;Young-Joon Lee

  • Design and CAD methodologies for low power gate-level monolithic 3D ICs

    Shreepad A. Panth;Kambiz Samadi;Yang Du;Sung Kyu Lim

  • Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs

    M. Healy;M. Vittes;M. Ekpanyapong;C.S. Ballapuram

  • 3D Floorplanning with Thermal Vias

    Eric Wong;Sung Kyu Lim

  • Physical design for 3D system on package

    S.K. Lim

  • Stress-driven 3D-IC placement with TSV keep-out zone and regularity study

    Krit Athikulwongse;Ashutosh Chakraborty;Jae-Seok Yang;David Z. Pan

  • Edge separability-based circuit clustering with application to multilevel circuit partitioning

    J. Cong;Sung Kyu Lim

  • Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC

    Chang Liu;Taigon Song;Jonghyun Cho;Joohee Kim

  • A design tradeoff study with monolithic 3D integration

    Chang Liu;Sung Kyu Lim

  • Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs

    Shreepad Panth;Kambiz Samadi;Yang Du;Sung Kyu Lim

  • Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling

    Dae Hyun Kim;S Mukhopadhyay;Sung Kyu Lim

  • Multiway partitioning with pairwise movement

    Jason Cong;Sung Kyu Lim

  • Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory

    Michael B. Healy;Krit Athikulwongse;Rohan Goel;Mohammad M. Hossain

  • Physical planning with retiming

    Jason Cong;Sung Kyu Lim

  • Low-Power and Reliable Clock Network Design for Through-Silicon Via (TSV) Based 3D ICs

    Xin Zhao;J Minz;Sung Kyu Lim

  • Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat

    Yoon Jo Kim;Yogendra K. Joshi;Andrei G. Fedorov;Young-Joon Lee

Frequent Co-Authors

Saibal Mukhopadhyay
Saibal Mukhopadhyay Georgia Institute of Technology
David Z. Pan
David Z. Pan The University of Texas at Austin
Hsien-Hsin S. Lee
Hsien-Hsin S. Lee Intel (United States)
Krishnendu Chakrabarty
Krishnendu Chakrabarty Arizona State University
Madhavan Swaminathan
Madhavan Swaminathan Pennsylvania State University
Jason Cong
Jason Cong University of California, Los Angeles
Gabriel H. Loh
Gabriel H. Loh Advanced Micro Devices (United States)
Michael Niemier
Michael Niemier University of Notre Dame
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology
Garrett S. Rose
Garrett S. Rose University of Tennessee at Knoxville

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