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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
71
Citations
22639
World Ranking
846
National Ranking
365

Overview

Eby G. Friedman is affiliated with the University of Rochester in the United States. Their research primarily spans the fields of Engineering and Physics and Astronomy, with a focus on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Condensed Matter Physics. They have contributed extensively to the study of quantum and electron transport phenomena as well as physics of superconductivity and magnetism.

The main research topics covered in their work include:

  • Quantum and electron transport phenomena
  • Physics of Superconductivity and Magnetism
  • Low-power high-performance VLSI design
  • Advancements in Semiconductor Devices and Circuit Design
  • Magnetic properties of thin films
  • Semiconductor materials and devices
  • Electromagnetic Compatibility and Noise Suppression

Friedman has published numerous papers in several distinguished journals. Their frequent publication venues are:

  • IEEE Transactions on Applied Superconductivity
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • Microelectronics Journal
  • IEEE Transactions on Components Packaging and Manufacturing Technology

Some of their recent papers include:

  • Repeater Insertion in SFQ Interconnect, 2020, IEEE Transactions on Applied Superconductivity
  • Design Methodology for Distributed Large-Scale ERSFQ Bias Networks, 2020, IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • Splitter Trees in Single Flux Quantum Circuits, 2021, IEEE Transactions on Applied Superconductivity
  • Asynchronous Dynamic Single-Flux Quantum Majority Gates, 2020, IEEE Transactions on Applied Superconductivity
  • QuCTS-Single-Flux Quantum Clock Tree Synthesis, 2021, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Collaborative research is a significant aspect of Friedman's work, with frequent co-authors including:

  • Gleb Krylov
  • Tahereh Jabbari
  • Nurzhan Zhuldassov
  • Rassul Bairamkulov
  • Abdelrahman G. Qoutb

Best Publications

  • TEAM: ThrEshold Adaptive Memristor Model

    S. Kvatinsky;E. G. Friedman;A. Kolodny;U. C. Weiser

  • MAGIC—Memristor-Aided Logic

    Shahar Kvatinsky;Dmitry Belousov;Slavik Liman;Guy Satat

  • VTEAM: A General Model for Voltage-Controlled Memristors

    Shahar Kvatinsky;Misbah Ramadan;Eby G. Friedman;Avinoam Kolodny

  • Memristor-Based Material Implication (IMPLY) Logic: Design Principles and Methodologies

    Shahar Kvatinsky;Guy Satat;Nimrod Wald;Eby G. Friedman

  • Figures of merit to characterize the importance of on-chip inductance

    Y.I. Ismail;E.G. Friedman;J.L. Neves

  • Clock distribution networks in synchronous digital integrated circuits

    E.G. Friedman

  • 3-D Topologies for Networks-on-Chip

    V.F. Pavlidis;E.G. Friedman

  • Effects of inductance on the propagation delay and repeater insertion in VLSI circuits

    Y.I. Ismail;E.G. Friedman

  • On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions

    M. Haurylau;Guoqing Chen;Hui Chen;Jidong Zhang

  • System timing

    Ivan S. Kourtev;Eby G. Friedman

  • Three-Dimensional Integrated Circuit Design

    Vasilis F. Pavlidis;Eby G. Friedman

  • Equivalent Elmore delay for RLC trees

    Y.I. Ismail;E.G. Friedman;J.L. Neves

  • Multi-voltage CMOS Circuit Design

    Volkan Kursun;Eby G. Friedman

  • MRL — Memristor Ratioed Logic

    Shahar Kvatinsky;Nimrod Wald;Guy Satat;Avinoam Kolodny

  • Repeater design to reduce delay and power in resistive interconnect

    V. Adler;E.G. Friedman

  • Effects of inductance on the propagation delay and repeater insertion in VLSI circuits

    Unknown

  • Power Distribution Networks with On-Chip Decoupling Capacitors

    Mikhail Popovich;Andrey V. Mezhiba;Eby G. Friedman

  • Multi-Voltage CMOS Circuit Design: Kursun/Multi-Voltage CMOS Circuit Design

    Volkan Kursun;Eby G. Friedman

  • Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance

    I. Savidis;E.G. Friedman

  • Predictions of CMOS compatible on-chip optical interconnect

    Guoqing Chen;Hui Chen;Mikhail Haurylau;Nicholas Nelson

  • Memristor-Based Circuit Design for Multilayer Neural Networks

    Yang Zhang;Xiaoping Wang;Eby G. Friedman

  • Figures of Merit to Characterize the Importance of On-Chip Inductance in Single Lines

    Yehea I. Ismail;Eby G. Friedman

Frequent Co-Authors

Yehea Ismail
Yehea Ismail American University in Cairo
Avinoam Kolodny
Avinoam Kolodny Technion – Israel Institute of Technology
Volkan Kursun
Volkan Kursun Bilkent University
Shahar Kvatinsky
Shahar Kvatinsky Technion – Israel Institute of Technology
David H. Albonesi
David H. Albonesi Cornell University
Ran Ginosar
Ran Ginosar Technion – Israel Institute of Technology
Philippe M. Fauchet
Philippe M. Fauchet Vanderbilt University
Siva G. Narendra
Siva G. Narendra Tyfone, Inc.
Vivek De
Vivek De Intel (United States)
Marios C. Papaefthymiou
Marios C. Papaefthymiou University of California, Irvine

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