World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
53
Citations
12168
World Ranking
2377
National Ranking
921

Research.com Recognitions

  • 2006 - IEEE Fellow For contributions in design tools, design methodologies and electromagnetic interference (EMI) control for power delivery in digital and mixed signal systems.
  • 1977 - Member of the National Academy of Sciences

Overview

Madhavan Swaminathan is affiliated with Pennsylvania State University in the United States. Their research contributions focus primarily in the field of Engineering, with a significant emphasis on Electrical and Electronic Engineering. Their work also spans subfields including Aerospace Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, and Materials Chemistry.

The scientist's main research topics include:

  • 3D IC and TSV technologies
  • Microwave Engineering and Waveguides
  • Electromagnetic Compatibility and Noise Suppression
  • Millimeter-Wave Propagation and Modeling
  • Semiconductor Lasers and Optical Devices
  • Radio Frequency Integrated Circuit Design
  • Silicon Carbide Semiconductor Technologies

Selected recent publications illustrate the range of their research interests and the venues in which they have published. These include:

  • "Power Delivery for High-Performance Microprocessors-Challenges, Solutions, and Future Trends," 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse," 2020, IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • "Facile synthesis of sphere-like structured ZnIn2S4-rGO-CuInS2 ternary heterojunction catalyst for efficient visible-active photocatalytic hydrogen evolution," 2021, Journal of Colloid and Interface Science
  • "Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias," 2020, IEEE Transactions on Microwave Theory and Techniques

The frequent coauthors collaborating with Madhavan Swaminathan include:

  • Rao Tummala
  • Mohanalingam Kathaperumal
  • Serhat Erdogan
  • Fuhan Liu
  • Xiaofan Jia

Publications by this scientist are often found in the following venues:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IEEE Transactions on Microwave Theory and Techniques
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • IMAPSource Proceedings

The scientist has been recognized as an IEEE Fellow since 2006 for contributions in design tools, design methodologies, and electromagnetic interference control for power delivery in digital and mixed signal systems. They are also a member of the National Academy of Sciences since 1977.

Best Publications

  • Power Integrity Modeling and Design for Semiconductors and Systems

    Madhavan Swaminathan;A. Engin

  • Power distribution networks for system-on-package: status and challenges

    M. Swaminathan;Joungho Kim;I. Novak;J.P. Libous

  • Impact of power-supply noise on timing in high-frequency microprocessors

    M. Saint-Laurent;M. Swaminathan

  • Modeling and transient simulation of planes in electronic packages

    Nanju Na;Jinseong Choi;Sungjun Chun;Madhavan Swaminathan

  • Modeling of irregular shaped power distribution planes using transmission matrix method

    Joong-Ho Kim;M. Swaminathan

  • The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

    R.R. Tummala;M. Swaminathan;M.M. Tentzeris;J. Laskar

  • Designing and Modeling for Power Integrity

    Madhavan Swaminathan;Daehyun Chung;Stefano Grivet-Talocia;Krishna Bharath

  • Modeling of simultaneous switching noise in high speed systems

    Sungjun Chun;M. Swaminathan;L.D. Smith;J. Srinivasan

  • A novel integrated decoupling capacitor for MCM-L technology

    P. Chahal;R.R. Tummala;M.G. Allen;M. Swaminathan

  • Electrical modeling of Through Silicon and Package Vias

    Tapobrata Bandyopadhyay;Ritwik Chatterjee;Daehyun Chung;Madhavan Swaminathan

  • Method of constructing an integrated circuit memory

    Michael Ford McAllister;James Alexander McDonald;Gordon Jay Robbins;Madhavan Swaminathan

  • High-Dimensional Global Optimization Method for High-Frequency Electronic Design

    Hakki Mert Torun;Madhavan Swaminathan

  • Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions

    Ki Jin Han;M Swaminathan;T Bandyopadhyay

  • Electrical-Thermal Co-Simulation of 3D Integrated Systems With Micro-Fluidic Cooling and Joule Heating Effects

    Jianyong Xie;M Swaminathan

  • A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications

    Jinwoo Choi;V. Govind;M. Swaminathan

  • Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects

    T Bandyopadhyay;Ki Jin Han;Daehyun Chung;R Chatterjee

  • Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends

    Kaladhar Radhakrishnan;Madhavan Swaminathan;Bidyut K. Bhattacharyya

  • Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation

    M. Swaminathan;E. Arvas;T.K. Sarkar;A.R. Djordjevic

  • PASSIVE SIGNALVERARBEITUNGSKOMPONENTEN AUF FLÜSSIGKRISTALLPOLYMER- UND MEHRSCHICHTPOLYMERBASIS FÜR HF-/DRAHTLOS-MEHRBAND-ANWENDUNGEN

    White George;Swaminathan Madhavan;Sundaram Venkatesh;Dalmia Sidharth

  • A Global Bayesian Optimization Algorithm and Its Application to Integrated System Design

    Hakki Mert Torun;Madhavan Swaminathan;Anto Kavungal Davis;Mohamed Lamine Faycal Bellaredj

  • Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes

    A.E. Engin;K. Bharath;M. Swaminathan

  • Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias

    Vijay Sukumaran;Tapobrata Bandyopadhyay;Qiao Chen;Nitesh Kumbhat

Frequent Co-Authors

Rao Tummala
Rao Tummala Georgia Institute of Technology
Tapan K. Sarkar
Tapan K. Sarkar Syracuse University
Abhijit Chatterjee
Abhijit Chatterjee Georgia Institute of Technology
Paul A. Kohl
Paul A. Kohl Georgia Institute of Technology
Saibal Mukhopadhyay
Saibal Mukhopadhyay Georgia Institute of Technology
Sung Kyu Lim
Sung Kyu Lim Georgia Institute of Technology
Kwang-Ting Cheng
Kwang-Ting Cheng Hong Kong University of Science and Technology
Ting Lei
Ting Lei Peking University
J. Laskar
J. Laskar Maja Systems
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology

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