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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
47
Citations
9701
World Ranking
3201
National Ranking
1196

Overview

Jun Fan is affiliated with the Missouri University of Science and Technology in the United States. Their research predominantly spans the field of Engineering with a particular focus on Electrical and Electronic Engineering, Aerospace Engineering, Mechanical Engineering, Renewable Energy, Sustainability and the Environment, and Artificial Intelligence.

The main areas of study encompass topics such as Electromagnetic Compatibility and Noise Suppression, Electromagnetic Compatibility and Measurements, Antenna Design and Analysis, Microwave Engineering and Waveguides, Advanced Antenna and Metasurface Technologies, 3D IC and TSV technologies, and Electronic Packaging and Soldering Technologies.

Jun Fan has contributed extensively to publication venues including:

  • IEEE Transactions on Electromagnetic Compatibility
  • 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
  • IEEE Transactions on Signal and Power Integrity
  • IEEE Transactions on Microwave Theory and Techniques
  • IEEE Electromagnetic Compatibility Magazine

The scientist's recent published papers include:

  • Inaudible Attack on Smart Speakers With Intentional Electromagnetic Interference, 2021, IEEE Transactions on Microwave Theory and Techniques
  • Jitter-Aware Economic PDN Optimization With a Genetic Algorithm, 2021, IEEE Transactions on Microwave Theory and Techniques
  • Radio-Frequency Interference Estimation for Multiple Random Noise Sources, 2021, IEEE Transactions on Electromagnetic Compatibility
  • Efficient DC and AC Impedance Calculation for Arbitrary-Shape and Multilayer PDN Using Boundary Integration, 2022, IEEE Transactions on Signal and Power Integrity
  • Calibration Loop Antenna for Multiple Probe Antenna Measurement System, 2020, IEEE Transactions on Instrumentation and Measurement

Frequent collaborators in Jun Fan's work are:

  • Chulsoon Hwang
  • DongHyun Kim
  • Xin Cao
  • Qiang-Ming Cai
  • Bo Pu

Best Publications

  • Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

    Jun Fan;Xiaoning Ye;Jingook Kim;Bruce Archambeault

  • Coaxial cable bragg grating sensor

    Hai Xiao;Jun Fan;Tao Wei;Songping Wu

  • An Improved Dipole-Moment Model Based on Near-Field Scanning for Characterizing Near-Field Coupling and Far-Field Radiation From an IC

    Zhenwei Yu;J. A. Mix;S. Sajuyigbe;K. P. Slattery

  • Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

    R. Rimolo-Donadio;Xiaoxiong Gu;Y.H. Kwark;M.B. Ritter

  • Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

    Yaojiang Zhang;J. Fan;G. Selli;M. Cocchini

  • An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances

    Chen Wang;Jingkun Mao;G. Selli;Shaofeng Luan

  • Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

    Jun Fan;J.L. Drewniak;J.L. Knighten;N.W. Smith

  • An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application

    Ji Zhang;K. W. Kam;Jin Min;V. V. Khilkevich

  • 5G Over-the-Air Measurement Challenges: Overview

    Yihong Qi;Guang Yang;Lie Liu;Jun Fan

  • Radiated Two-Stage Method for LTE MIMO User Equipment Performance Evaluation

    Wei Yu;Yihong Qi;Kefeng Liu;Yangguang Xu

  • A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements

    Zhaowen Yan;Jianwei Wang;Wei Zhang;Yansheng Wang

  • Toward QoI and Energy-Efficiency in Internet-of-Things Sensory Environments

    Chi Harold Liu;Jun Fan;Joel W. Branch;Kin K. Leung

  • An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

    Yao-Jiang Zhang;Jun Fan

  • Coaxial cable Bragg grating

    Tao Wei;Songping Wu;Jie Huang;Hai Xiao

  • Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity

    Hanfeng Wang;Victor Khilkevich;Yao-Jiang Zhang;Jun Fan

  • Estimating the noise mitigation effect of local decoupling in printed circuit boards

    Jun Fan;Wei Cui;J.L. Drewniak;T.P. Van Doren

  • Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

    Jingook Kim;Liehui Ren;Jun Fan

  • A Miniature Ultrawideband Electric Field Probe Based on Coax-Thru-Hole via Array for Near-Field Measurement

    Zhaowen Yan;Jianwei Wang;Wei Zhang;Yansheng Wang

  • Radio-Frequency Interference Estimation Using Equivalent Dipole-Moment Models and Decomposition Method Based on Reciprocity

    Jingnan Pan;Hanfeng Wang;Xu Gao;Chulsoon Hwang

  • Energy-Efficient Relay Selection for Cooperative Relaying in Wireless Multimedia Networks

    Zhengguo Sheng;Jun Fan;Chi Harold Liu;Victor C. M. Leung

  • DC power-bus noise isolation with power-plane segmentation

    Wei Cui;Jun Fan;Yong Ren;Hao Shi

  • A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications

    Hao-Hsiang Chuang;Guang-Hua Li;Eakhwan Song;Hyun-Ho Park

  • Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters

    Francesco de Paulis;Yao-Jiang Zhang;Jun Fan

Frequent Co-Authors

James L. Drewniak
James L. Drewniak Missouri University of Science and Technology
Antonio Orlandi
Antonio Orlandi University of L'Aquila
David Pommerenke
David Pommerenke Graz University of Technology
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology
Hai Xiao
Hai Xiao Clemson University
Todd H. Hubing
Todd H. Hubing Clemson University
Xiaoxiong Gu
Xiaoxiong Gu IBM (United States)
Kin K. Leung
Kin K. Leung Imperial College London
Ming Yu
Ming Yu Chinese University of Hong Kong
Albert E. Ruehli
Albert E. Ruehli Missouri University of Science and Technology

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