World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
45
Citations
9022
World Ranking
3516
National Ranking
1300

Research.com Recognitions

  • 2007 - IEEE Fellow For contributions in electromagnetic interference coupling paths and numerical modeling for compatibility design

Overview

James L. Drewniak is affiliated with the Missouri University of Science and Technology in the United States. Their primary research domain lies within Engineering, with a focus on Electrical and Electronic Engineering. Drewniak's work also extends to related subfields such as Aerospace Engineering, Mechanical Engineering, Mechanics of Materials, and Astronomy and Astrophysics.

The scientist's research topics cover several key areas including:

  • Electromagnetic Compatibility and Noise Suppression
  • Electromagnetic Compatibility and Measurements
  • Electrostatic Discharge in Electronics
  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Microwave and Dielectric Measurement Techniques
  • Antenna Design and Analysis

James L. Drewniak has contributed to multiple publication venues. Frequent venues include:

  • IEEE Electromagnetic Compatibility Magazine
  • 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
  • 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
  • IEEE Transactions on Electromagnetic Compatibility
  • IEEE Internet of Things Journal

Some of the recent papers authored or co-authored by Drewniak are:

  • A 60 GHz PCB Wideband Antenna-in-Package for 5G/6G Applications, 2020, IEEE Antennas and Wireless Propagation Letters
  • Dielectric Loss Tangent Extraction Using Modal Measurements and 2-D Cross-Sectional Analysis for Multilayer PCBs, 2020, IEEE Transactions on Electromagnetic Compatibility
  • Calibration Loop Antenna for Multiple Probe Antenna Measurement System, 2020, IEEE Transactions on Instrumentation and Measurement
  • S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures, 2020, IEEE Transactions on Electromagnetic Compatibility
  • Rugged Linear Array for IoT Applications, 2020, IEEE Internet of Things Journal

The scientist has collaborated on multiple occasions with several frequent co-authors, including:

  • Yihong Qi
  • Jun Fan
  • Samuel Connor
  • Zibin Weng
  • Bhyrav Mutnury

James L. Drewniak was named an IEEE Fellow in 2007 for contributions in electromagnetic interference coupling paths and numerical modeling for compatibility design.

Best Publications

  • Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

    D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren

  • EMI from cavity modes of shielding enclosures-FDTD modeling and measurements

    Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff

  • Electromagnetic interference (EMI) of system-on-package (SOP)

    T. Sudo;H. Sasaki;N. Masuda;J.L. Drewniak

  • Power bus decoupling on multilayer printed circuit boards

    T.H. Hubing;J.L. Drewniak;T.P. Van Doren;D.M. Hockanson

  • Numerical modeling of electrostatic discharge generators

    Kai Wang;D. Pommerenke;R. Chundru;T. Van Doren

  • An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances

    Chen Wang;Jingkun Mao;G. Selli;Shaofeng Luan

  • Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs

    Jun Fan;J.L. Drewniak;J.L. Knighten;N.W. Smith

  • Power-bus decoupling with embedded capacitance in printed circuit board design

    Minjia Xu;T.H. Hubing;J. Chen;T.P. Van Doren

  • Modeling of Shielding Composite Materials and Structures for Microwave Frequencies

    Marina Koledintseva;James Drewniak;Richard DuBroff;Konstantin Rozanov

  • EMI from airflow aperture arrays in shielding enclosures-experiments, FDTD, and MoM modeling

    Min Li;J. Nuebel;J.L. Drewniak;R.E. DuBroff

  • EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

    Xiaoning Ye;D.A. Hockanson;Min Li;Yong Ren

  • Hand-Assembled Cable Bundle Modeling for Crosstalk and Common-Mode Radiation Prediction

    Shishuang Sun;Geping Liu;J.L. Drewniak;D.J. Pommerenke

  • A Three-Dimensional FDTD Subgridding Algorithm With Separated Temporal and Spatial Interfaces and Related Stability Analysis

    Kai Xiao;D.J. Pommerenke;J.L. Drewniak

  • An EMI estimate for shielding-enclosure evaluation

    Min Li;J.L. Drewniak;S. Radu;J. Nuebel

  • Comparison of FDTD algorithms for subcellular modeling of slots in shielding enclosures

    Kuang-Pin Ma;Min Li;J.L. Drewniak;T.H. Hubing

  • Susceptibility Scanning as a Failure Analysis Tool for System-Level Electrostatic Discharge (ESD) Problems

    G. Muchaidze;Jayong Koo;Qing Cai;Tun Li

  • Causal RLGC ( $f$ ) Models for Transmission Lines From Measured $S$ -Parameters

    Jianmin Zhang;J.L. Drewniak;D.J. Pommerenke;M.Y. Koledintseva

  • FDTD modeling of common-mode radiation from cables

    D.M. Hockanson;J.L. Drewniak;T.H. Hubing;T.P. Van Doren

  • Power bus decoupling on multilayer printed circuit boards

    Todd H. Hubing;James L. Drewniak;Thomas P. Van Doren;David M. Hockanson

  • Estimating the noise mitigation effect of local decoupling in printed circuit boards

    Jun Fan;Wei Cui;J.L. Drewniak;T.P. Van Doren

  • DC power-bus design using FDTD modeling with dispersive media and surface mount technology components

    Xiaoning Ye;M.Y. Koledintseva;Min Li;J.L. Drewniak

Frequent Co-Authors

Jun Fan
Jun Fan Missouri University of Science and Technology
Todd H. Hubing
Todd H. Hubing Clemson University
David Pommerenke
David Pommerenke Graz University of Technology
Antonio Orlandi
Antonio Orlandi University of L'Aquila
Albert E. Ruehli
Albert E. Ruehli Missouri University of Science and Technology
Joungho Kim
Joungho Kim Korea Advanced Institute of Science and Technology
David R. Jackson
David R. Jackson University of Houston
Weihua Zhuang
Weihua Zhuang University of Waterloo
Scott D. Sudhoff
Scott D. Sudhoff Purdue University West Lafayette
Rodolfo Araneo
Rodolfo Araneo Sapienza University of Rome

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