World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
48
Citations
8174
World Ranking
3104
National Ranking
1165

Andreas C. Cangellaris publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Andreas C. Cangellaris sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 386 publications — 73rd percentile

73% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Andreas C. Cangellaris D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Andreas C. Cangellaris sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 48 D-Index — 56th percentile

56% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2000 - IEEE Fellow For contributions to methodologies and algorithms for modeling and simulation of the electromagnetic behavior of high-speed interconnections and electronic packages.

Overview

Andreas C. Cangellaris is affiliated with the University of Illinois at Urbana-Champaign in the United States. Their primary field of study is Engineering, with a strong focus on Electrical and Electronic Engineering. The subfields of study include Statistics, Probability and Uncertainty, Control and Systems Engineering, Civil and Structural Engineering, and Mechanical Engineering.

Their research covers several main topics of work, which include:

  • Probabilistic and Robust Engineering Design
  • Electromagnetic Compatibility and Measurements
  • Electromagnetic Simulation and Numerical Methods
  • Control Systems and Identification
  • Structural Health Monitoring Techniques
  • Electromagnetic Compatibility and Noise Suppression
  • Advancements in PLL and VCO Technologies

Among the frequent publication venues for Andreas C. Cangellaris are:

  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • IEEE Transactions on Signal and Power Integrity
  • IEEE Access
  • 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
  • arXiv (Cornell University)

Their recent papers include the following:

  • "Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications," 2021, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "Support Vector Regression-Based Active Subspace (SVR-AS) Modeling of High-Speed Links for Fast and Accurate Sensitivity Analysis," 2020, IEEE Access
  • "Modular Neural Network-Based Models of High-Speed Link Transceivers," 2023, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "A Fast Optimization Method for High-Speed Link Inverse Design With SVR-AS Algorithm," 2022, IEEE Transactions on Signal and Power Integrity
  • "Uncertainty Quantification of Signal Integrity Analysis for Neuromorphic Chips," 2022, IEEE Transactions on Signal and Power Integrity

Frequent co-authors collaborating with Andreas C. Cangellaris include:

  • Hanzhi Ma
  • Er-Ping Li
  • José E. Schutt-Ainé
  • Xu Chen
  • Thong Nguyen

Andreas C. Cangellaris was named an IEEE Fellow in 2000 for contributions to methodologies and algorithms for modeling and simulation of the electromagnetic behavior of high-speed interconnections and electronic packages.

Best Publications

  • Time-domain finite-element methods

    Jin-Fa Lee;R. Lee;A. Cangellaris

  • Analysis of the numerical error caused by the stair-stepped approximation of a conducting boundary in FDTD simulations of electromagnetic phenomena

    A.C. Cangellaris;D.B. Wright

  • Multigrid Finite Element Methods for Electromagnetic Field Modeling

    Yu Zhu;Andreas C. Cangellaris

  • Progress in the methodologies for the electrical modeling of interconnects and electronic packages

    A.E. Ruehli;A.C. Cangellaris

  • GT-PML: generalized theory of perfectly matched layers and its application to the reflectionless truncation of finite-difference time-domain grids

    L. Zhao;A.C. Cangellaris

  • Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

    Er-Ping Li;Xing-Chang Wei;Andreas C Cangellaris;En-Xiao Liu

  • Point-matched time domain finite element methods for electromagnetic radiation and scattering

    A. Cangellaris;Chung-Chi Lin;Kenneth Mei

  • Numerical stability and numerical dispersion of a compact 2-D/FDTD method used for the dispersion analysis of waveguides

    A.C. Cangellaris

  • Enhanced skin effect for partial-element equivalent-circuit (PEEC) models

    K.M. Coperich;A.E. Ruehli;A. Cangellaris

  • Simulation of dispersive multiconductor transmission lines by Pade approximation via the Lanczos process

    M. Celik;A.C. Cangellaris

  • Effective permittivities for second-order accurate FDTD equations at dielectric interfaces

    Kyu-Pyung Hwang;A.C. Cangellaris

  • A general approach for the development of unsplit-field time-domain implementations of perfectly matched layers for FDTD grid truncation

    Li Zhao;A.C. Cangellaris

  • Accurate approximation of Green's functions in planar stratified media in terms of a finite sum of spherical and cylindrical waves

    V.N. Kourkoulos;A.C. Cangellaris

  • Electromagnetic model order reduction for system-level modeling

    A.C. Cangellaris;M. Celik;S. Pasha;Li Zhao

  • A study of discretization error in the finite element approximation of wave solutions

    R. Lee;A.C. Cangellaris

  • Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial-element equivalent-circuit formulation

    W. Pinello;A.C. Cangellaris;A. Ruehli

  • Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

    Yuh-Sheng Tsuei;A.C. Cangellaris;J.L. Prince

  • Nonlinear transport and heat dissipation in metallic carbon nanotubes

    Marcelo A. Kuroda;Andreas Cangellaris;Jean Pierre Leburton

  • Systematic development of transmission-line models for interconnects with frequency-dependent losses

    K.M. Coperich;J. Morsey;V.I. Okhmatovski;A.C. Cangellaris

  • Simulation of multiconductor transmission lines using Krylov subspace order-reduction techniques

    M. Celik;A.C. Cangellaris

  • Random-Space Dimensionality Reduction for Expedient Yield Estimation of Passive Microwave Structures

    Juan S. Ochoa;Andreas C. Cangellaris

Frequent Co-Authors

Peter Russer
Peter Russer Technical University of Munich
Albert E. Ruehli
Albert E. Ruehli Missouri University of Science and Technology
Narayana R Aluru
Narayana R Aluru University of Illinois at Urbana-Champaign
Linda P. B. Katehi
Linda P. B. Katehi Texas A&M University
Eric Michielssen
Eric Michielssen University of Michigan–Ann Arbor
Jian-Ming Jin
Jian-Ming Jin University of Illinois at Urbana-Champaign
Michael B. Steer
Michael B. Steer North Carolina State University
Elyse Rosenbaum
Elyse Rosenbaum University of Illinois at Urbana-Champaign
Paul D. Franzon
Paul D. Franzon North Carolina State University
Weng Cho Chew
Weng Cho Chew Purdue University West Lafayette

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