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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
34
Citations
8657
World Ranking
5688
National Ranking
1932

Research.com Recognitions

  • 2006 - IEEE Fellow For contributions to chip-package codesign.

Overview

Paul D. Franzon is affiliated with North Carolina State University in the United States. Their research spans several fields within computer science and engineering, with particular emphasis on electrical and electronic engineering, artificial intelligence, hardware and architecture, computational theory and mathematics, and computer vision and pattern recognition.

Their notable research topics include:

  • 3D IC and TSV technologies
  • Physical Unclonable Functions (PUFs) and Hardware Security
  • Advanced Multi-Objective Optimization Algorithms
  • VLSI and FPGA Design Techniques
  • Cryptographic Implementations and Security
  • Advanced Malware Detection Techniques
  • Radio Frequency Integrated Circuit Design

Paul D. Franzon has contributed to a variety of papers published in diverse venues. Some recent examples include:

  • "2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning," 2020, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • "Multi-Fidelity Surrogate-Based Optimization for Electromagnetic Simulation Acceleration," 2020, ACM Transactions on Design Automation of Electronic Systems
  • "Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "RD-FAXID: Ransomware Detection with FPGA-Accelerated XGBoost," 2024, ACM Transactions on Reconfigurable Technology and Systems
  • "Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning," 2022, IEEE Transactions on Very Large Scale Integration (VLSI) Systems

The researcher has frequently published in the following venues:

  • arXiv (Cornell University)
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • SSRN Electronic Journal
  • ACM Journal on Emerging Technologies in Computing Systems
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Paul D. Franzon often collaborates with several frequent co-authors, including:

  • Eren Kurshan
  • Priyank Kashyap
  • Joshua Schabel
  • Aydın Aysu
  • Luis Francisco

The main fields of study represented in their publications are Computer Science and Engineering, with a strong focus on Electrical and Electronic Engineering as a subfield.

Among their accolades, Paul D. Franzon was named IEEE Fellow in 2006 for contributions to chip-package codesign.

Best Publications

  • Demystifying 3D ICs: the pros and cons of going vertical

    W.R. Davis;J. Wilson;S. Mick;J. Xu

  • A review of 3-D packaging technology

    S.F. Al-Sarawi;D. Abbott;P.D. Franzon

  • FreePDK: An Open-Source Variation-Aware Design Kit

    J.E. Stine;I. Castellanos;M. Wood;J. Henson

  • Molecular electronics: from devices and interconnect to circuits and architecture

    M.R. Stan;P.D. Franzon;S.C. Goldstein;J.C. Lach

  • An electronically tunable microstrip bandpass filter using thin-film Barium-Strontium-Titanate (BST) varactors

    J. Nath;D. Ghosh;J.-P. Maria;A.I. Kingon

  • Multichip Module Technologies and Alternatives: The Basics

    Daryl Ann Doane;Paul D. Franzon

  • Nanocell logic gates for molecular computing

    J.M. Tour;W.L. Van Zandt;C.P. Husband;S.M. Husband

  • Overview of RFID Technology and Its Applications in the Food Industry

    P. Kumar;H.W. Reinitz;J. Simunovic;K.P. Sandeep

  • Controllable molecular modulation of conductivity in silicon-based devices.

    Tao He;David A. Corley;Meng Lu;Neil Halen Di Spigna

  • Design and CAD for 3D integrated circuits

    Paul D. Franzon;W. Rhett Davis;Michael B. Steer;Steve Lipa

  • NanoCell Electronic Memories

    James M. Tour;Long Cheng;David P. Nackashi;Yuxing Yao

  • Configurable string matching hardware for speeding up intrusion detection

    Monther Aldwairi;Thomas Conte;Paul Franzon

  • Demystifying Surrogate Modeling for Circuits and Systems

    M. B. Yelten;Ting Zhu;S. Koziel;P. D. Franzon

  • Energy consumption modeling and optimization for SRAM's

    R.J. Evans;P.D. Franzon

  • An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale.

    Amy Szuchmacher Blum;Carissa M. Soto;Charmaine D. Wilson;Tina L. Brower

  • A compact dielectric elastomer tubular actuator for refreshable Braille displays

    P. Chakraborti;H.A. Karahan Toprakci;P. Yang;N. Di Spigna

  • Controlled Modulation of Conductance in Silicon Devices by Molecular Monolayers

    Tao He;Jianli He;Meng Lu;Bo Chen

  • 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver

    Lei Luo;J.M. Wilson;S.E. Mick;Jian Xu

  • 4 Gbps high-density AC coupled interconnection

    S. Mick;J. Wilson;P. Franzon

  • Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC

    Menglin Tsai;Amy Klooz;Alexander Leonard;Jennie Appel

Frequent Co-Authors

Michael B. Steer
Michael B. Steer North Carolina State University
Jian Xu
Jian Xu Pennsylvania State University
Wentai Liu
Wentai Liu University of California, Los Angeles
Angus I. Kingon
Angus I. Kingon Brown University
James M. Tour
James M. Tour Rice University
Veena Misra
Veena Misra North Carolina State University
Mehmet Rasit Yuce
Mehmet Rasit Yuce Monash University
Behnam Pourdeyhimi
Behnam Pourdeyhimi North Carolina State University
Jon-Paul Maria
Jon-Paul Maria Pennsylvania State University
Samuel Graham
Samuel Graham Georgia Institute of Technology

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