What is he best known for?
The fields of study he is best known for:
- Electrical engineering
- Operating system
- Integrated circuit
His primary areas of investigation include Electronic engineering, Electrical engineering, Integrated circuit, Nanotechnology and Electronic circuit.
His Electronic engineering research is multidisciplinary, incorporating elements of Energy consumption, Fast Fourier transform and Interconnection.
His research on Electrical engineering frequently connects to adjacent areas such as System Architect.
The study incorporates disciplines such as Black box, Capacitive coupling, Transistor model, Real-time computing and CMOS in addition to Integrated circuit.
His Nanotechnology study combines topics from a wide range of disciplines, such as AND gate, Transistor and Modulation.
His work focuses on many connections between Electronic circuit and other disciplines, such as Through-silicon via, that overlap with his field of interest in Leakage.
His most cited work include:
- Demystifying 3D ICs: the pros and cons of going vertical (745 citations)
- A review of 3-D packaging technology (379 citations)
- Molecular electronics: from devices and interconnect to circuits and architecture (260 citations)
What are the main themes of his work throughout his whole career to date?
His scientific interests lie mostly in Electronic engineering, Electrical engineering, Interconnection, Embedded system and Integrated circuit.
His work deals with themes such as Optoelectronics, Electronic circuit and Chip, which intersect with Electronic engineering.
His work on Capacitive coupling, Capacitor and Integrated circuit packaging as part of his general Electrical engineering study is frequently connected to Low-power electronics, thereby bridging the divide between different branches of science.
As part of his studies on Interconnection, Paul D. Franzon often connects relevant areas like Soldering.
His research in Embedded system is mostly focused on System on a chip.
Integrated circuit is often connected to Integrated circuit design in his work.
He most often published in these fields:
- Electronic engineering (41.03%)
- Electrical engineering (20.65%)
- Interconnection (14.13%)
What were the highlights of his more recent work (between 2014-2020)?
- Electronic engineering (41.03%)
- Artificial intelligence (3.53%)
- Computer architecture (5.43%)
In recent papers he was focusing on the following fields of study:
His primary scientific interests are in Electronic engineering, Artificial intelligence, Computer architecture, Embedded system and Artificial neural network.
His Electronic engineering study incorporates themes from Transmitter, Interconnection, Chip and Domain knowledge.
His Interconnection research is multidisciplinary, relying on both Computing with Memory and Very-large-scale integration.
The Chip study combines topics in areas such as Optoelectronics, Electronic circuit and Raman spectroscopy.
Paul D. Franzon focuses mostly in the field of Artificial intelligence, narrowing it down to matters related to Machine learning and, in some cases, Hardware security module, Post-quantum cryptography, Integrated circuit design and Physical design.
His Embedded system research includes themes of Memory address, Memory map, Semiconductor memory, Computer memory and Multi-core processor.
Between 2014 and 2020, his most popular works were:
- Appliance Identification Algorithm for a Non-Intrusive Home Energy Monitor Using Cogent Confabulation (14 citations)
- Machine learning in physical design (12 citations)
- Verilog Styles for Synthesis of Digital Systems (9 citations)
In his most recent research, the most cited papers focused on:
- Electrical engineering
- Operating system
- Integrated circuit
Paul D. Franzon spends much of his time researching Electronic engineering, Multi-core processor, Microarchitecture, Embedded system and Interconnection.
His Electronic engineering research incorporates themes from Transistor, Chip and Benchmark.
His work in Chip tackles topics such as Electronic circuit which are related to areas like Thermal analysis, Material properties, Three-dimensional integrated circuit, Integrated circuit layout and CMOS.
His CMOS study introduces a deeper knowledge of Electrical engineering.
His Embedded system study integrates concerns from other disciplines, such as Dennard scaling, Decision support system, Computing with Memory and Thermal management of electronic devices and systems.
His biological study spans a wide range of topics, including Codec, Communication channel, Jitter and Printed circuit board.
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