World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
34
Citations
8657
World Ranking
5688
National Ranking
1933

Paul D. Franzon publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Paul D. Franzon sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 384 publications — 72nd percentile

72% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Paul D. Franzon D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Paul D. Franzon sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 34 D-Index — 18th percentile

18% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2006 - IEEE Fellow For contributions to chip-package codesign.

Overview

Paul D. Franzon is affiliated with North Carolina State University in the United States. Their research spans several fields within computer science and engineering, with particular emphasis on electrical and electronic engineering, artificial intelligence, hardware and architecture, computational theory and mathematics, and computer vision and pattern recognition.

Their notable research topics include:

  • 3D IC and TSV technologies
  • Physical Unclonable Functions (PUFs) and Hardware Security
  • Advanced Multi-Objective Optimization Algorithms
  • VLSI and FPGA Design Techniques
  • Cryptographic Implementations and Security
  • Advanced Malware Detection Techniques
  • Radio Frequency Integrated Circuit Design

Paul D. Franzon has contributed to a variety of papers published in diverse venues. Some recent examples include:

  • "2Deep: Enhancing Side-Channel Attacks on Lattice-Based Key-Exchange via 2-D Deep Learning," 2020, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • "Multi-Fidelity Surrogate-Based Optimization for Electromagnetic Simulation Acceleration," 2020, ACM Transactions on Design Automation of Electronic Systems
  • "Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation," 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • "RD-FAXID: Ransomware Detection with FPGA-Accelerated XGBoost," 2024, ACM Transactions on Reconfigurable Technology and Systems
  • "Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning," 2022, IEEE Transactions on Very Large Scale Integration (VLSI) Systems

The researcher has frequently published in the following venues:

  • arXiv (Cornell University)
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • SSRN Electronic Journal
  • ACM Journal on Emerging Technologies in Computing Systems
  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Paul D. Franzon often collaborates with several frequent co-authors, including:

  • Eren Kurshan
  • Priyank Kashyap
  • Joshua Schabel
  • Aydın Aysu
  • Luis Francisco

The main fields of study represented in their publications are Computer Science and Engineering, with a strong focus on Electrical and Electronic Engineering as a subfield.

Among their accolades, Paul D. Franzon was named IEEE Fellow in 2006 for contributions to chip-package codesign.

Best Publications

  • Demystifying 3D ICs: the pros and cons of going vertical

    W.R. Davis;J. Wilson;S. Mick;J. Xu

  • A review of 3-D packaging technology

    S.F. Al-Sarawi;D. Abbott;P.D. Franzon

  • FreePDK: An Open-Source Variation-Aware Design Kit

    J.E. Stine;I. Castellanos;M. Wood;J. Henson

  • Molecular electronics: from devices and interconnect to circuits and architecture

    M.R. Stan;P.D. Franzon;S.C. Goldstein;J.C. Lach

  • An electronically tunable microstrip bandpass filter using thin-film Barium-Strontium-Titanate (BST) varactors

    J. Nath;D. Ghosh;J.-P. Maria;A.I. Kingon

  • Multichip Module Technologies and Alternatives: The Basics

    Daryl Ann Doane;Paul D. Franzon

  • Nanocell logic gates for molecular computing

    J.M. Tour;W.L. Van Zandt;C.P. Husband;S.M. Husband

  • Overview of RFID Technology and Its Applications in the Food Industry

    P. Kumar;H.W. Reinitz;J. Simunovic;K.P. Sandeep

  • Controllable molecular modulation of conductivity in silicon-based devices.

    Tao He;David A. Corley;Meng Lu;Neil Halen Di Spigna

  • Design and CAD for 3D integrated circuits

    Paul D. Franzon;W. Rhett Davis;Michael B. Steer;Steve Lipa

  • NanoCell Electronic Memories

    James M. Tour;Long Cheng;David P. Nackashi;Yuxing Yao

  • Configurable string matching hardware for speeding up intrusion detection

    Monther Aldwairi;Thomas Conte;Paul Franzon

  • Demystifying Surrogate Modeling for Circuits and Systems

    M. B. Yelten;Ting Zhu;S. Koziel;P. D. Franzon

  • Energy consumption modeling and optimization for SRAM's

    R.J. Evans;P.D. Franzon

  • An engineered virus as a scaffold for three-dimensional self-assembly on the nanoscale.

    Amy Szuchmacher Blum;Carissa M. Soto;Charmaine D. Wilson;Tina L. Brower

  • A compact dielectric elastomer tubular actuator for refreshable Braille displays

    P. Chakraborti;H.A. Karahan Toprakci;P. Yang;N. Di Spigna

  • Controlled Modulation of Conductance in Silicon Devices by Molecular Monolayers

    Tao He;Jianli He;Meng Lu;Bo Chen

  • 3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver

    Lei Luo;J.M. Wilson;S.E. Mick;Jian Xu

  • 4 Gbps high-density AC coupled interconnection

    S. Mick;J. Wilson;P. Franzon

  • Through Silicon Via(TSV) defect/pinhole self test circuit for 3D-IC

    Menglin Tsai;Amy Klooz;Alexander Leonard;Jennie Appel

Frequent Co-Authors

Michael B. Steer
Michael B. Steer North Carolina State University
Jian Xu
Jian Xu Pennsylvania State University
Angus I. Kingon
Angus I. Kingon Brown University
Wentai Liu
Wentai Liu University of California, Los Angeles
James M. Tour
James M. Tour Rice University
Thomas M. Conte
Thomas M. Conte Georgia Institute of Technology
Veena Misra
Veena Misra North Carolina State University
Frederick A. Ware
Frederick A. Ware Rambus (United Kingdom)
Huiyang Zhou
Huiyang Zhou North Carolina State University
Mehmet Rasit Yuce
Mehmet Rasit Yuce Monash University

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