Eric Beyne is affiliated with Imec in Belgium and has contributed extensively to the field of engineering, with a particular focus on electrical and electronic engineering. Their research encompasses multiple subfields including biomedical engineering, mechanical engineering, atomic and molecular physics and optics, as well as electronic, optical, and magnetic materials.
The core topics of Eric Beyne's research involve advanced integration technologies and semiconductor innovations. These main topics include:
Eric Beyne has contributed to several scientific publications over recent years, with selected papers reflecting their focus on 3D integration and device technologies:
Frequent co-authors collaborating with Eric Beyne include:
Eric Beyne's work has been published often in multiple venues, which serve as key platforms for disseminating research in electronics packaging, device technologies, and integrated circuits. These frequent publication venues include:
G Van der Plas;P Limaye;I Loi;A Mercha
Harrie A C Tilmans;Walter De Raedt;Eric Beyne
Hendrikus A. C. Tilmans;Eric Beyne;Myriam Van de Peer
B. Swinnen;W. Ruythooren;P. De Moor;L. Bogaerts
Eric Beyne;Steve Lerner
Hendrikus Tilmans;Eric Beyne;Henri Jansen;Walter De Raedt
Eric Beyne
Eric Beyne;Augustin Coello-Vera;Olivier Vendier
P. Marchal;B. Bougard;G. Katti;M. Stucchi
J. Van Olmen;A. Mercha;G. Katti;C. Huyghebaert
Eric Beyne
Bart Vandevelde;Mario Gonzalez;Paresh Limaye;Petar Ratchev
E. Beyne
B. Vandevelde;M. Gonzalez;P. Limaye;P. Ratchev
I. De Wolf;K. Croes;O. Varela Pedreira;R. Labie
E.A Soliman;S Brebels;Peter Delmotte;Guy Vandenbosch
G. Carchon;K. Vaesen;S. Brebels;W. De Raedt
A. Mercha;G. Van der Plas;V. Moroz;I. De Wolf
Eric Beyne;Riet Labie
H.A.C. Tilmans;D.J. van de Peer;E. Beyne
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