H-Index & Metrics Best Publications
Mitsumasa Koyanagi

Mitsumasa Koyanagi

H-Index & Metrics

Discipline name H-index Citations Publications World Ranking National Ranking
Electronics and Electrical Engineering D-index 33 Citations 5,434 271 World Ranking 2800 National Ranking 115

Overview

What is he best known for?

The fields of study he is best known for:

  • Integrated circuit
  • Semiconductor
  • Electrical engineering

Optoelectronics, Wafer, Wafer bonding, Chip and Electrical engineering are his primary areas of study. His research in the fields of Integrated circuit overlaps with other disciplines such as Electric field. The various areas that Mitsumasa Koyanagi examines in his Wafer study include Stacking and Silicon.

His Silicon research is multidisciplinary, incorporating perspectives in Self-assembly and Composite material. His Chip research is multidisciplinary, incorporating elements of Image sensor, Electronic engineering, Interconnection and Daisy chain. His research in Electrical engineering tackles topics such as Process which are related to areas like Pixel and Focus.

His most cited work include:

  • Future system-on-silicon LSI chips (303 citations)
  • High-Density Through Silicon Vias for 3-D LSIs (249 citations)
  • Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections (207 citations)

What are the main themes of his work throughout his whole career to date?

His primary areas of study are Optoelectronics, Wafer, Chip, Electronic engineering and Nanotechnology. His work carried out in the field of Optoelectronics brings together such families of science as Transistor, MOSFET and Electrical engineering. His Wafer research includes elements of Composite material and Interposer.

He has researched Chip in several fields, including Computer hardware, Self-assembly, Stacking, CMOS and Interconnection. His research integrates issues of Image sensor and Annealing in his study of Electronic engineering. His work is connected to Nanodot and Layer, as a part of Nanotechnology.

He most often published in these fields:

  • Optoelectronics (47.75%)
  • Wafer (20.24%)
  • Chip (19.72%)

What were the highlights of his more recent work (between 2013-2020)?

  • Optoelectronics (47.75%)
  • Wafer (20.24%)
  • Chip (19.72%)

In recent papers he was focusing on the following fields of study:

Mitsumasa Koyanagi mainly investigates Optoelectronics, Wafer, Chip, Electronic engineering and Composite material. Mitsumasa Koyanagi studies Silicon, a branch of Optoelectronics. In general Wafer study, his work on Anodic bonding often relates to the realm of Surface tension, thereby connecting several areas of interest.

His studies deal with areas such as Dram, Planar and Key as well as Chip. His Electronic engineering research incorporates elements of Capacitance, Wafer bonding, Annealing and Memory retention. Mitsumasa Koyanagi interconnects Engineering drawing and Three-dimensional integrated circuit in the investigation of issues within Composite material.

Between 2013 and 2020, his most popular works were:

  • Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film (29 citations)
  • Recent progress in 3D integration technology (15 citations)
  • Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM (13 citations)

In his most recent research, the most cited papers focused on:

  • Integrated circuit
  • Semiconductor
  • Operating system

Mitsumasa Koyanagi mostly deals with Optoelectronics, Wafer, Chip, Electronic engineering and Nanotechnology. His Optoelectronics study combines topics in areas such as Layer, Adhesive, Plating, Self-assembly and Interposer. His work on Anodic bonding as part of his general Wafer study is frequently connected to Surface tension, thereby bridging the divide between different branches of science.

His study in Chip is interdisciplinary in nature, drawing from both Composite material and Stacking. The Electronic engineering study combines topics in areas such as Polyimide, Capacitance and Annealing. He works mostly in the field of Nanotechnology, limiting it down to topics relating to Nano- and, in certain cases, Wire bonding, as a part of the same area of interest.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Future system-on-silicon LSI chips

M. Koyanagi;H. Kurino;Kang Wook Lee;K. Sakuma.
IEEE Micro (1998)

424 Citations

High-Density Through Silicon Vias for 3-D LSIs

M. Koyanagi;T. Fukushima;T. Tanaka.
Proceedings of the IEEE (2009)

335 Citations

Three-dimensional shared memory fabricated using wafer stacking technology

K.W. Lee;T. Nakamura;T. Ono;Y. Yamada.
international electron devices meeting (2000)

280 Citations

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

M. Koyanagi;T. Nakamura;Y. Yamada;H. Kikuchi.
IEEE Transactions on Electron Devices (2006)

269 Citations

Handbook of 3D Integration

Philip Garrou;Mitsumasa Koyanagi;Peter Ramm.
(2008)

246 Citations

Method of manufacturing three-dimensional image processor

Mitsumasa Koyanagi;Nobuaki Miyagawa;Taisuke Okano;宣明 宮川.
(2000)

211 Citations

Hot-electron-induced punchthrough (HEIP) effect in submicrometer PMOSFET's

M. Koyanagi;A.G. Lewis;R.A. Martin;Tiao-Yuan Huang.
IEEE Transactions on Electron Devices (1987)

170 Citations

Neuromorphic vision chip fabricated using three-dimensional integration technology

M. Koyanagi;Y. Nakagawa;Kang-Wook Lee;T. Nakamura.
international solid-state circuits conference (2001)

166 Citations

Three-dimensional integration technology and integrated systems

Mitsumasa Koyanagi;Takafumi Fukushima;Tetsu Tanaka.
asia and south pacific design automation conference (2009)

159 Citations

Intelligent image sensor chip with three dimensional structure

H. Kurino;K.W. Lee;T. Nakamura;K. Sakuma.
international electron devices meeting (1999)

154 Citations

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