Mitsumasa Koyanagi is affiliated with Tohoku University in Japan, specializing in research within the field of engineering, with a focus on electrical and electronic engineering. Their work predominantly covers topics in 3D IC and TSV (through-silicon via) technologies, electronic packaging and soldering technologies, and the synthesis and properties of polymers.
Their recent publications include the following papers:
Frequent co-authors of Mitsumasa Koyanagi include:
Common venues where this research is published include:
Their research spans several specialized fields including electrical and electronic engineering, polymers and plastics, electronic, optical and magnetic materials, biomedical engineering, and atomic and molecular physics and optics.
Key topics addressed in their work are:
M. Koyanagi;H. Kurino;Kang Wook Lee;K. Sakuma
M. Koyanagi;T. Fukushima;T. Tanaka
K.W. Lee;T. Nakamura;T. Ono;Y. Yamada
M. Koyanagi;T. Nakamura;Y. Yamada;H. Kikuchi
Mitsumasa Koyanagi;Takafumi Fukushima;Tetsu Tanaka
M. Koyanagi;Y. Nakagawa;Kang-Wook Lee;T. Nakamura
M. Koyanagi;A.G. Lewis;R.A. Martin;Tiao-Yuan Huang
H. Kurino;K.W. Lee;T. Nakamura;K. Sakuma
T. Fukushima;Y. Yamada;H. Kikuchi;M. Koyanagi
Tiao-yuan Huang;W.W. Yao;R.A. Martin;A.G. Lewis
M. Takata;S. Kondoh;T. Sakaguchi;H. Choi
Takuji Matsumoto;Masakazu Satoh;Katsuyuki Sakuma;Hiroyuki Kurino
T. Fukushima;H. Kikuchi;Y. Yamada;T. Konno
Kang-Wook Lee;A Noriki;K Kiyoyama;T Fukushima
M. Koyanagi;H. Sunami;N. Hashimoto;M. Ashikawa
T. Fukushima;E. Iwata;T. Konno;J.-C. Bea
M. Murugesan;H. Kino;H. Nohira;J.C. Bea
Hirokazu Kikuchi;Yusuke Yamada;Atif Mossad Ali;Jun Liang
Takafumi Fukushima;Yusuke Yamada;Hirokazu Kikuchi;Mitsumasa Koyanagi
Kang Wook Lee;Tomonori Nakamura;Katsuyuki Sakuma;Ki Tae Park
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