World's Best Scientists 2026 revealed!
Mitsumasa Koyanagi

Mitsumasa Koyanagi

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
40
Citations
8214
World Ranking
4430
National Ranking
169

Mitsumasa Koyanagi publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Mitsumasa Koyanagi sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 619 publications — 91st percentile

91% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Mitsumasa Koyanagi D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Mitsumasa Koyanagi sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 40 D-Index — 36th percentile

36% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Mitsumasa Koyanagi is affiliated with Tohoku University in Japan, specializing in research within the field of engineering, with a focus on electrical and electronic engineering. Their work predominantly covers topics in 3D IC and TSV (through-silicon via) technologies, electronic packaging and soldering technologies, and the synthesis and properties of polymers.

Their recent publications include the following papers:

  • "Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems" (2022), published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • "Cu-SiO2 Hybrid Bonding Yield Enhancement Through Cu Grain Enlargement" (2022), published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • "On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2" (2020), published in Journal of Polymer Science
  • "High aspect ratio through-silicon-via formation by using low-cost electroless-Ni as barrier and seed layers for 3D-LSI integration and packaging applications" (2020), published in Japanese Journal of Applied Physics
  • "Cyclic reservoir neural network circuit for 3D IC implementation" (2021), published in Nonlinear Theory and Its Applications IEICE

Frequent co-authors of Mitsumasa Koyanagi include:

  • Takafumi Fukushima
  • M. Murugesan
  • Tomoaki Shibata
  • K. Mori
  • Hiroyuki Hashimoto

Common venues where this research is published include:

  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Journal of Polymer Science
  • Japanese Journal of Applied Physics
  • Nonlinear Theory and Its Applications IEICE
  • IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Their research spans several specialized fields including electrical and electronic engineering, polymers and plastics, electronic, optical and magnetic materials, biomedical engineering, and atomic and molecular physics and optics.

Key topics addressed in their work are:

  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Synthesis and properties of polymers
  • Copper Interconnects and Reliability
  • Nanofabrication and Lithography Techniques
  • Semiconductor materials and devices
  • Semiconductor materials and interfaces

Best Publications

  • Future system-on-silicon LSI chips

    M. Koyanagi;H. Kurino;Kang Wook Lee;K. Sakuma

  • High-Density Through Silicon Vias for 3-D LSIs

    M. Koyanagi;T. Fukushima;T. Tanaka

  • Three-dimensional shared memory fabricated using wafer stacking technology

    K.W. Lee;T. Nakamura;T. Ono;Y. Yamada

  • Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

    M. Koyanagi;T. Nakamura;Y. Yamada;H. Kikuchi

  • Three-dimensional integration technology and integrated systems

    Mitsumasa Koyanagi;Takafumi Fukushima;Tetsu Tanaka

  • Neuromorphic vision chip fabricated using three-dimensional integration technology

    M. Koyanagi;Y. Nakagawa;Kang-Wook Lee;T. Nakamura

  • Hot-electron-induced punchthrough (HEIP) effect in submicrometer PMOSFET's

    M. Koyanagi;A.G. Lewis;R.A. Martin;Tiao-Yuan Huang

  • Intelligent image sensor chip with three dimensional structure

    H. Kurino;K.W. Lee;T. Nakamura;K. Sakuma

  • New three-dimensional integration technology using self-assembly technique

    T. Fukushima;Y. Yamada;H. Kikuchi;M. Koyanagi

  • A novel submicron LDD transistor with inverse-T gate structure

    Tiao-yuan Huang;W.W. Yao;R.A. Martin;A.G. Lewis

  • New non-volatile memory with extremely high density metal nano-dots

    M. Takata;S. Kondoh;T. Sakaguchi;H. Choi

  • New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method.

    Takuji Matsumoto;Masakazu Satoh;Katsuyuki Sakuma;Hiroyuki Kurino

  • New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

    T. Fukushima;H. Kikuchi;Y. Yamada;T. Konno

  • Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems

    Kang-Wook Lee;A Noriki;K Kiyoyama;T Fukushima

  • Novel high density, stacked capacitor MOS RAM

    M. Koyanagi;H. Sunami;N. Hashimoto;M. Ashikawa

  • Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

    T. Fukushima;E. Iwata;T. Konno;J.-C. Bea

  • Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

    M. Murugesan;H. Kino;H. Nohira;J.C. Bea

  • Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs

    Hirokazu Kikuchi;Yusuke Yamada;Atif Mossad Ali;Jun Liang

  • New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration

    Takafumi Fukushima;Yusuke Yamada;Hirokazu Kikuchi;Mitsumasa Koyanagi

  • Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip.

    Kang Wook Lee;Tomonori Nakamura;Katsuyuki Sakuma;Ki Tae Park

Frequent Co-Authors

Tetsu Tanaka
Tetsu Tanaka Tohoku University
Hajime Mushiake
Hajime Mushiake Tohoku University
Masanobu Miyao
Masanobu Miyao Kyushu University
Makoto Tamai
Makoto Tamai Tohoku University
Kazuhiro Hane
Kazuhiro Hane Tohoku University
Ki-Tae Park
Ki-Tae Park Samsung (South Korea)
Seiichi Miyazaki
Seiichi Miyazaki Hiroshima University
Yutaka S. Sato
Yutaka S. Sato Tohoku University
Seiji Samukawa
Seiji Samukawa Tohoku University
Mikihiko Oogane
Mikihiko Oogane Tohoku University

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Related Online Degrees & Career Pathways

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