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D-Index & Metrics

Electronics and Electrical Engineering

D-Index
67
Citations
17400
World Ranking
1081
National Ranking
15

Overview

Göran Stemme is affiliated with the Royal Institute of Technology in Sweden and has produced a significant body of research primarily in engineering, with a focus on biomedical engineering, electrical and electronic engineering, and atomic and molecular physics and optics.

Their recent papers cover a range of topics in materials science and microengineering. Notable publications include:

  • Large-area integration of two-dimensional materials and their heterostructures by wafer bonding, 2021, Nature Communications
  • 3D Microvascularized Tissue Models by Laser-Based Cavitation Molding of Collagen, 2022, Advanced Materials
  • Three-dimensional printing of silica glass with sub-micrometer resolution, 2023, Nature Communications
  • Micro 3D printing of a functional MEMS accelerometer, 2022, Microsystems & Nanoengineering
  • Wafer-level hermetically sealed silicon photonic MEMS, 2021, Photonics Research

The scientist collaborates frequently with a group of researchers including Frank Niklaus, Niclas Roxhed, Kristinn B. Gylfason, Anna Herland, and Oliver Hartwig.

Göran Stemme's publications are often found in specific scientific venues focusing on microsystems, nanotechnology, and applied materials such as:

  • Microsystems & Nanoengineering
  • Journal of Microelectromechanical Systems
  • ACS Nano
  • ACS Applied Materials & Interfaces
  • Materials Today Bio

Within the realm of engineering, their research contributions extend deeply into several subfields including:

  • Biomedical Engineering
  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics
  • Molecular Biology
  • Materials Chemistry

The main scientific topics of interest in their work encompass:

  • 3D Printing in Biomedical Research
  • Nanofabrication and Lithography Techniques
  • Nonlinear Optical Materials Studies
  • Photonic and Optical Devices
  • Neuroscience and Neural Engineering
  • Microfluidic and Bio-sensing Technologies
  • Photonic Crystals and Applications

Best Publications

  • Adhesive wafer bonding

    Frank Niklaus;Göran Stemme;J. Q. Lu;R. J. Gutmann

  • Resonant silicon sensors

    G Stemme

  • A valve-less planar fluid pump with two pump chambers

    Anders Olsson;Göran Stemme;Erik Stemme

  • Integrating MEMS and ICs

    Andreas C. Fischer;Fredrik Forsberg;Martin Lapisa;Simon J. Bleiker

  • A Valve-Less Diffuser Micropump for Microfluidic Analytical Systems

    Helene Andersson;Wouter van der Wijngaart;Peter Nilsson;Peter Enoksson

  • A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips

    C. F. Carlborg;K. B. Gylfason;A. Kaźmierczak;F. Dortu

  • Micromachined flat-walled valveless diffuser pumps

    A. Olsson;P. Enoksson;G. Stemme;E. Stemme

  • Micromachined electrodes for biopotential measurements

    P. Griss;P. Enoksson;H.K. Tolvanen-Laakso;P. Merilainen

  • Characterization of micromachined spiked biopotential electrodes

    P. Griss;H.K. Tolvanen-Laakso;P. Merilainen;G. Stemme

  • Micromachined flow-through filter-chamber for chemical reactions on beads.

    Helene Andersson;Wouter van der Wijngaart;Peter Enoksson;Göran Stemme

  • Penetration-Enhanced Ultrasharp Microneedles and Prediction on Skin Interaction for Efficient Transdermal Drug Delivery

    N. Roxhed;T.C. Gasser;P. Griss;G.A. Holzapfel

  • Thermal characterization of surface-micromachined silicon nitride membranes for thermal infrared detectors

    P. Eriksson;J.Y. Andersson;G. Stemme

  • Diffuser-element design investigation for valve-less pumps

    Anders Olsson;Go¨ran Stemme;Erik Stemme

  • Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

    Arne Quellmalz;Xiaojing Wang;Simon Sawallich;Burkay Uzlu

  • A silicon resonant sensor structure for Coriolis mass-flow measurements

    P. Enoksson;G. Stemme;E. Stemme

  • Real-time intradermal continuous glucose monitoring using a minimally invasive microneedle-based system

    Federico Ribet;Göran Stemme;Niclas Roxhed

  • Method of joining components

    Edouard Kälvesten;Göran Stemme;Frank Niklaus

  • Deep wet etching of borosilicate glass using an anodically bonded silicon substrate as mask

    Thierry Corman;Peter Enoksson;Göran Stemme

  • Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS

    Martin Lapisa;Göran Stemme;Frank Niklaus

  • A robust micro conveyer realized by arrayed polyimide joint actuators

    Thorbjörn Ebefors;Johan Ulfstedt Mattsson;Edvard Kälvesten;Göran Stemme

  • A sub-micron particle filter in silicon

    Gjermund Kittilsland;Göran Stemme;Bengt Nordén

  • A valve-less planar pump isotropically etched in silicon

    Anders Olsson;Peter Enoksson;Göran Stemme;Erik Stemme

Frequent Co-Authors

Joachim Oberhammer
Joachim Oberhammer Royal Institute of Technology
Peter Enoksson
Peter Enoksson Chalmers University of Technology
Antti V. Räisänen
Antti V. Räisänen Aalto University
Ai Qun Liu
Ai Qun Liu Hong Kong Polytechnic University
Anthony J. Brookes
Anthony J. Brookes University of Leicester
Max C. Lemme
Max C. Lemme RWTH Aachen University
Georg S. Duesberg
Georg S. Duesberg Bundeswehr University Munich
Liwei Lin
Liwei Lin University of California, Berkeley
Herre S. J. van der Zant
Herre S. J. van der Zant Delft University of Technology
Eva Malmström
Eva Malmström Royal Institute of Technology

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