World's Best Scientists 2026 revealed!

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
39
Citations
5960
World Ranking
4719
National Ranking
84

Kuan-Neng Chen publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Kuan-Neng Chen sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 256 publications — 46th percentile

46% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Kuan-Neng Chen D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Kuan-Neng Chen sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 39 D-Index — 33rd percentile

33% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2020 - Fellow, National Academy of Inventors
  • 2018 - IEEE Fellow For contributions to 3D integrated circuit and packaging technologies

Overview

Kuan-Neng Chen is affiliated with National Yang Ming Chiao Tung University in Taiwan. Their research focuses primarily within the engineering discipline, with a strong specialization in electrical and electronic engineering.

The subfields of study covered by their work include:

  • Electrical and Electronic Engineering
  • Automotive Engineering
  • Electronic, Optical and Magnetic Materials
  • Biomedical Engineering
  • Polymers and Plastics

The main research topics include:

  • 3D IC and TSV technologies
  • Electronic Packaging and Soldering Technologies
  • Additive Manufacturing and 3D Printing Technologies
  • Semiconductor materials and devices
  • Copper Interconnects and Reliability
  • Thin-Film Transistor Technologies
  • Integrated Circuits and Semiconductor Failure Analysis

Chen has published extensively in several venues related to electronics and device packaging, including:

  • IEEE Electron Device Letters
  • IEEE Transactions on Components Packaging and Manufacturing Technology
  • Applied Surface Science
  • IEEE Journal of the Electron Devices Society
  • IEEE Transactions on Electron Devices

Significant recent papers authored or co-authored by Chen include:

  • Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC), 2021, Microelectronics Reliability
  • Investigation of bonding mechanism for low-temperature Cu Cu bonding with passivation layer, 2022, Applied Surface Science
  • Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration, 2020, IEEE Transactions on Components Packaging and Manufacturing Technology
  • Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation, 2021, IEEE Journal of the Electron Devices Society
  • Investigation of Low-Temperature Cu-Cu Direct Bonding With Pt Passivation Layer in 3-D Integration, 2021, IEEE Transactions on Components Packaging and Manufacturing Technology

Frequent co-authors collaborating with Chen have included:

  • Hanwen Hu
  • Zhong-Jie Hong
  • Po-Tsang Huang
  • Chih-Chao Yang
  • Yuan-Chiu Huang

Chen has received recognition within the professional community, having been awarded Fellow status by the National Academy of Inventors in 2020 and IEEE Fellow in 2018 for contributions to 3D integrated circuit and packaging technologies.

Best Publications

  • Wafer-level bonding/stacking technology for 3D integration

    Cheng Ta Ko;Kuan-Neng Chen

  • Wafer-level 3D integration technology

    S. J. Koester;A. M. Young;R. R. Yu;S. Purushothaman

  • Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

    Wen Wei Shen;Kuan-Neng Chen

  • Technology, performance, and computer-aided design of three-dimensional integrated circuits

    Shamik Das;Andy Fan;Kuan-Neng Chen;Chuan Seng Tan

  • Morphology and Bond Strength of Copper Wafer Bonding

    Kuan-Neng Chen;C. S. Tan;A. Fan;R. Reif

  • Low temperature bonding technology for 3D integration

    Cheng Ta Ko;Kuan-Neng Chen

  • Fabrication technologies for three-dimensional integrated circuits

    R. Reif;A. Fan;Kuan-Neng Chen;S. Das

  • Evidence for segregation of Te in Ge2Sb2Te5 films: Effect on the “phase-change” stress

    L. Krusin-Elbaum;C. Cabral;Kuan-Neng Chen;M. Copel

  • Wafer-level Cu-Cu bonding technology

    Ya Sheng Tang;Yao Jen Chang;Kuan-Neng Chen

  • A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

    F. Liu;R.R. Yu;A.M. Young;J.P. Doyle

  • Novel Cu-to-Cu Bonding With Ti Passivation at 180 $^{\circ}{ m C}$ in 3-D Integration

    Yan-Pin Huang;Yu-San Chien;Ruoh-Ning Tzeng;Ming-Shaw Shy

  • Irreversible modification of Ge2Sb2Te5 phase change material by nanometer-thin Ti adhesion layers in a device-compatible stack

    C. Cabral;Kuan-Neng Chen;L. Krusin-Elbaum;V. Deline

  • Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

    Asisa Kumar Panigrahy;Kuan-Neng Chen

  • Vertical interconnects of microbumps in 3D integration

    Chih Chen;Doug Yu;Kuan-Neng Chen

  • Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review

    Sang Hwui Lee;Kuan-Neng Chen;James Jian-Qiang Lu

  • Microstructure examination of copper wafer bonding

    Kuan-Neng Chen;Andy Fan;Rafael Reif

  • Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

    Han-Wen Hu;Kuan-Neng Chen

  • Bonding parameters of blanket copper wafer bonding

    Kuan-Neng Chen;A. Fan;C. S. Tan;R. Reif

  • Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology

    K.N. Chen;A. Fan;C.S. Tan;R. Reif

  • Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

    Kuan-Neng Chen;C. S. Tan;A. Fan;R. Reif

  • Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation

    Yan-Pin Huang;Yu-San Chien;Ruoh-Ning Tzeng;Kuan-Neng Chen

  • Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits

    Kuan-Neng Chen;Sang Hwui Lee;P.S. Andry;C.K. Tsang

  • Comparisons of conventional, 3-D, optical, and RF interconnects for on-chip clock distribution

    Kuan-Neng Chen;M.J. Kobrinsky;B.C. Barnett;R. Reif

Frequent Co-Authors

Chuan Seng Tan
Chuan Seng Tan Nanyang Technological University
Steven J. Koester
Steven J. Koester University of Minnesota
Cyril Cabral
Cyril Cabral IBM (United States)
King-Ning Tu
King-Ning Tu City University of Hong Kong
Ching-Te Chuang
Ching-Te Chuang National Yang Ming Chiao Tung University
Sampath Purushothaman
Sampath Purushothaman IBM (United States)
Chih Chen
Chih Chen National Yang Ming Chiao Tung University
Chenming Hu
Chenming Hu University of California, Berkeley
Wen-Wei Wu
Wen-Wei Wu National Yang Ming Chiao Tung University

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