Kuan-Neng Chen is affiliated with National Yang Ming Chiao Tung University in Taiwan. Their research focuses primarily within the engineering discipline, with a strong specialization in electrical and electronic engineering.
The subfields of study covered by their work include:
The main research topics include:
Chen has published extensively in several venues related to electronics and device packaging, including:
Significant recent papers authored or co-authored by Chen include:
Frequent co-authors collaborating with Chen have included:
Chen has received recognition within the professional community, having been awarded Fellow status by the National Academy of Inventors in 2020 and IEEE Fellow in 2018 for contributions to 3D integrated circuit and packaging technologies.
Cheng Ta Ko;Kuan-Neng Chen
S. J. Koester;A. M. Young;R. R. Yu;S. Purushothaman
Wen Wei Shen;Kuan-Neng Chen
Shamik Das;Andy Fan;Kuan-Neng Chen;Chuan Seng Tan
Kuan-Neng Chen;C. S. Tan;A. Fan;R. Reif
Cheng Ta Ko;Kuan-Neng Chen
R. Reif;A. Fan;Kuan-Neng Chen;S. Das
L. Krusin-Elbaum;C. Cabral;Kuan-Neng Chen;M. Copel
Ya Sheng Tang;Yao Jen Chang;Kuan-Neng Chen
F. Liu;R.R. Yu;A.M. Young;J.P. Doyle
Yan-Pin Huang;Yu-San Chien;Ruoh-Ning Tzeng;Ming-Shaw Shy
C. Cabral;Kuan-Neng Chen;L. Krusin-Elbaum;V. Deline
Asisa Kumar Panigrahy;Kuan-Neng Chen
Chih Chen;Doug Yu;Kuan-Neng Chen
Sang Hwui Lee;Kuan-Neng Chen;James Jian-Qiang Lu
Kuan-Neng Chen;Andy Fan;Rafael Reif
Han-Wen Hu;Kuan-Neng Chen
Kuan-Neng Chen;A. Fan;C. S. Tan;R. Reif
K.N. Chen;A. Fan;C.S. Tan;R. Reif
Kuan-Neng Chen;C. S. Tan;A. Fan;R. Reif
Yan-Pin Huang;Yu-San Chien;Ruoh-Ning Tzeng;Kuan-Neng Chen
Kuan-Neng Chen;Sang Hwui Lee;P.S. Andry;C.K. Tsang
Kuan-Neng Chen;M.J. Kobrinsky;B.C. Barnett;R. Reif
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