Tadatomo Suga

Overview

Best Publications

• DISPOSITIF A SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION

  Suga Tadatomo

  775
  Citations

• Surface activated bonding of silicon wafers at room temperature

  H. Takagi;K. Kikuchi;R. Maeda;T. R. Chung

  575
  Citations

• Room temperature Cu-Cu direct bonding using surface activated bonding method

  T. H. Kim;M. M. R. Howlader;T. Itoh;T. Suga

  353
  Citations

• Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

  T. Suga;Y. Takahashi;H. Takagi;B. Gibbesch

  298
  Citations

• Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation

  Hideki Takagi;Ryutaro Maeda;Teak Ryong Chung;Naoe Hosoda

  231
  Citations

• Self-excited piezoelectric PZT microcantilevers for dynamic SFM—with inherent sensing and actuating capabilities

  Chengkuo Lee;Toshihiro Itoh;Tadatomo Suga

  204
  Citations

• Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices.

  Zhe Cheng;Fengwen Mu;Fengwen Mu;Luke Yates;Tadatomo Suga

  203
  Citations

• Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

  Hideki Takagi;Ryutaro Maeda;Teak Ryong Chung;Tadatomo Suga

  169
  Citations

• Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films

  E. Higurashi;T. Imamura;T. Suga;R. Sawada

  164
  Citations

• Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method

  A. Shigetou;T. Itoh;M. Matsuo;N. Hayasaka

  163
  Citations

• Development of a force sensor for atomic force microscopy using piezoelectric thin films

  T Itoh;T Suga

  163
  Citations

• Composite Parameters and Mechanical Compatibility of Material Joints

  T. Suga;G. Elssner;S. Schmauder

  151
  Citations

• High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces.

  Fengwen Mu;Zhe Cheng;Jingjing Shi;Seongbin Shin

  142
  Citations

• Au–Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure

  E. Higurashi;D. Chino;T. Suga;R. Sawada

  139
  Citations

• Micromachined piezoelectric force sensors based on PZT thin films

  Chengkuo Lee;T. Itoh;T. Suga

  135
  Citations

• Room-temperature bonding of lithium niobate and silicon wafers by argon-beam surface activation

  Hideki Takagi;Ryutaro Maeda;Naoe Hosoda;Tadatomo Suga

  130
  Citations

• Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

  Taek Ryong Chung;Liu Yang;Naoe Hosoda;Hidegi Takagi

  123
  Citations

• Transmission Electron Microscope Observations of Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation

  Hideki Takagi;Ryutaro Maeda;Naoe hosoda;Tadatomo Suga

  123
  Citations

• Deflection detection and feedback actuation using a self‐excited piezoelectric Pb(Zr,Ti)O3 microcantilever for dynamic scanning force microscopy

  T. Itoh;C. Lee;T. Suga

  118
  Citations

• Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

  Fengwen Mu;Ran He;Tadatomo Suga

  112
  Citations

• Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature

  Hideki Takagi;Ryutaro Maeda;Tadatomo Suga

  111
  Citations

• Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activation

  Hideki Takagi;Ryutaro Maeda;Tadatomo Suga

  111
  Citations