What is he best known for?
The fields of study he is best known for:
- Composite material
- Electrical engineering
- Semiconductor
His primary areas of investigation include Optoelectronics, Anodic bonding, Surface activated bonding, Composite material and Wafer bonding.
The study incorporates disciplines such as Thin film, Nanotechnology, Wire bonding, Piezoelectricity and Cantilever in addition to Optoelectronics.
His Anodic bonding research incorporates themes from Reactive-ion etching, Thermocompression bonding and Direct bonding.
Tadatomo Suga combines subjects such as Amorphous solid, Crystallography, Chemical-mechanical planarization, Surface roughness and Electronic engineering with his study of Surface activated bonding.
His Composite material study incorporates themes from Mineralogy and Anisotropy.
The concepts of his Wafer bonding study are interwoven with issues in Fluidics, Annealing, p–n junction and Analytical chemistry.
His most cited work include:
- Surface activated bonding of silicon wafers at room temperature (325 citations)
- Method for manufacturing an interconnect structure for stacked semiconductor device (241 citations)
- Room temperature Cu–Cu direct bonding using surface activated bonding method (198 citations)
What are the main themes of his work throughout his whole career to date?
His main research concerns Composite material, Surface activated bonding, Optoelectronics, Anodic bonding and Wafer.
The study of Composite material is intertwined with the study of Metallurgy in a number of ways.
His research investigates the connection with Surface activated bonding and areas like Chemical engineering which intersect with concerns in Fullerene.
His studies examine the connections between Optoelectronics and genetics, as well as such issues in Piezoelectricity, with regards to Cantilever.
His Anodic bonding research includes themes of Bonding in solids, Wafer bonding, Thermocompression bonding and Direct bonding.
His Direct bonding study combines topics in areas such as Plasma activation and Formic acid.
He most often published in these fields:
- Composite material (32.76%)
- Surface activated bonding (30.30%)
- Optoelectronics (24.39%)
What were the highlights of his more recent work (between 2015-2021)?
- Surface activated bonding (30.30%)
- Composite material (32.76%)
- Wafer bonding (18.18%)
In recent papers he was focusing on the following fields of study:
Tadatomo Suga mainly focuses on Surface activated bonding, Composite material, Wafer bonding, Optoelectronics and Wafer.
Tadatomo Suga has included themes like Bond energy, Chemical engineering and Analytical chemistry in his Surface activated bonding study.
His research in Composite material intersects with topics in Silicon and Direct bonding.
As a member of one scientific family, Tadatomo Suga mostly works in the field of Wafer bonding, focusing on Annealing and, on occasion, Amorphous solid.
The various areas that Tadatomo Suga examines in his Optoelectronics study include Thin film, Thermal conductivity and Diamond.
He has researched Anodic bonding in several fields, including Bonding in solids, Substrate, Thermocompression bonding and Polymer.
Between 2015 and 2021, his most popular works were:
- Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications. (37 citations)
- Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices (28 citations)
- Room-temperature direct bonding of silicon and quartz glass wafers (21 citations)
In his most recent research, the most cited papers focused on:
- Composite material
- Electrical engineering
- Semiconductor
His primary scientific interests are in Surface activated bonding, Composite material, Anodic bonding, Optoelectronics and Wafer bonding.
His Surface activated bonding research integrates issues from Hydrogen, Thermal conductivity, Polishing, Ion beam and Chemical engineering.
His Composite material research is multidisciplinary, relying on both Metallurgy, Dielectric and Direct bonding.
His Anodic bonding study integrates concerns from other disciplines, such as Intermediate layer and Thermocompression bonding.
His studies in Optoelectronics integrate themes in fields like Thin film, Substrate, Diamond and Electronics.
The study incorporates disciplines such as Bond energy, Epitaxy, Annealing, Rapid thermal annealing and Nano- in addition to Wafer bonding.
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