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Materials Science

D-Index
54
Citations
9241
World Ranking
8989
National Ranking
104

Overview

Chih Chen is affiliated with National Yang Ming Chiao Tung University in Taiwan and has a research focus spanning engineering and materials science. Their work primarily covers subfields such as electrical and electronic engineering, electronic, optical and magnetic materials, mechanical engineering, materials chemistry, and mechanics of materials.

The scientist's research topics include:

  • Electronic packaging and soldering technologies
  • Copper interconnects and reliability
  • 3D IC and TSV technologies
  • Microstructure and mechanical properties
  • Aluminum alloys composites properties
  • Metal and thin film mechanics
  • Electrodeposition and electroless coatings

Chih Chen has published extensively, with a significant presence in several key journals related to materials science and engineering. Frequent publication venues include:

  • Journal of Materials Research and Technology
  • Materials
  • Materials Science and Engineering A
  • Materials Characterization
  • Applied Surface Science

Recent publications by Chih Chen demonstrate a range of studies in advanced materials and bonding technologies:

  • "Highly Selective Electrochemical Reduction of CO2 into Methane on Nanotwinned Cu", 2023, Journal of the American Chemical Society
  • "A kinetic model of copper-to-copper direct bonding under thermal compression", 2021, Journal of Materials Research and Technology
  • "Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints", 2020, Scripta Materialia
  • "Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces", 2022, Materials
  • "Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM", 2021, Acta Materialia

Collaborative work features a number of frequent co-authors, indicating ongoing partnerships within the research community. These include:

  • Dinh-Phuc Tran
  • K. N. Tu
  • Jia-Juen Ong
  • Kai-Cheng Shie
  • Wei-Lan Chiu

Best Publications

  • Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

    Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu

  • Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

    Chih Chen;H. M. Tong;King-Ning Tu

  • Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

    Chien Min Liu;Han Wen Lin;Yi Sa Huang;Yi Cheng Chu

  • Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

    C. Y. Liu;Chih Chen;C. N. Liao;King-Ning Tu

  • Electromigration in Sn-Pb solder strips as a function of alloy composition

    C. Y. Liu;C. Y. Liu;Chih Chen;King-Ning Tu

  • Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

    King-Ning Tu;Hsiang Yao Hsiao;Chih Chen

  • Whisker Growth induced by Ag photodoping in glassy GexSe1−x films

    C. H. Chen;K. L. Tai

  • Effect of current crowding on vacancy diffusion and void formation in electromigration

    King-Ning Tu;C. C. Yeh;C. Y. Liu;Chih Chen

  • Thermomigration in solder joints

    Chih Chen;Hsiang Yao Hsiao;Yuan Wei Chang;Fanyi Ouyang

  • Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

    Tao Chi Liu;Chien Min Liu;Hsiang Yao Hsiao;Jia Ling Lu

  • Eliminate Kirkendall voids in solder reactions on nanotwinned copper

    Tao Chi Liu;Chien Min Liu;Yi Sa Huang;Chih Chen

  • Electromigration issues in lead-free solder joints

    Chih Chen;S. W. Liang

  • Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

    Chien Min Liu;Han Wen Lin;Yi Cheng Chu;Chih Chen

  • Electromigration in eutectic SnPb solder lines

    Q. T. Huynh;C. Y. Liu;Chih Chen;Chih Chen;King-Ning Tu

  • Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

    S. H. Chiu;T. L. Shao;Chih Chen;D. J. Yao

  • Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads

    T. L. Shao;Y. H. Chen;S. H. Chiu;Chih Chen

  • Stress analysis of spontaneous Sn whisker growth

    King-Ning Tu;Chih Chen;Albert T. Wu

  • Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

    C. Y. Liu;Chih Chen;A. K. Mal;King-Ning Tu

  • Vertical interconnects of microbumps in 3D integration

    Chih Chen;Doug Yu;Kuan-Neng Chen

  • Tin whisker growth driven by electrical currents

    S. H. Liu;Chih Chen;P. C. Liu;T. Chou

  • Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

    Y. W. Chang;S. W. Liang;Chih Chen

Frequent Co-Authors

King-Ning Tu
King-Ning Tu City University of Hong Kong
Kuan-Neng Chen
Kuan-Neng Chen National Yang Ming Chiao Tung University
Wen-Wei Wu
Wen-Wei Wu National Yang Ming Chiao Tung University
Marco Di Michiel
Marco Di Michiel European Synchrotron Radiation Facility
Jinsong Huang
Jinsong Huang University of North Carolina at Chapel Hill
Ci-Ling Pan
Ci-Ling Pan National Tsing Hua University
Ting-Chang Chang
Ting-Chang Chang National Sun Yat-sen University
Albert Chin
Albert Chin National Yang Ming Chiao Tung University
Tien-Chang Lu
Tien-Chang Lu National Yang Ming Chiao Tung University
Ajit K. Mal
Ajit K. Mal University of California, Los Angeles

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