D-Index & Metrics Best Publications

D-Index & Metrics

Discipline name D-index D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines. Citations Publications World Ranking National Ranking
Materials Science D-index 41 Citations 6,129 242 World Ranking 8454 National Ranking 103

Overview

What is he best known for?

The fields of study he is best known for:

  • Composite material
  • Semiconductor
  • Electrical engineering

Soldering, Electromigration, Metallurgy, Composite material and Flip chip are his primary areas of study. His Soldering research includes themes of Microstructure, Microelectronics and Intermetallic. His Electromigration research includes elements of Whisker, Current crowding, Joule heating and Void.

His work on Eutectic system and Copper is typically connected to Temperature gradient as part of general Metallurgy study, connecting several disciplines of science. His Composite material research incorporates elements of Surface diffusion and Direct bonding. His Flip chip research incorporates themes from Thermoelectric effect and Infrared microscopy.

His most cited work include:

  • Recent progress of molecular organic electroluminescent materials and devices (1075 citations)
  • Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (208 citations)
  • Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper (200 citations)

What are the main themes of his work throughout his whole career to date?

Chih Chen mainly focuses on Soldering, Composite material, Electromigration, Metallurgy and Flip chip. Chih Chen focuses mostly in the field of Soldering, narrowing it down to topics relating to Intermetallic and, in certain cases, Diffusion. His biological study spans a wide range of topics, including Direct bonding, Annealing and Copper.

The concepts of his Electromigration study are interwoven with issues in Void, Cathode, Anode, Electrical resistivity and conductivity and Substrate. His work in the fields of Metallurgy, such as Reflow soldering, Tin and Nickel, intersects with other areas such as Temperature gradient. Chih Chen works mostly in the field of Flip chip, limiting it down to topics relating to Stress and, in certain cases, Optoelectronics, as a part of the same area of interest.

He most often published in these fields:

  • Soldering (47.85%)
  • Composite material (39.57%)
  • Electromigration (37.42%)

What were the highlights of his more recent work (between 2015-2021)?

  • Composite material (39.57%)
  • Copper (18.10%)
  • Soldering (47.85%)

In recent papers he was focusing on the following fields of study:

His primary areas of investigation include Composite material, Copper, Soldering, Microstructure and Annealing. His research integrates issues of Thermal stability and Direct bonding in his study of Composite material. His Copper research is multidisciplinary, relying on both Electroplating, Wafer, Electrical resistivity and conductivity and Engineering physics.

Chih Chen has researched Soldering in several fields, including Joint, Anisotropy and Intermetallic. His Intermetallic research entails a greater understanding of Metallurgy. His research in Electromigration tackles topics such as Void which are related to areas like Flip chip and Current crowding.

Between 2015 and 2021, his most popular works were:

  • Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration (38 citations)
  • Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling (24 citations)
  • A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps (20 citations)

In his most recent research, the most cited papers focused on:

  • Composite material
  • Semiconductor
  • Electrical engineering

His main research concerns Composite material, Intermetallic, Soldering, Annealing and Electromigration. His studies deal with areas such as Surface diffusion and Direct bonding as well as Composite material. His Intermetallic study is focused on Metallurgy in general.

Much of his study explores Soldering relationship to Grain boundary. His work in Annealing addresses subjects such as Copper, which are connected to disciplines such as Wafer-level packaging, Shrinkage, Engineering physics and Redistribution layer. Chih Chen works mostly in the field of Electromigration, limiting it down to concerns involving Void and, occasionally, Flip chip and Current crowding.

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

Chih Chen;H. M. Tong;King-Ning Tu.
Annual Review of Materials Research (2010)

271 Citations

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu.
Science (2012)

257 Citations

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu;Chih Chen;C. N. Liao;King-Ning Tu.
Applied Physics Letters (1999)

208 Citations

Whisker Growth induced by Ag photodoping in glassy GexSe1−x films

C. H. Chen;K. L. Tai.
Applied Physics Letters (1980)

195 Citations

Electromigration in Sn-Pb solder strips as a function of alloy composition

C. Y. Liu;C. Y. Liu;Chih Chen;King-Ning Tu.
Journal of Applied Physics (2000)

194 Citations

Effect of current crowding on vacancy diffusion and void formation in electromigration

King-Ning Tu;C. C. Yeh;C. Y. Liu;Chih Chen.
Applied Physics Letters (2000)

174 Citations

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

King-Ning Tu;Hsiang Yao Hsiao;Chih Chen.
Microelectronics Reliability (2013)

144 Citations

Electromigration issues in lead-free solder joints

Chih Chen;S. W. Liang.
Journal of Materials Science: Materials in Electronics (2006)

125 Citations

Electromigration in eutectic SnPb solder lines

Q. T. Huynh;C. Y. Liu;Chih Chen;Chih Chen;King-Ning Tu.
Journal of Applied Physics (2001)

121 Citations

Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

S. H. Chiu;T. L. Shao;Chih Chen;D. J. Yao.
Applied Physics Letters (2006)

118 Citations

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