Soldering, Electromigration, Metallurgy, Composite material and Flip chip are his primary areas of study. His Soldering research includes themes of Microstructure, Microelectronics and Intermetallic. His Electromigration research includes elements of Whisker, Current crowding, Joule heating and Void.
His work on Eutectic system and Copper is typically connected to Temperature gradient as part of general Metallurgy study, connecting several disciplines of science. His Composite material research incorporates elements of Surface diffusion and Direct bonding. His Flip chip research incorporates themes from Thermoelectric effect and Infrared microscopy.
Chih Chen mainly focuses on Soldering, Composite material, Electromigration, Metallurgy and Flip chip. Chih Chen focuses mostly in the field of Soldering, narrowing it down to topics relating to Intermetallic and, in certain cases, Diffusion. His biological study spans a wide range of topics, including Direct bonding, Annealing and Copper.
The concepts of his Electromigration study are interwoven with issues in Void, Cathode, Anode, Electrical resistivity and conductivity and Substrate. His work in the fields of Metallurgy, such as Reflow soldering, Tin and Nickel, intersects with other areas such as Temperature gradient. Chih Chen works mostly in the field of Flip chip, limiting it down to topics relating to Stress and, in certain cases, Optoelectronics, as a part of the same area of interest.
His primary areas of investigation include Composite material, Copper, Soldering, Microstructure and Annealing. His research integrates issues of Thermal stability and Direct bonding in his study of Composite material. His Copper research is multidisciplinary, relying on both Electroplating, Wafer, Electrical resistivity and conductivity and Engineering physics.
Chih Chen has researched Soldering in several fields, including Joint, Anisotropy and Intermetallic. His Intermetallic research entails a greater understanding of Metallurgy. His research in Electromigration tackles topics such as Void which are related to areas like Flip chip and Current crowding.
His main research concerns Composite material, Intermetallic, Soldering, Annealing and Electromigration. His studies deal with areas such as Surface diffusion and Direct bonding as well as Composite material. His Intermetallic study is focused on Metallurgy in general.
Much of his study explores Soldering relationship to Grain boundary. His work in Annealing addresses subjects such as Copper, which are connected to disciplines such as Wafer-level packaging, Shrinkage, Engineering physics and Redistribution layer. Chih Chen works mostly in the field of Electromigration, limiting it down to concerns involving Void and, occasionally, Flip chip and Current crowding.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
Chih Chen;H. M. Tong;King-Ning Tu.
Annual Review of Materials Research (2010)
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu.
Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
C. Y. Liu;Chih Chen;C. N. Liao;King-Ning Tu.
Applied Physics Letters (1999)
Whisker Growth induced by Ag photodoping in glassy GexSe1−x films
C. H. Chen;K. L. Tai.
Applied Physics Letters (1980)
Electromigration in Sn-Pb solder strips as a function of alloy composition
C. Y. Liu;C. Y. Liu;Chih Chen;King-Ning Tu.
Journal of Applied Physics (2000)
Effect of current crowding on vacancy diffusion and void formation in electromigration
King-Ning Tu;C. C. Yeh;C. Y. Liu;Chih Chen.
Applied Physics Letters (2000)
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
King-Ning Tu;Hsiang Yao Hsiao;Chih Chen.
Microelectronics Reliability (2013)
Electromigration issues in lead-free solder joints
Chih Chen;S. W. Liang.
Journal of Materials Science: Materials in Electronics (2006)
Electromigration in eutectic SnPb solder lines
Q. T. Huynh;C. Y. Liu;Chih Chen;Chih Chen;King-Ning Tu.
Journal of Applied Physics (2001)
Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
S. H. Chiu;T. L. Shao;Chih Chen;D. J. Yao.
Applied Physics Letters (2006)
If you think any of the details on this page are incorrect, let us know.
We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below: