World's Best Scientists 2026 revealed!

D-Index & Metrics

Materials Science

D-Index
54
Citations
9241
World Ranking
8987
National Ranking
105

Chih Chen publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Chih Chen sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 351 publications — 70th percentile

70% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

Chih Chen D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Chih Chen sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 54 D-Index — 32nd percentile

32% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

Chih Chen is affiliated with National Yang Ming Chiao Tung University in Taiwan and has a research focus spanning engineering and materials science. Their work primarily covers subfields such as electrical and electronic engineering, electronic, optical and magnetic materials, mechanical engineering, materials chemistry, and mechanics of materials.

The scientist's research topics include:

  • Electronic packaging and soldering technologies
  • Copper interconnects and reliability
  • 3D IC and TSV technologies
  • Microstructure and mechanical properties
  • Aluminum alloys composites properties
  • Metal and thin film mechanics
  • Electrodeposition and electroless coatings

Chih Chen has published extensively, with a significant presence in several key journals related to materials science and engineering. Frequent publication venues include:

  • Journal of Materials Research and Technology
  • Materials
  • Materials Science and Engineering A
  • Materials Characterization
  • Applied Surface Science

Recent publications by Chih Chen demonstrate a range of studies in advanced materials and bonding technologies:

  • "Highly Selective Electrochemical Reduction of CO2 into Methane on Nanotwinned Cu", 2023, Journal of the American Chemical Society
  • "A kinetic model of copper-to-copper direct bonding under thermal compression", 2021, Journal of Materials Research and Technology
  • "Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints", 2020, Scripta Materialia
  • "Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces", 2022, Materials
  • "Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM", 2021, Acta Materialia

Collaborative work features a number of frequent co-authors, indicating ongoing partnerships within the research community. These include:

  • Dinh-Phuc Tran
  • K. N. Tu
  • Jia-Juen Ong
  • Kai-Cheng Shie
  • Wei-Lan Chiu

Best Publications

  • Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

    Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu

  • Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

    Chih Chen;H. M. Tong;King-Ning Tu

  • Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

    Chien Min Liu;Han Wen Lin;Yi Sa Huang;Yi Cheng Chu

  • Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

    C. Y. Liu;Chih Chen;C. N. Liao;King-Ning Tu

  • Electromigration in Sn-Pb solder strips as a function of alloy composition

    C. Y. Liu;C. Y. Liu;Chih Chen;King-Ning Tu

  • Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

    King-Ning Tu;Hsiang Yao Hsiao;Chih Chen

  • Whisker Growth induced by Ag photodoping in glassy GexSe1−x films

    C. H. Chen;K. L. Tai

  • Effect of current crowding on vacancy diffusion and void formation in electromigration

    King-Ning Tu;C. C. Yeh;C. Y. Liu;Chih Chen

  • Thermomigration in solder joints

    Chih Chen;Hsiang Yao Hsiao;Yuan Wei Chang;Fanyi Ouyang

  • Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

    Tao Chi Liu;Chien Min Liu;Hsiang Yao Hsiao;Jia Ling Lu

  • Eliminate Kirkendall voids in solder reactions on nanotwinned copper

    Tao Chi Liu;Chien Min Liu;Yi Sa Huang;Chih Chen

  • Electromigration issues in lead-free solder joints

    Chih Chen;S. W. Liang

  • Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

    Chien Min Liu;Han Wen Lin;Yi Cheng Chu;Chih Chen

  • Electromigration in eutectic SnPb solder lines

    Q. T. Huynh;C. Y. Liu;Chih Chen;Chih Chen;King-Ning Tu

  • Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration

    S. H. Chiu;T. L. Shao;Chih Chen;D. J. Yao

  • Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads

    T. L. Shao;Y. H. Chen;S. H. Chiu;Chih Chen

  • Stress analysis of spontaneous Sn whisker growth

    King-Ning Tu;Chih Chen;Albert T. Wu

  • Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

    C. Y. Liu;Chih Chen;A. K. Mal;King-Ning Tu

  • Vertical interconnects of microbumps in 3D integration

    Chih Chen;Doug Yu;Kuan-Neng Chen

  • Tin whisker growth driven by electrical currents

    S. H. Liu;Chih Chen;P. C. Liu;T. Chou

  • Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

    Y. W. Chang;S. W. Liang;Chih Chen

Frequent Co-Authors

King-Ning Tu
King-Ning Tu City University of Hong Kong
Kuan-Neng Chen
Kuan-Neng Chen National Yang Ming Chiao Tung University
Wen-Wei Wu
Wen-Wei Wu National Yang Ming Chiao Tung University
Marco Di Michiel
Marco Di Michiel European Synchrotron Radiation Facility
Jinsong Huang
Jinsong Huang University of North Carolina at Chapel Hill
Ci-Ling Pan
Ci-Ling Pan National Tsing Hua University
Ting-Chang Chang
Ting-Chang Chang National Sun Yat-sen University
Albert Chin
Albert Chin National Yang Ming Chiao Tung University
Tien-Chang Lu
Tien-Chang Lu National Yang Ming Chiao Tung University
Ajit K. Mal
Ajit K. Mal University of California, Los Angeles

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