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D-Index & Metrics

Materials Science

D-Index
119
Citations
50674
World Ranking
503
National Ranking
149

King-Ning Tu publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where King-Ning Tu sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 781 publications — 97th percentile

97% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

King-Ning Tu D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where King-Ning Tu sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 119 D-Index — 96th percentile

96% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Research.com Recognitions

  • 2010 - Fellow of the Materials Research Society

Overview

King-Ning Tu is affiliated with the City University of Hong Kong in China. Their research primarily spans the fields of engineering and materials science, with notable contributions in various subfields including electrical and electronic engineering, mechanical engineering, electronic, optical and magnetic materials, materials chemistry, and mechanics of materials.

The scientist's work focuses extensively on topics related to electronic packaging and soldering technologies, 3D IC and Through-Silicon Via (TSV) technologies, copper interconnects and reliability, aluminum alloys composites properties, metal and thin film mechanics, microstructure and mechanical properties, as well as intermetallics and advanced alloy properties.

King-Ning Tu has published frequently in several academic venues, with the highest number of papers appearing in the Journal of Materials Research and Technology. Other common publication venues include Materials Characterization, Materials, Scientific Reports, and Materials Letters.

Recent significant publications include the following:

  • Low melting point solders based on Sn, Bi, and In elements, 2020, Materials Today Advances
  • A kinetic model of copper-to-copper direct bonding under thermal compression, 2021, Journal of Materials Research and Technology
  • A high-entropy alloy as very low melting point solder for advanced electronic packaging, 2020, Materials Today Advances
  • Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints, 2020, Scripta Materialia
  • Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces, 2022, Materials

Frequent collaborators with King-Ning Tu include Chih Chen, Yingxia Liu, Andriy Gusak, Xiuchen Zhao, and Dinh-Phuc Tran.

King-Ning Tu was recognized as a Fellow of the Materials Research Society in 2010.

Best Publications

  • Thin Films—Interdiffusion and Reactions

    J. M. Poate;K. N. Tu;J. W. Mayor;Archibald L. Fripp

  • Six cases of reliability study of Pb-free solder joints in electronic packaging technology

    K. Zeng;King-Ning Tu

  • Recent advances on electromigration in very-large-scale-integration of interconnects

    King-Ning Tu

  • Electronic thin film science : for electrical engineers and materials scientists

    K. N. Tu;James W. Mayer;Leonard C. Feldman

  • Stress evolution due to electromigration in confined metal lines

    M. A. Korhonen;P. Borgesen;King-Ning Tu;Che Yu Li

  • Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’

    U. Gösele;King-Ning Tu

  • Tin–lead (SnPb) solder reaction in flip chip technology

    King-Ning Tu;K. Zeng

  • Reliability challenges in 3D IC packaging technology

    King-Ning Tu

  • Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.

    H. Kim;King-Ning Tu

  • Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films

    King-Ning Tu

  • Kinetics of interfacial reaction in bimetallic CuSn thin films

    King-Ning Tu;R. D. Thompson

  • Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

    Kejun Zeng;Roger Stierman;Tz Cheng Chiu;Darvin Edwards

  • Current-crowding-induced electromigration failure in flip chip solder joints

    Everett C.C. Yeh;W. J. Choi;King-Ning Tu;Peter Elenius

  • Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions.

    King-Ning Tu

  • Low Schottky barrier of rare‐earth silicide on n‐Si

    King-Ning Tu;R. D. Thompson;B. Y. Tsaur

  • Physics and materials challenges for lead-free solders

    King-Ning Tu;A. M. Gusak;M. Li

  • Observation of atomic diffusion at twin-modified grain boundaries in copper

    Kuan Chia Chen;Wen-Wei Wu;Chien Neng Liao;Lih Juann Chen

  • Structure and properties of lead-free solders bearing micro and nano particles

    Liang Zhang;King-Ning Tu

  • Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology

    J. W. Jang;P. G. Kim;King-Ning Tu;D. R. Frear

  • Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

    Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu

  • Nanoscale Joule Heating and Electromigration Enhanced Ripening of Silver Nanowire Contacts

    Tze Bin Song;Yu Chen;Choong Heui Chung;Choong Heui Chung;Yang Yang

Frequent Co-Authors

Chih Chen
Chih Chen National Yang Ming Chiao Tung University
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory
Subodh G. Mhaisalkar
Subodh G. Mhaisalkar Nanyang Technological University
James W. Mayer
James W. Mayer Arizona State University
Wen-Wei Wu
Wen-Wei Wu National Yang Ming Chiao Tung University
Weijia Wen
Weijia Wen Hong Kong University of Science and Technology
Shadi A. Dayeh
Shadi A. Dayeh University of California, San Diego
Y.C. Chan
Y.C. Chan City University of Hong Kong
David Smith
David Smith University of Oxford

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