2026 King-Ning Tu: Materials Science Researcher – H-Index, Publications & Awards

Discipline name	D-Index	World Ranking	National Ranking	Publications	Citations
Materials Science	119	503	148	781	50674

Discipline name

D-Index

World Ranking

National Ranking

Publications

Citations

Materials Science

119

503

148

781

50674

Research.com Recognitions

2010 - Fellow of the Materials Research Society

Overview

King-Ning Tu is affiliated with the City University of Hong Kong in China. Their research primarily spans the fields of engineering and materials science, with notable contributions in various subfields including electrical and electronic engineering, mechanical engineering, electronic, optical and magnetic materials, materials chemistry, and mechanics of materials.

The scientist's work focuses extensively on topics related to electronic packaging and soldering technologies, 3D IC and Through-Silicon Via (TSV) technologies, copper interconnects and reliability, aluminum alloys composites properties, metal and thin film mechanics, microstructure and mechanical properties, as well as intermetallics and advanced alloy properties.

King-Ning Tu has published frequently in several academic venues, with the highest number of papers appearing in the Journal of Materials Research and Technology. Other common publication venues include Materials Characterization, Materials, Scientific Reports, and Materials Letters.

Recent significant publications include the following:

Low melting point solders based on Sn, Bi, and In elements, 2020, Materials Today Advances
A kinetic model of copper-to-copper direct bonding under thermal compression, 2021, Journal of Materials Research and Technology
A high-entropy alloy as very low melting point solder for advanced electronic packaging, 2020, Materials Today Advances
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints, 2020, Scripta Materialia
Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces, 2022, Materials

Frequent collaborators with King-Ning Tu include Chih Chen, Yingxia Liu, Andriy Gusak, Xiuchen Zhao, and Dinh-Phuc Tran.

King-Ning Tu was recognized as a Fellow of the Materials Research Society in 2010.

Best Publications

Thin Films—Interdiffusion and Reactions

J. M. Poate;K. N. Tu;J. W. Mayor;Archibald L. Fripp

1750
Citations
Six cases of reliability study of Pb-free solder joints in electronic packaging technology

K. Zeng;King-Ning Tu

1735
Citations
Recent advances on electromigration in very-large-scale-integration of interconnects

King-Ning Tu

1416
Citations
Electronic thin film science : for electrical engineers and materials scientists

K. N. Tu;James W. Mayer;Leonard C. Feldman

997
Citations
Stress evolution due to electromigration in confined metal lines

M. A. Korhonen;P. Borgesen;King-Ning Tu;Che Yu Li

924
Citations
Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’

U. Gösele;King-Ning Tu

803
Citations
Tin–lead (SnPb) solder reaction in flip chip technology

King-Ning Tu;K. Zeng

797
Citations
Reliability challenges in 3D IC packaging technology

King-Ning Tu

793
Citations
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.

H. Kim;King-Ning Tu

693
Citations
Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films

King-Ning Tu

687
Citations
Kinetics of interfacial reaction in bimetallic CuSn thin films

King-Ning Tu;R. D. Thompson

651
Citations
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng;Roger Stierman;Tz Cheng Chiu;Darvin Edwards

610
Citations
Current-crowding-induced electromigration failure in flip chip solder joints

Everett C.C. Yeh;W. J. Choi;King-Ning Tu;Peter Elenius

506
Citations
Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions.

King-Ning Tu

502
Citations
Low Schottky barrier of rare‐earth silicide on n‐Si

King-Ning Tu;R. D. Thompson;B. Y. Tsaur

492
Citations
Physics and materials challenges for lead-free solders

King-Ning Tu;A. M. Gusak;M. Li

470
Citations
Observation of atomic diffusion at twin-modified grain boundaries in copper

Kuan Chia Chen;Wen-Wei Wu;Chien Neng Liao;Lih Juann Chen

439
Citations
Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang;King-Ning Tu

408
Citations
Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology

J. W. Jang;P. G. Kim;King-Ning Tu;D. R. Frear

403
Citations
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang Yao Hsiao;Chien Min Liu;Han Wen Lin;Tao Chi Liu

398
Citations
Nanoscale Joule Heating and Electromigration Enhanced Ripening of Silver Nanowire Contacts

Tze Bin Song;Yu Chen;Choong Heui Chung;Choong Heui Chung;Yang Yang

386
Citations