2010 - Fellow of the Materials Research Society
King-Ning Tu mostly deals with Soldering, Metallurgy, Thin film, Electromigration and Eutectic system. His Soldering study is concerned with the larger field of Composite material. His Metallurgy study integrates concerns from other disciplines, such as Electronic packaging and Dissolution.
His Thin film study combines topics from a wide range of disciplines, such as Bimetallic strip, Annealing, Mineralogy, Analytical chemistry and Kinetics. His work carried out in the field of Electromigration brings together such families of science as Void, Joule heating, Cathode, Current crowding and Interconnection. His Eutectic system course of study focuses on Wetting and Morphology.
His primary scientific interests are in Metallurgy, Soldering, Composite material, Electromigration and Thin film. His work in Soldering addresses issues such as Intermetallic, which are connected to fields such as Diffusion. King-Ning Tu combines subjects such as Void, Joule heating, Cathode, Current crowding and Anode with his study of Electromigration.
The concepts of his Thin film study are interwoven with issues in Crystallography, Annealing and Analytical chemistry. His Crystallography research includes elements of Silicide, Condensed matter physics, Diffraction and Nucleation. He interconnects X-ray crystallography, Atmospheric temperature range and Electrical resistivity and conductivity in the investigation of issues within Analytical chemistry.
His primary areas of study are Composite material, Soldering, Metallurgy, Electromigration and Microstructure. His Composite material research incorporates elements of Surface diffusion, Direct bonding, Annealing and Copper. His studies deal with areas such as Grain boundary, Microelectronics, Intermetallic, Three-dimensional integrated circuit and Joint as well as Soldering.
His Metallurgy research includes themes of Thermal diffusivity and Fracture. King-Ning Tu has included themes like Void, Joule heating, Current crowding, Entropy production and Stress migration in his Electromigration study. His Microstructure study also includes fields such as
Soldering, Composite material, Metallurgy, Microstructure and Electromigration are his primary areas of study. His study in Soldering is interdisciplinary in nature, drawing from both Three-dimensional integrated circuit, Eutectic system, Microelectronics and Intermetallic. His work on Grain growth as part of general Composite material research is frequently linked to Temperature gradient, thereby connecting diverse disciplines of science.
His work on Metallurgy is being expanded to include thematically relevant topics such as Fracture. The various areas that King-Ning Tu examines in his Microstructure study include Relaxation, Crystal structure, Thermal expansion, Thermodynamics and Alloy. His Electromigration study combines topics in areas such as Current crowding, Joule heating and Void.
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Thin Films—Interdiffusion and Reactions
J. M. Poate;K. N. Tu;J. W. Mayor;Archibald L. Fripp.
Journal of The Electrochemical Society (1979)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K. Zeng;King-Ning Tu.
Materials Science & Engineering R-reports (2002)
Recent advances on electromigration in very-large-scale-integration of interconnects
Journal of Applied Physics (2003)
Electronic thin film science : for electrical engineers and materials scientists
K. N. Tu;James W. Mayer;Leonard C. Feldman.
Stress evolution due to electromigration in confined metal lines
M. A. Korhonen;P. Borgesen;King-Ning Tu;Che Yu Li.
Journal of Applied Physics (1993)
Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’
U. Gösele;King-Ning Tu.
Journal of Applied Physics (1982)
Tin–lead (SnPb) solder reaction in flip chip technology
King-Ning Tu;K. Zeng.
Materials Science & Engineering R-reports (2001)
Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films
Acta Metallurgica (1973)
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.
H. Kim;King-Ning Tu.
Physical Review B (1996)
Kinetics of interfacial reaction in bimetallic CuSn thin films
King-Ning Tu;R. D. Thompson.
Acta Metallurgica (1982)
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