2007 - Semiconductor Industry Association University Researcher Award
Electromigration in metals
Paul S Ho;Thomas Kwok.
Reports on Progress in Physics (1989)
Low Dielectric Constant Materials for ULSI Interconnects
Michael Morgen;E. Todd Ryan;Jie-Hua Zhao;Chuan Hu.
Annual Review of Materials Science (2000)
Electromigration reliability issues in dual-damascene Cu interconnections
E.T. Ogawa;Ki-Don Lee;V.A. Blaschke;P.S. Ho.
IEEE Transactions on Reliability (2002)
Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications
Wei William Lee;Paul S. Ho.
Mrs Bulletin (1997)
Diffusion Phenomena in Thin Films and Microelectronic Materials
Davendra Gupta;Paul S. Ho.
Plasma processing of low-k dielectrics
Mikhail R. Baklanov;Jean-Francois de Marneffe;Denis Shamiryan;Adam M. Urbanowicz.
Journal of Applied Physics (2013)
Chemical bonding and reaction at metal/polymer interfaces
Paul S Ho;P. O. Hahn;J. W. Bartha;G. W. Rubloff.
Journal of Vacuum Science and Technology (1985)
Auger study of preferred sputtering on binary alloy surfaces
P.S Ho;J.E Lewis;H.S Wildman;J.K Howard.
Surface Science (1976)
Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects
Suk-Kyu Ryu;Kuan-Hsun Lu;Xuefeng Zhang;Jang-Hi Im.
IEEE Transactions on Device and Materials Reliability (2011)
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
Kuan H. Lu;Xuefeng Zhang;Suk-Kyu Ryu;Jay Im.
electronic components and technology conference (2009)
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