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D-Index & Metrics

Materials Science

D-Index
49
Citations
8062
World Ranking
10597
National Ranking
465

Young-Chang Joo publication distribution in Materials Science in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Materials Science in 2026. The highlighted bar marks where Young-Chang Joo sits on this spectrum.

50–69 publications: 28 scientists 70–89 publications: 152 scientists 90–109 publications: 356 scientists 110–129 publications: 487 scientists 130–149 publications: 723 scientists 150–169 publications: 835 scientists 170–189 publications: 850 scientists 190–209 publications: 891 scientists 210–229 publications: 862 scientists 230–249 publications: 766 scientists 250–269 publications: 726 scientists 270–289 publications: 665 scientists 290–309 publications: 593 scientists 310–329 publications: 537 scientists 330–349 publications: 477 scientists 350–369 publications: 440 scientists 370–389 publications: 356 scientists 390–409 publications: 321 scientists 410–429 publications: 256 scientists 430–449 publications: 246 scientists 450–469 publications: 216 scientists 470–489 publications: 212 scientists 490–509 publications: 174 scientists 510–529 publications: 194 scientists 530–549 publications: 162 scientists 550–569 publications: 131 scientists 570–589 publications: 111 scientists 590–609 publications: 103 scientists 610–629 publications: 99 scientists 630–649 publications: 77 scientists 650–669 publications: 92 scientists 670–689 publications: 56 scientists 690–709 publications: 53 scientists 710–729 publications: 53 scientists 730–749 publications: 38 scientists 750–769 publications: 52 scientists 770–789 publications: 43 scientists 790–809 publications: 38 scientists 810–829 publications: 34 scientists 830–849 publications: 25 scientists 850–869 publications: 18 scientists 870–889 publications: 20 scientists 890–909 publications: 24 scientists 910–929 publications: 27 scientists 930–949 publications: 20 scientists 950–969 publications: 17 scientists 970–989 publications: 10 scientists 990–1,009 publications: 16 scientists 1,010–1,029 publications: 13 scientists 1,030–1,049 publications: 12 scientists 1,050–1,069 publications: 9 scientists 1,070–1,089 publications: 8 scientists 1,090–1,109 publications: 7 scientists 1,110–1,129 publications: 9 scientists 1,130–1,149 publications: 2 scientists 1,150–1,162 publications: 5 scientists 1,163+ publications: 100 scientists
50 publications 1,163+

This scientist: 270 publications — 52nd percentile

52% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,163 publications or more.

Young-Chang Joo D-index placement in Materials Science in 2026

The chart shows the D-index (discipline H-index) distribution of Materials Science scientists ranked by Research.com in 2026. The highlighted bar marks where Young-Chang Joo sits on this spectrum.

40–41 D-Index: 211 scientists 42–43 D-Index: 450 scientists 44–45 D-Index: 612 scientists 46–47 D-Index: 612 scientists 48–49 D-Index: 598 scientists 50–51 D-Index: 657 scientists 52–53 D-Index: 667 scientists 54–55 D-Index: 621 scientists 56–57 D-Index: 597 scientists 58–59 D-Index: 610 scientists 60–61 D-Index: 587 scientists 62–63 D-Index: 606 scientists 64–65 D-Index: 533 scientists 66–67 D-Index: 490 scientists 68–69 D-Index: 469 scientists 70–71 D-Index: 378 scientists 72–73 D-Index: 421 scientists 74–75 D-Index: 359 scientists 76–77 D-Index: 323 scientists 78–79 D-Index: 299 scientists 80–81 D-Index: 230 scientists 82–83 D-Index: 210 scientists 84–85 D-Index: 195 scientists 86–87 D-Index: 203 scientists 88–89 D-Index: 175 scientists 90–91 D-Index: 175 scientists 92–93 D-Index: 142 scientists 94–95 D-Index: 121 scientists 96–97 D-Index: 117 scientists 98–99 D-Index: 107 scientists 100–101 D-Index: 88 scientists 102–103 D-Index: 85 scientists 104–105 D-Index: 68 scientists 106–107 D-Index: 62 scientists 108–109 D-Index: 57 scientists 110–111 D-Index: 45 scientists 112–113 D-Index: 49 scientists 114–115 D-Index: 50 scientists 116–117 D-Index: 34 scientists 118–119 D-Index: 38 scientists 120–121 D-Index: 37 scientists 122–123 D-Index: 29 scientists 124–125 D-Index: 28 scientists 126–127 D-Index: 24 scientists 128–129 D-Index: 33 scientists 130–131 D-Index: 28 scientists 132–133 D-Index: 21 scientists 134–135 D-Index: 20 scientists 136–137 D-Index: 23 scientists 138–139 D-Index: 17 scientists 140–141 D-Index: 12 scientists 142–143 D-Index: 17 scientists 144–145 D-Index: 21 scientists 146–147 D-Index: 13 scientists 148–149 D-Index: 11 scientists 150–151 D-Index: 14 scientists 152–153 D-Index: 13 scientists 154–155 D-Index: 9 scientists 156–157 D-Index: 10 scientists 158–159 D-Index: 7 scientists 160–161 D-Index: 4 scientists 162–163 D-Index: 4 scientists 164 D-Index: 3 scientists 165+ D-Index: 98 scientists
40 D-Index 165+

This scientist: 49 D-Index — 19th percentile

19% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 165 D-Index or more.

Overview

Young-Chang Joo is affiliated with Seoul National University in South Korea. Their research lies at the intersection of engineering and materials science, focusing extensively on advanced technologies across multiple subfields.

Their primary fields of study include engineering, with 74 publications, and materials science, accounting for 49 of their contributions. Subfields encompass electrical and electronic engineering, materials chemistry, renewable energy, sustainability and the environment, biomedical engineering, and mechanical engineering. This diverse expertise reflects a multidisciplinary approach to problem solving in technology and materials development.

The main research topics pursued by Young-Chang Joo cover various specialized areas such as:

  • CO2 Reduction Techniques and Catalysts
  • Electronic Packaging and Soldering Technologies
  • Advanced Sensor and Energy Harvesting Materials
  • 3D IC and Through-Silicon Via (TSV) technologies
  • Copper Interconnects and Reliability
  • Diamond and Carbon-based Materials Research
  • Ionic liquids properties and applications

Young-Chang Joo's recent scientific papers include:

  • "Electrochemical upgrade of CO2 from amine capture solution," 2020, published in Nature Energy
  • "Quasi-graphitic carbon shell-induced Cu confinement promotes electrocatalytic CO2 reduction toward C2+ products," 2021, published in Nature Communications
  • "Long-term reliable physical health monitoring by sweat pore-inspired perforated electronic skins," 2021, published in Science Advances
  • "Nanofiber Channel Organic Electrochemical Transistors for Low-Power Neuromorphic Computing and Wide-Bandwidth Sensing Platforms," 2021, published in Advanced Science
  • "Thermodynamically driven self-formation of copper-embedded nitrogen-doped carbon nanofiber catalysts for a cascade electroreduction of carbon dioxide to ethylene," 2020, published in Journal of Materials Chemistry A

The frequent co-authors in their collaborative work include:

  • Miyoung Kim
  • Deokgi Hong
  • Ji-Yong Kim
  • Dae-Hyun Nam
  • Seongi Lee

Young-Chang Joo has published predominantly in these venues:

  • Electronic Materials Letters
  • SSRN Electronic Journal
  • Science Advances
  • ACS Applied Materials & Interfaces
  • RSC Advances

Best Publications

  • Highly efficient and bending durable perovskite solar cells: toward a wearable power source

    Byeong Jo Kim;Dong Hoe Kim;Yoo Yong Lee;Hee Won Shin

  • Method of forming copper/copper alloy interconnection with reduced electromigration

    Takeshi Nogami;Sergey Lopatin;Young-Chang Joo

  • A Strain-Insensitive Stretchable Electronic Conductor: PEDOT:PSS/Acrylamide Organogels

    Yoo-Yong Lee;Ho-Young Kang;Seok Hyeon Gwon;Gwang Mook Choi

  • Electrochemical upgrade of CO2 from amine capture solution

    Geonhui Lee;Yuguang C. Li;Ji-Yong Kim;Tao Peng

  • Quasi-graphitic carbon shell-induced Cu confinement promotes electrocatalytic CO2 reduction toward C2+ products.

    Ji-Yong Kim;Deokgi Hong;Jae-Chan Lee;Hyoung Gyun Kim

  • Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy

    S.-H. Kim;H.-J. Sohn;Y.-C. Joo;Y.-W. Kim

  • Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins

    Hanwool Yeon;Haneol Lee;Haneol Lee;Yeongin Kim;Doyoon Lee

  • Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

    Linda Vanasupa;Young-Chang Joo;Paul R. Besser;Shekhar Pramanick

  • A new hematite photoanode doping strategy for solar water splitting: oxygen vacancy generation.

    Tae-Youl Yang;Ho-Young Kang;Uk Sim;Young-Joo Lee

  • Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

    A. S. Budiman;H.-A.-S. Shin;B.-J. Kim;S.-H. Hwang

  • Thermomechanical properties and mechanical stresses of Ge2Sb2Te5 films in phase-change random access memory

    Il-Mok Park;Jung-Kyu Jung;Sang-Ouk Ryu;Kyu-Jeong Choi

  • Atomic migration in molten and crystalline Ge2Sb2Te5 under high electric field

    Tae-Youl Yang;Il-Mok Park;Byoung-Joon Kim;Young-Chang Joo

  • Graphene as an atomically thin barrier to Cu diffusion into Si.

    Juree Hong;Sanggeun Lee;Seulah Lee;Heetak Han

  • Crack nucleation during mechanical fatigue in thin metal films on flexible substrates

    Byoung-Joon Kim;Hae-A. Seul Shin;Sung-Yup Jung;Yigil Cho

  • Effect of film thickness and annealing temperature on hillock distributions in pure Al films

    Soo-Jung Hwang;Je-Hun Lee;Chang-Oh Jeong;Young-Chang Joo

  • Tailoring of Electron-Collecting Oxide Nanoparticulate Layer for Flexible Perovskite Solar Cells

    Seong Sik Shin;Woon Seok Yang;Eun Joo Yeom;Seon Joo Lee

  • Highly reliable ag nanowire flexible transparent electrode with mechanically welded junctions.

    Byungil Hwang;Hae-A-Seul Shin;Taegeon Kim;Young-Chang Joo

  • Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

    Gi-Tae Lim;Byoung-Joon Kim;Kiwook Lee;Jaedong Kim

  • Effect of low- k dielectric on stress and stress-induced damage in Cu interconnects

    Jong-Min Paik;Hyun Park;Young-Chang Joo

  • Microstructural evidence of abnormal grain growth by solid-state wetting in Fe-3%Si steel

    Hyun Park;Doh-Yeon Kim;Nong-Moon Hwang;Young-Chang Joo

  • Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects

    Young-Chang Joo;Carl V. Thompson

Frequent Co-Authors

Ki Tae Nam
Ki Tae Nam Seoul National University
Miyoung Kim
Miyoung Kim Seoul National University
Nong-Moon Hwang
Nong-Moon Hwang Seoul National University
Kyu Hwan Oh
Kyu Hwan Oh Seoul National University
Nobumichi Tamura
Nobumichi Tamura Lawrence Berkeley National Laboratory
William D. Nix
William D. Nix Stanford University
Heung Nam Han
Heung Nam Han Seoul National University
Taek Dong Chung
Taek Dong Chung Seoul National University
Oliver Kraft
Oliver Kraft Karlsruhe Institute of Technology

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