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Materials Science

D-Index
46
Citations
8539
World Ranking
11406
National Ranking
2680

Overview

Timothy W. Weidman is affiliated with Applied Materials in the United States and has contributed to research in the fields of Engineering and Materials Science. Their work includes focused studies in the subfields of Electrical and Electronic Engineering as well as Surfaces, Coatings, and Films.

The scientist's research covers several main topics, including:

  • Advancements in Photolithography Techniques
  • Integrated Circuits and Semiconductor Failure Analysis
  • Electron and X-Ray Spectroscopy Techniques

Weidman has coauthored publications alongside colleagues such as Xiao Zhao, Chenghao Wu, Hans A. Bechtel, and Miquel Salmerón. These collaborations appear in peer-reviewed venues, contributing to their research output and professional network.

One noted publication by Timothy W. Weidman is titled "Infrared nanospectroscopy characterization of metal oxide photoresists," published in 2022 in the Journal of Micro/Nanopatterning Materials and Metrology. This paper has received citations within the scientific community, reflecting engagement with their research findings.

Weidman's academic contributions are concentrated in journals specialized in micro- and nanofabrication techniques and material characterization, with a presence in outlets such as the Journal of Micro/Nanopatterning Materials and Metrology.

Best Publications

  • Method of depositing an amorphous carbon layer

    Kevin Fairbairn;Michael Rice;Timothy Weidman;Christopher S Ngai

  • Method of forming a dual damascene structure

    Nikolaos Bekiaris;Timothy Weidman;Michael Armacost;Mehul Naik

  • Contact metallization methods and processes

    Timothy W Weidman;Kapila P Wijekoon;Zhize Zhu;Avgerinos V Jerry Gelatos

  • Integrated electroless deposition system

    Dmitry Lubomirsky;Arulkumar Shanmugasundram;Allen D'ambra;Timothy W. Weidman

  • Apparatus and methods for deposition of silicon carbide and silicon carbonitride films

    Timothy W. Weidman;Todd Schroeder

  • Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices

    Farhad Moghadam;Jun Zhao;Timothy Weidman;Rick J. Roberts

  • Curing methods for silicon dioxide multi-layers

    Abhijit Basu Mallick;Srinivas D. Nemani;Timothy W. Weidman

  • Electroless deposition process on a silicon contact

    Michael P. Stewart;Timothy W. Weidman;Arulkumar Shanmugasundram;David J. Eaglesham

  • Method of selectively depositing a thin film material at a semiconductor interface

    Michael P. Stewart;Timothy W. Weidman

  • Apparatus for electroless deposition

    Dmitry Lubomirsky;Arulkumar Shanmugasundram;Ian A. Pancham;Sergey Lopatin

  • Method And Apparatus For Low Temperature ALD Deposition

    Maitreyee Mahajani;Steven D. Marcus;Li-Qun Xia;Mihaela Balseanu

  • Process and an integrated tool for low k dielectric deposition including a pecvd capping module

    Jun Zhao;Farhad Moghadam;Tim Weidman;Rick Roberts

  • Deposition of an intermediate catalytic layer on a barrier layer for copper metallization

    Timothy Weidman

  • Ultrasound-mediated reductive condensation synthesis of silicon-silicon-bonded network polymers

    Patricia A. Bianconi;Frederic C. Schilling;Timothy W. Weidman

  • Poly(n-hexylsilyne): synthesis and properties of the first alkyl silicon [RSi]n network polymer

    Patricia A. Bianconi;Timothy W. Weidman

  • Surface cleaning and texturing process for crystalline solar cells

    Kapila Wijekoon;Rohit Mishra;Michael P. Stewart;Timothy Weidman

  • Patterned electroless metallization processes for large area electronics

    Timothy Weidman

  • Apparatus for electroless deposition of metals onto semiconductor substrates

    Dmitry Lubomirsky;Arulkumar Shanmugasundram;Russell Ellwanger;Ian A. Pancham

  • Airgap for semiconductor devices

    Ian S. Latchford;Christopher D. Bencher;Michael D. Armacost;Timothy Weidman

  • Hybrid heterojunction solar cell fabrication using a doping layer mask

    Timothy W. Weidman;Rohit Mishra;Michael P. Stewart;Yonghwa Chris Cha

Frequent Co-Authors

Dmitry Lubomirsky
Dmitry Lubomirsky Applied Materials (United States)
Srinivas D. Nemani
Srinivas D. Nemani Applied Materials (United States)
Li-Qun Xia
Li-Qun Xia Applied Materials (United States)
K. Peter C. Vollhardt
K. Peter C. Vollhardt University of California, Berkeley
Sergey D. Lopatin
Sergey D. Lopatin Applied Materials (United States)
Leonard C. Feldman
Leonard C. Feldman Rutgers, The State University of New Jersey
Nitin K. Ingle
Nitin K. Ingle Applied Materials (United States)
Ellie Yieh
Ellie Yieh Applied Materials (United States)
Olivier Joubert
Olivier Joubert University of Nantes
Martin L. Green
Martin L. Green National Institute of Standards and Technology

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