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Engineering and Technology

D-Index
48
Citations
8632
World Ranking
4580
National Ranking
1318

Overview

Kartik Ramaswamy is affiliated with Applied Materials in the United States. Their research primarily focuses on the field of Business, Management and Accounting, with a particular emphasis on the subfield of Accounting. The core topics of their work relate to Banking Sector Performance and Management.

Ramaswamy's publications include contributions to one main venue, the International Journal of Engineering Technology and Management Sciences. Their recent published paper is titled "Impact of NPA on Profitability of Banks", released in 2020 through the same journal.

  • "Impact of NPA on Profitability of Banks" (2020), International Journal of Engineering Technology and Management Sciences

Frequent collaborators in their research efforts include:

  • Ritu Wadhwa
  • Ishan Sunilkumar Bhatt

Ramaswamy's work investigates various dimensions of banking sector performance, notably analyzing the effects of non-performing assets (NPAs) on bank profitability. Their integration of accounting principles in this context places their studies within applied managerial and financial analysis frameworks.

Best Publications

  • Low temperature CVD process with selected stress of the CVD layer on CMOS devices

    Hiroji Hanawa;Kartik Ramaswamy;Kenneth S. Collins;Amir Al-Bayati

  • Semiconductor substrate process using a low temperature-deposited carbon-containing hard mask

    Kartik Ramaswamy;Hiroji Hanawa;Biagio Gallo;Kenneth S. Collins

  • Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage

    Kenneth S. Collins;Hiroji Hanawa;Kartik Ramaswamy;Andrew Nguyen

  • Method for ion implanting insulator material to reduce dielectric constant

    Amir Al-Bayati;Rick J. Roberts;Kenneth S. Collins;Ken MacWilliams

  • Chemical vapor deposition plasma process using an ion shower grid

    Hiroji Hanawa;Tsutomu Tanaka;Kenneth S. Collins;Amir Al-Bayati

  • Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer

    Kartik Ramaswamy;Hiroji Hanawa;Biagio Gallo;Kenneth S. Collins

  • Substrate support having heat transfer system

    Andrew Nguyen;Wing Lau Cheng;Hiroji Hanawa;Semyon L. Kats

  • Copper barrier reflow process employing high speed optical annealing

    Kartik Ramaswamy;Hiroji Hanawa;Biagio Gallo;Kenneth S Collins

  • Method for tuning a system operating a plasma process

    Banna Samer;Todorow Valentin;Ramaswamy Kartik

  • Semiconductor substrate process using an optically writable carbon-containing mask

    Kartik Ramaswamy;Hiroji Hanawa;Biagio Gallo;Kenneth S. Collins

  • A semiconductor junction formation process includi

    Ramaswamy Kartik;Hanawa Hiroji;Gallo Biagio;Collins Kenneth S

  • Low temperature absorption layer deposition and hi

    Ramaswamy Kartik;Hanawa Hiroji;Gallo Biagio;Collins Kenneth S

  • A process for low temperature plasma deposition of

    Ramaswamy Kartik;Hanawa Hiroji;Gallo Biagio;Collins Kenneth S

  • Chemical vapor deposition plasma reactor having plural ion shower grids

    Hiroji Hanawa;Tsutomu Tanaka;Kenneth S. Collins;Amir Al-Bayati

  • Independent control of rf phases of separate coils of an inductively coupled plasma reactor

    Kenneth S. Collins;Satoru Kobayashi;Lawrence Wong;Jonathan Liu

  • REMOVAL OF SURFACE DOPANT FROM SUBSTRATE

    Kartik Ramaswamy;Collins Kenneth S;Gallo Biagio;Hanawa Koji

  • Two-phase operation of plasma chamber by phase locked loop

    Satoru Kobayashi;Lawrence Wong;Jonathan Liu;Yang Yang

  • Semiconductor system assemblies and methods of operation

    Andrew Nguyen;Kartik Ramaswamy;Srinivas Nemani;Bradley Howard

  • Multi-mode etch chamber source assembly

    Sergey G. Belostotskiy;Alexander Marcacci;Kartik Ramaswamy;Srinivas D. Nemani

  • Plasma immersion ion implantation apparatus including a plasma source having low dissociation and low minimum plasma voltage

    Kenneth S. Collins;Hiroji Hanawa;Kartik Ramaswamy;Andrew Nguyen

Frequent Co-Authors

Kenneth S. Collins
Kenneth S. Collins Applied Materials (United States)
Shahid Rauf
Shahid Rauf Applied Materials (United States)
Andrew Nguyen
Andrew Nguyen Applied Materials (United States)
Hiroji Hanawa
Hiroji Hanawa Applied Materials (United States)
Srinivas D. Nemani
Srinivas D. Nemani Applied Materials (United States)
Matthew L. Miller
Matthew L. Miller NEC (United States)
Ellie Yieh
Ellie Yieh Applied Materials (United States)
Dmitry Lubomirsky
Dmitry Lubomirsky Applied Materials (United States)
Ajay Kumar
Ajay Kumar Hong Kong Polytechnic University
John M. White
John M. White Applied Materials (United States)

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