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Engineering and Technology

D-Index
39
Citations
7733
World Ranking
7592
National Ranking
2085

Overview

Shahid Rauf is a researcher affiliated with Applied Materials in the United States, specializing in engineering with a focus on electrical and electronic engineering. Their work extensively covers plasma diagnostics and applications, with significant contributions to the study of dust and plasma wave phenomena, metal and thin film mechanics, and semiconductor materials and devices. Additional research interests include electrohydrodynamics, fluid dynamics, and particle accelerators and beam dynamics.

The scientist has a publication record that highlights key venues, including 11 papers in Plasma Sources Science and Technology, 7 papers on arXiv (Cornell University), 4 papers in the Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, and additional works in the Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena and Physics of Plasmas.

Notable recent publications by Shahid Rauf include:

  • On uniformity and non-local transport in low pressure capacitively coupled plasmas, 2020, Plasma Sources Science and Technology
  • Ion energy distribution functions in a dual-frequency low-pressure capacitively-coupled plasma: experiments and particle-in-cell simulation, 2021, Plasma Sources Science and Technology
  • The 2021 release of the Quantemol database (QDB) of plasma chemistries and reactions, 2022, Plasma Sources Science and Technology
  • Metastable argon atom kinetics in a low-pressure capacitively coupled radio frequency discharge, 2023, Plasma Sources Science and Technology
  • Future of plasma etching for microelectronics: Challenges and opportunities, 2024, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena

Shahid Rauf has collaborated frequently with a group of coauthors, including Kallol Bera, Igor Kaganovich, Jason Kenney, Sathya Ganta, and Ihor Korolov. These collaborations have resulted in multiple joint publications and contributions to the field of plasma science and engineering.

In addition to journal articles, Rauf has published a book titled Electrical Engineering for Non-Electrical Engineers with River Publishers eBooks in 2021.

The researcher's work spans several subfields, such as mechanics of materials, atomic and molecular physics and optics, radiology, nuclear medicine and imaging, and aerospace engineering, reflecting a diverse scope within applied engineering disciplines.

Best Publications

  • The 2017 Plasma Roadmap: Low temperature plasma science and technology

    I. Adamovich;S. D. Baalrud;A. Bogaerts;P. J. Bruggeman

  • The 2012 Plasma Roadmap

    Seiji Samukawa;Masaru Hori;Shahid Rauf;Kunihide Tachibana

  • Dynamics of a coplanar-electrode plasma display panel cell. I. Basic operation

    Shahid Rauf;Mark J. Kushner

  • Dual mode inductively coupled plasma reactor with adjustable phase coil assembly

    Samer Banna;Valentin N. Todorow;Kenneth S. Collins;Andrew Nguyen

  • Argon metastable densities in radio frequency Ar, Ar/O2 and Ar/CF4 electrical discharges

    Shahid Rauf;Mark J. Kushner

  • Etch method in the manufacture of an integrated circuit

    Terry G. Sparks;Shahid Rauf

  • Plasma reactor gas distribution plate with radially distributed path splitting manifold

    Kallol Bera;Shahid Rauf

  • Independent control of rf phases of separate coils of an inductively coupled plasma reactor

    Kenneth S. Collins;Satoru Kobayashi;Lawrence Wong;Jonathan Liu

  • Two-phase operation of plasma chamber by phase locked loop

    Satoru Kobayashi;Lawrence Wong;Jonathan Liu;Yang Yang

  • Nonlinear dynamics of radio frequency plasma processing reactors powered by multifrequency sources

    S. Rauf;M.J. Kushner

  • Synchronized radio frequency pulsing for plasma etching

    Bryan Liao;Katsumasa Kawasaki;Yashaswini Pattar;Sergio Fukuda Shoji

  • Inductively Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Robust, Reliable, and Fine Conductor Etching

    S. Banna;A. Agarwal;K. Tokashiki;Hong Cho

  • Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution

    Kallol Bera;Shahid Rauf

  • Pulsed plasma high aspect ratio dielectric process

    Ankur Agarwal;Kenneth S. Collins;Shahid Rauf;Kartik Ramaswamy

  • Self-consistent simulation of very high frequency capacitively coupled plasmas

    Shahid Rauf;Kallol Bera;Ken Collins

  • SYMMETRICAL PLASMA PROCESSING CHAMBER

    James D Carducci;Hamid Tabassoli;Balakrishna Ajit;Chen Zhigang

  • A molecular dynamics investigation of fluorocarbon based layer-by-layer etching of silicon and SiO2

    S. Rauf;T. Sparks;P. L. G. Ventzek;V. V. Smirnov

  • Breakdown processes in metal halide lamps

    Brian Lay;Brian Lay;Richard S Moss;Shahid Rauf;Shahid Rauf;Mark J Kushner

  • The effect of radio frequency plasma processing reactor circuitry on plasma characteristics

    Shahid Rauf;Mark J. Kushner

  • Process for wafer backside polymer removal and wafer front side photoresist removal

    Kenneth S. Collins;Hiroji Hanawa;Andrew Nguyen;Shahid Rauf

Frequent Co-Authors

Kenneth S. Collins
Kenneth S. Collins Applied Materials (United States)
Kartik Ramaswamy
Kartik Ramaswamy Applied Materials (United States)
Andrew Nguyen
Andrew Nguyen Applied Materials (United States)
Hiroji Hanawa
Hiroji Hanawa Applied Materials (United States)
Mark J. Kushner
Mark J. Kushner University of Michigan–Ann Arbor
Julian Schulze
Julian Schulze Ruhr University Bochum
Matthew L. Miller
Matthew L. Miller NEC (United States)
Jonathan Tennyson
Jonathan Tennyson University College London
Annemie Bogaerts
Annemie Bogaerts University of Antwerp
Uwe R. Kortshagen
Uwe R. Kortshagen University of Minnesota

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