A method for depositing and curing low-k films for gapfill and conformal film applications
Munro Jeffery C;Nemani Srinivas D.
Method and apparatus for gettering fluorine from chamber material surfaces
Li-Qun Xia;Visweswaren Sivaramakrishnan;Srinivas Nemani;Ellie Yieh.
Method and system for improving dielectric film quality for void free gap fill
Abhijit Basu Mallick;Jeffrey C. Munro;Linlin Wang;Srinivas D. Nemani.
High quality silicon oxide films by remote plasma cvd from disilane precursors
Abhijit Basu Mallick;Srinivas D. Nemani;Ellie Yieh.
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
David W Cheung;Frederick Gaillard;Shin-Puu Jeng;Chi-I Lang.
Method of depositing dielectric materials in damascene applications
Ju-hyung Lee;Ping Xu;Shankar Venkataraman;Li-Qun Xia.
Methods for forming silicon nitride based film or silicon carbon based film
Abhijit Basu Mallick;Srinivas D. Nemani.
Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers
Srinivas D. Nemani;Li-Qun Xia;Ellie Yieh.
Method of depositing low dielectric constant silicon carbide layers
Francimar Campana;Srinivas Nemani;Michael Chapin;Shankar Venkataraman.
Method of depositing dielectric films
Srinivas D Nemani;Li-Qun Xia;Dian Sugiarto;Ellie Yieh.
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