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Engineering and Technology

D-Index
38
Citations
7658
World Ranking
7928
National Ranking
2175

Overview

Srinivas D. Nemani is affiliated with Applied Materials in the United States and has contributed extensively to the fields of engineering and materials science, with a particular focus on electrical and electronic engineering, and the mechanics and chemistry of materials. Their research spans a number of subfields including electronic, optical and magnetic materials, atomic and molecular physics, and optics.

The main topics of their work include semiconductor materials and devices, copper interconnects and reliability, metal and thin film mechanics, molecular junctions and nanostructures, electronic and structural properties of oxides, integrated circuits and semiconductor failure analysis, as well as advancements in semiconductor devices and circuit design.

Recent publications by Srinivas D. Nemani feature studies on nanoscale deposition techniques and materials engineering. These include:

  • Proximity Effects of the Selective Atomic Layer Deposition of Cobalt on the Nanoscale: Implications for Interconnects, 2021, ACS Applied Nano Materials
  • Selective Pulsed Chemical Vapor Deposition of Water-Free TiO2/Al2O3 and HfO2/Al2O3 Nanolaminates on Si and SiO2 in Preference to SiCOH, 2022, ACS Applied Materials & Interfaces
  • Inherent selective pulsed chemical vapor deposition of amorphous hafnium oxide / titanium oxide nanolaminates, 2022, Applied Surface Science
  • Inherent selective pulsed chemical vapor deposition of aluminum oxide in nm scale, 2023, Applied Surface Science
  • Inherently Selective Water-Free Deposition of Titanium Dioxide on the Nanoscale: Implications for Nanoscale Patterning, 2022, ACS Applied Nano Materials

Srinivas D. Nemani's work has been published frequently in venues such as ACS Applied Nano Materials, ACS Applied Materials & Interfaces, Applied Surface Science, and the Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. These publications reflect consistent contributions to the advancement of nanomaterials and semiconductor technology.

Their collaborative efforts include frequent co-authors such as Keith T. Wong, Andrew C. Kummel, Ellie Yieh, James Huang, and Yunil Cho, highlighting an active role in team-based research projects. These collaborations often intersect with the fields of thin film deposition and nanoscale materials engineering.

Best Publications

  • Method and apparatus for gettering fluorine from chamber material surfaces

    Li-Qun Xia;Visweswaren Sivaramakrishnan;Srinivas Nemani;Ellie Yieh

  • Formation of fluid silicon layer by reaction of organic silicon compound with hydroxyl forming compound

    David W Cheung;Frederick Gaillard;Shin-Puu Jeng;Chi-I Lang

  • Method and system for improving dielectric film quality for void free gap fill

    Abhijit Basu Mallick;Jeffrey C. Munro;Linlin Wang;Srinivas D. Nemani

  • Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications

    Ju-hyung Lee;Ping Xu;Shankar Venkataraman;Li-Qun Xia

  • Curing methods for silicon dioxide multi-layers

    Abhijit Basu Mallick;Srinivas D. Nemani;Timothy W. Weidman

  • Methods for forming silicon nitride based film or silicon carbon based film

    Abhijit Basu Mallick;Srinivas D. Nemani

  • Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers

    Srinivas D. Nemani;Li-Qun Xia;Ellie Yieh

  • Method of depositing dielectric films

    Srinivas D Nemani;Li-Qun Xia;Dian Sugiarto;Ellie Yieh

  • Method of depositing low dielectric constant silicon carbide layers

    Francimar Campana;Srinivas Nemani;Michael Chapin;Shankar Venkataraman

  • Method of etching high aspect ratio features in a dielectric layer

    Jong Mun Kim;Kenny Linh Doan;Li Ling;Jairaj Payyapilly

  • Two-layer film for next generation damascene barrier application with good oxidation resistance

    Yi Zheng;Srinivas D Nemani;Li Qun Xia

  • Method of removing a metal hardmask

    Chia-Ling Kao;Kwang-Soo Kim;Sean S. Kang;Srinivas D. Nemani

  • Air gap process

    Srinivas D. Nemani;Takehito Koshizawa

  • Methods for etching an etching stop layer utilizing a cyclical etching process

    Mang-Mang Ling;Sean S. Kang;Jeremiah T. P. Pender;Srinivas D. Nemani

  • Delicate dry clean

    Lina Zhu;Sean S. Kang;Srinivas D. Nemani;Chia-Ling Kao

  • Near surface etch selectivity enhancement

    Lina Zhu;Sean S. Kang;Srinivas D. Nemani;Sergey G. Belostotskiy

  • Semiconductor system assemblies and methods of operation

    Andrew Nguyen;Kartik Ramaswamy;Srinivas Nemani;Bradley Howard

  • Multi-mode etch chamber source assembly

    Sergey G. Belostotskiy;Alexander Marcacci;Kartik Ramaswamy;Srinivas D. Nemani

  • Patterning magnetic memory

    Srinivas D. Nemani;Sumit Agarwal;Jeremiah T. Pender;Jonathan Germain

  • Method of patterning a low-k dielectric film

    Srinivas D. Nemani;Jeremiah T. Pender;Qingjun Zhou;Dmitry Lubomirsky

Frequent Co-Authors

Ellie Yieh
Ellie Yieh Applied Materials (United States)
Kartik Ramaswamy
Kartik Ramaswamy Applied Materials (United States)
Li-Qun Xia
Li-Qun Xia Applied Materials (United States)
Dmitry Lubomirsky
Dmitry Lubomirsky Applied Materials (United States)
Andrew C. Kummel
Andrew C. Kummel University of California, San Diego
Andrew Nguyen
Andrew Nguyen Applied Materials (United States)
Timothy W. Weidman
Timothy W. Weidman Applied Materials (United States)
Kenneth S. Collins
Kenneth S. Collins Applied Materials (United States)
Nitin K. Ingle
Nitin K. Ingle Applied Materials (United States)
Olivier Joubert
Olivier Joubert University of Nantes

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