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Materials Science

D-Index
48
Citations
9493
World Ranking
10784
National Ranking
2551

Best Publications

  • Method to improve the step coverage and pattern loading for dielectric films

    Mihaela Balseanu;Meiyee Shek;Li-Qun Xia;Hichem M'Saad

  • Post-deposition treatment to enhance properties of Si-O-C low k films

    Li-Qun Xia;Frederic Gaillard;Ellie Yieh;Tian H. Lim

  • Process for forming a low dielectric constant carbon-containing film

    Frederic Gaillard;Li-Qun Xia;Jen Shu;Ellie Yieh

  • Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications

    Ju-hyung Lee;Ping Xu;Shankar Venkataraman;Li-Qun Xia

  • Boron nitride and boron nitride-derived materials deposition method

    Mihaela Balseanu;Christopher D. Bencher;Yongmei Chen;Li Yan Miao

  • Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition

    Frederic Gaillard;Li-Qun Xia;Tian-Hoe Lim;Ellie Yieh

  • Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ uv cure

    Mihaela Balseanu;Victor Nguyen;Li-Qun Xia;Derek R. Witty

  • Gapfill improvement with low etch rate dielectric liners

    Young Soo Kwon;Bi Jang;Anchuan Wang;Young S. Lee

  • Method of depositing dielectric films

    Srinivas D Nemani;Li-Qun Xia;Dian Sugiarto;Ellie Yieh

  • Method of eliminating photoresist poisoning in damascene applications

    Ping Xu;Li-Qun Xia;Larry A. Dworkin;Mehul Naik

  • MULTISTAGE CHAMBER CLEANING PROCESS FOR IMPROVING FILM GAP FILLING USING REMOTE PLASMA

    Xia Li-Qun;Yieh Ellie

  • Method for critical dimension shrink using conformal pecvd films

    Li-Qun Xia;Mihaela Balseanu;Meiyee Shek;SiYi Li

  • Method to increase the compressive stress of pecvd silicon nitride films

    Mihaela Balseanu;Li-Qun Xia;Vladimir Zubkov;Mei-Yee Shek

  • Method of modifying interlayer adhesion

    Francimar Campana Schmitt;Li-Qun Xia;Son Van Nguyen;Shankar Venkataraman

  • Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure

    Mihaela Balseanu;Michael S. Cox;Li-Qun Xia;Mei-Yee Shek

  • Method for producing gate stack sidewall spacers

    Reza Arghavani;Michael Chiu Kwan;Li-Qun Xia;Kang Sub Yim

  • Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics

    Huiwen Xu;Mei-Yee Shek;Li-Qun Xia;Amir Al-Bayati

  • Post-Deposition Treatment Methods For Silicon Nitride

    Victor Nguyen;Isabelita Roflox;Mihaela Balseanu;Li-Qun Xia

  • Method And Apparatus For Low Temperature ALD Deposition

    Maitreyee Mahajani;Steven D. Marcus;Li-Qun Xia;Mihaela Balseanu

  • Methods and Systems for Forming at Least One Dielectric Layer

    Li-Qun Xia;Mihaela Balseanu;Victor Nguyen;Derek R. Witty

Frequent Co-Authors

Ellie Yieh
Ellie Yieh Applied Materials (United States)
Srinivas D. Nemani
Srinivas D. Nemani Applied Materials (United States)
Timothy W. Weidman
Timothy W. Weidman Applied Materials (United States)
Reinhold H. Dauskardt
Reinhold H. Dauskardt Stanford University
Mei Chang
Mei Chang Applied Materials (United States)
Lei Wang
Lei Wang University of Wollongong

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