Li-Qun Xia

Best Publications

• Method to improve the step coverage and pattern loading for dielectric films

  Mihaela Balseanu;Meiyee Shek;Li-Qun Xia;Hichem M'Saad

  502
  Citations

• Post-deposition treatment to enhance properties of Si-O-C low k films

  Li-Qun Xia;Frederic Gaillard;Ellie Yieh;Tian H. Lim

  430
  Citations

• Process for forming a low dielectric constant carbon-containing film

  Frederic Gaillard;Li-Qun Xia;Jen Shu;Ellie Yieh

  403
  Citations

• Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications

  Ju-hyung Lee;Ping Xu;Shankar Venkataraman;Li-Qun Xia

  329
  Citations

• Boron nitride and boron nitride-derived materials deposition method

  Mihaela Balseanu;Christopher D. Bencher;Yongmei Chen;Li Yan Miao

  322
  Citations

• Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition

  Frederic Gaillard;Li-Qun Xia;Tian-Hoe Lim;Ellie Yieh

  315
  Citations

• Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ uv cure

  Mihaela Balseanu;Victor Nguyen;Li-Qun Xia;Derek R. Witty

  311
  Citations

• Gapfill improvement with low etch rate dielectric liners

  Young Soo Kwon;Bi Jang;Anchuan Wang;Young S. Lee

  287
  Citations

• Method of depositing dielectric films

  Srinivas D Nemani;Li-Qun Xia;Dian Sugiarto;Ellie Yieh

  284
  Citations

• Method of eliminating photoresist poisoning in damascene applications

  Ping Xu;Li-Qun Xia;Larry A. Dworkin;Mehul Naik

  280
  Citations

• MULTISTAGE CHAMBER CLEANING PROCESS FOR IMPROVING FILM GAP FILLING USING REMOTE PLASMA

  Xia Li-Qun;Yieh Ellie

  273
  Citations

• Method for critical dimension shrink using conformal pecvd films

  Li-Qun Xia;Mihaela Balseanu;Meiyee Shek;SiYi Li

  266
  Citations

• Method to increase the compressive stress of pecvd silicon nitride films

  Mihaela Balseanu;Li-Qun Xia;Vladimir Zubkov;Mei-Yee Shek

  265
  Citations

• Method of modifying interlayer adhesion

  Francimar Campana Schmitt;Li-Qun Xia;Son Van Nguyen;Shankar Venkataraman

  250
  Citations

• Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure

  Mihaela Balseanu;Michael S. Cox;Li-Qun Xia;Mei-Yee Shek

  250
  Citations

• Method for producing gate stack sidewall spacers

  Reza Arghavani;Michael Chiu Kwan;Li-Qun Xia;Kang Sub Yim

  249
  Citations

• Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics

  Huiwen Xu;Mei-Yee Shek;Li-Qun Xia;Amir Al-Bayati

  245
  Citations

• Post-Deposition Treatment Methods For Silicon Nitride

  Victor Nguyen;Isabelita Roflox;Mihaela Balseanu;Li-Qun Xia

  210
  Citations

• Method And Apparatus For Low Temperature ALD Deposition

  Maitreyee Mahajani;Steven D. Marcus;Li-Qun Xia;Mihaela Balseanu

  208
  Citations

• Methods and Systems for Forming at Least One Dielectric Layer

  Li-Qun Xia;Mihaela Balseanu;Victor Nguyen;Derek R. Witty

  202
  Citations