Daniel C. Edelstein is affiliated with IBM in the United States. Their professional work involves contributions to the field of chip interconnect technology.
In 2011, they were recognized as a Member of the National Academy of Engineering for contributions to the implementation of copper/low-dielectric chip interconnects.
Their research contributions have focused on advancing the technology related to interconnects in semiconductor devices, particularly in the integration of copper materials and low-dielectric constants to optimize performance and reliability in microchips.
D. Edelstein;J. Heidenreich;R. Goldblatt;W. Cote
Burghartz Joachim Norbert;Edelstein Daniel Charles;Jahnes Christopher Vincent;Uzoh Cyprian Emeka
R. Rosenberg;D. C. Edelstein;C.-K. Hu;K. P. Rodbell
Daniel C. Edelstein;Timothy J. Dalton;John G. Gaudiello;Mahadevaiyer Krishnan
J.N. Burghartz;D.C. Edelstein;M. Soyuer;H.A. Ainspan
Carlos Juan Sambucetti;Judith Marie Rubino;Daniel Charles Edelstein;Cyryl Cabral
Conti Richard A;Edelstein Daiel;Lee Gill Y
Soon-Chen Seo;Carlos Sambucetti;Xiaomeng Chen;Zheng Chen
A. Deutsch;P.W. Coteus;G.V. Kopcsay;H.H. Smith
Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey
Joachim Norbert Burghartz;Daniel Charles Edelstein;Christopher Vincent Jahnes;Cyprian Emeka Uzoh
J.N. Burghartz;D.C. Edelstein;K.A. Jenkiin;Y.H. Kwark
Daniel C. Edelstein;David V. Horak;Elbert E. Huang;Satyanarayana V. Nitta
D. C. Edelstein;G. A. Sai-Halasz;Y.-J. Mii
Madhav Datta;Daniel Charles Edelstein;Cyprian Emeka Uzoh
S. Narasimha;K. Onishi;H. M. Nayfeh;A. Waite
M. He;X. Zhang;T. Nogami;X. Lin
Panayotis Constantinou Andricacos;Harikilia Deligianni;John Owen Dukovic;Daniel C. Edelstein
Cyprian E. Uzoh;Daniel C. Edelstein
Chih-Chao Yang;Daniel C. Edelstein;Fenton R. McFeely
Daniel C. Edelstein;Takeshi Nogami
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