World's Best Scientists 2026 revealed!
Daniel C. Edelstein

Daniel C. Edelstein

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
49
Citations
10397
World Ranking
2922
National Ranking
1107

Materials Science

D-Index
49
Citations
10384
World Ranking
10441
National Ranking
2482

Daniel C. Edelstein publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Daniel C. Edelstein sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 240 publications — 42nd percentile

42% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Daniel C. Edelstein D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Daniel C. Edelstein sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 49 D-Index — 58th percentile

58% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Research.com Recognitions

  • 2011 - Member of the National Academy of Engineering For contributions to implementation of copper/low-dielectric chip interconnects.

Overview

Daniel C. Edelstein is affiliated with IBM in the United States. Their professional work involves contributions to the field of chip interconnect technology.

In 2011, they were recognized as a Member of the National Academy of Engineering for contributions to the implementation of copper/low-dielectric chip interconnects.

Their research contributions have focused on advancing the technology related to interconnects in semiconductor devices, particularly in the integration of copper materials and low-dielectric constants to optimize performance and reliability in microchips.

Best Publications

  • Full copper wiring in a sub-0.25 /spl mu/m CMOS ULSI technology

    D. Edelstein;J. Heidenreich;R. Goldblatt;W. Cote

  • Method of forming an integrated circuit toroidal inductor

    Burghartz Joachim Norbert;Edelstein Daniel Charles;Jahnes Christopher Vincent;Uzoh Cyprian Emeka

  • Copper Metallization for High Performance Silicon Technology

    R. Rosenberg;D. C. Edelstein;C.-K. Hu;K. P. Rodbell

  • Method of forming barrier layers for damascene interconnects

    Daniel C. Edelstein;Timothy J. Dalton;John G. Gaudiello;Mahadevaiyer Krishnan

  • RF circuit design aspects of spiral inductors on silicon

    J.N. Burghartz;D.C. Edelstein;M. Soyuer;H.A. Ainspan

  • Method for forming Co-W-P-Au films

    Carlos Juan Sambucetti;Judith Marie Rubino;Daniel Charles Edelstein;Cyryl Cabral

  • Low-K metal proelectrolyte semiconductor structure

    Conti Richard A;Edelstein Daiel;Lee Gill Y

  • Method for forming encapsulated metal interconnect structures in semiconductor integrated circuit devices

    Soon-Chen Seo;Carlos Sambucetti;Xiaomeng Chen;Zheng Chen

  • On-chip wiring design challenges for gigahertz operation

    A. Deutsch;P.W. Coteus;G.V. Kopcsay;H.H. Smith

  • Silicon chip carrier with conductive through-vias and method for fabricating same

    Daniel Charles Edelstein;Paul Stephen Andry;Leena Paivikki Buchwalter;Jon Alfred Casey

  • Integrated circuit inductor

    Joachim Norbert Burghartz;Daniel Charles Edelstein;Christopher Vincent Jahnes;Cyprian Emeka Uzoh

  • Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates

    J.N. Burghartz;D.C. Edelstein;K.A. Jenkiin;Y.H. Kwark

  • Microelectronic structure including air gap

    Daniel C. Edelstein;David V. Horak;Elbert E. Huang;Satyanarayana V. Nitta

  • VLSI on-chip interconnection performance simulations and measurements

    D. C. Edelstein;G. A. Sai-Halasz;Y.-J. Mii

  • Apparatus and method for the electrochemical etching of a wafer

    Madhav Datta;Daniel Charles Edelstein;Cyprian Emeka Uzoh

  • High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

    S. Narasimha;K. Onishi;H. M. Nayfeh;A. Waite

  • Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill

    M. He;X. Zhang;T. Nogami;X. Lin

  • Electroplated interconnection structures on integrated circuit chips

    Panayotis Constantinou Andricacos;Harikilia Deligianni;John Owen Dukovic;Daniel C. Edelstein

  • Serial intelligent electro-chemical-mechanical wafer processor

    Cyprian E. Uzoh;Daniel C. Edelstein

  • Noble metal cap for interconnect structures

    Chih-Chao Yang;Daniel C. Edelstein;Fenton R. McFeely

  • Interconnect with titanium-oxide diffusion barrier

    Daniel C. Edelstein;Takeshi Nogami

Frequent Co-Authors

Cyprian Emeka Uzoh
Cyprian Emeka Uzoh IBM (United States)
Alfred Grill
Alfred Grill IBM (United States)
Chenming Hu
Chenming Hu University of California, Berkeley
Anthony K. Stamper
Anthony K. Stamper GlobalFoundries (United States)
Joachim N. Burghartz
Joachim N. Burghartz University of Stuttgart
Vamsi K. Paruchuri
Vamsi K. Paruchuri IBM (United States)
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
Cyril Cabral
Cyril Cabral IBM (United States)
Jeffrey P. Gambino
Jeffrey P. Gambino ON Semiconductor (United States)
Vishnubhai Vitthalbhai Patel
Vishnubhai Vitthalbhai Patel IBM (United States)

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Related Online Degrees & Career Pathways

For students pursuing studies in Electronics and Electrical Engineering, exploring related online degrees can open diverse career pathways. A bachelor's in project management is a valuable complement, equipping graduates with leadership and organizational skills essential for managing complex engineering projects.

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Additionally, careers in education and training can benefit from an online master's in instructional design. This degree focuses on innovative e-learning strategies, supporting the development of technical training programs in engineering fields.

For professionals seeking tailored learning experiences, what is a competency based masters degree explains how competency-based programs allow students to progress upon demonstrating skills mastery—ideal for those with prior industry experience.

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