The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Vamsi K. Paruchuri sits on this spectrum.
This scientist: 222 publications — 37th percentile
37% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 1,065 publications or more.
The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Vamsi K. Paruchuri sits on this spectrum.
This scientist: 38 D-Index — 30th percentile
30% of scientists in this discipline score the same or lower.
The last bar groups every scientist with 111 D-Index or more.
Vamsi K. Paruchuri is affiliated with IBM in the United States, contributing research primarily within the fields of Computer Science, Engineering, and Materials Science. Their body of work encompasses a variety of subfields, including Information Systems, Signal Processing, Computer Networks and Communications, Mechanical Engineering, and Materials Chemistry.
The scientist's research topics cover several advanced domains such as User Authentication and Security Systems, Biometric Identification and Security, Advanced Authentication Protocols Security, Metallurgical Processes and Thermodynamics, Solidification and Crystal Growth Phenomena, Aluminum Alloy Microstructure Properties, and Blockchain Technology Applications and Security.
Recent publication activity includes a paper titled "Phase field simulation of segregation and precipitates formation during steel solidification", published in 2023. This work appeared in the IOP Conference Series Materials Science and Engineering and has been cited twice. The study focuses on metallurgical processes relevant to understanding steel solidification patterns.
Vamsi K. Paruchuri has collaborated with frequent coauthors including Sriram Bobba, Begoña Santillana, Ulrich Prahl, and Ali Bakhshi. These partnerships reflect interdisciplinary efforts linking Computer Science and Engineering disciplines with applied materials research.
The scientist's publications are concentrated in venues such as the IOP Conference Series Materials Science and Engineering, underscoring engagement with materials-oriented engineering research communities. Their work bridges computational techniques and practical applications in physical sciences and security systems.
N. Loubet;T. Hook;P. Montanini;C.-W. Yeung
S. Zafar;Y.H. Kim;V. Narayanan;C. Cabral
H. Kawasaki;V. S. Basker;T. Yamashita;C.-H. Lin
Martin M. Frank;Steven J. Koester;Matthew Copel;John A. Ott
R. Xie;P. Montanini;K. Akarvardar;N. Tripathi
V. Paruchuri;S. Basavaraju;A. Durresi;R. Kannan
A. Durresi;V.K. Paruchuri;S.S. Iyengar;R. Kannan
S. Guha;S. Guha;V. K. Paruchuri;M. Copel;V. Narayanan
V. Paruchuri;A. Durresi;M. Ramesh
Nestor A. Bojarczuk;Cyril Cabral;Eduard A. Cartier;Matthew W. Copel
Nestor A. Bojarczuk;Michael P. Chudzik;Matthew W. Copel;Supratik Guha
S. Krishnan;U. Kwon;N. Moumen;M.W. Stoker
E. Cartier;F.R. McFeely;V. Narayanan;P. Jamison
M. Chudzik;B. Doris;R. Mo;J. Sleight
V. S. Basker;T. Standaert;H. Kawasaki;C.-C. Yeh
V. Narayanan;V.K. Paruchuri;N.A. Bojarczuk;B.P. Linder
F. Andrieu;O. Weber;J. Mazurier;O. Thomas
E. Cartier;B. P. Linder;V. Narayanan;V. K. Paruchuri
K. I. Seo;B. Haran;D. Gupta;D. Guo
B.S. Haran;A. Kumar;L. Adam;J. Chang
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