World's Best Scientists 2026 revealed!
Alexander Reznicek

Alexander Reznicek

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
31
Citations
5586
World Ranking
6478
National Ranking
2123

Alexander Reznicek publication distribution in Electronics and Electrical Engineering in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Electronics and Electrical Engineering in 2026. The highlighted bar marks where Alexander Reznicek sits on this spectrum.

34–53 publications: 24 scientists 54–73 publications: 52 scientists 74–93 publications: 114 scientists 94–113 publications: 203 scientists 114–133 publications: 269 scientists 134–153 publications: 355 scientists 154–173 publications: 403 scientists 174–193 publications: 445 scientists 194–213 publications: 430 scientists 214–233 publications: 431 scientists 234–253 publications: 399 scientists 254–273 publications: 366 scientists 274–293 publications: 335 scientists 294–313 publications: 300 scientists 314–333 publications: 276 scientists 334–353 publications: 250 scientists 354–373 publications: 214 scientists 374–393 publications: 187 scientists 394–413 publications: 152 scientists 414–433 publications: 169 scientists 434–453 publications: 147 scientists 454–473 publications: 111 scientists 474–493 publications: 117 scientists 494–513 publications: 103 scientists 514–533 publications: 99 scientists 534–553 publications: 92 scientists 554–573 publications: 75 scientists 574–593 publications: 58 scientists 594–613 publications: 69 scientists 614–633 publications: 50 scientists 634–653 publications: 62 scientists 654–673 publications: 54 scientists 674–693 publications: 44 scientists 694–713 publications: 37 scientists 714–733 publications: 28 scientists 734–753 publications: 26 scientists 754–773 publications: 26 scientists 774–793 publications: 19 scientists 794–813 publications: 23 scientists 814–833 publications: 20 scientists 834–853 publications: 16 scientists 854–873 publications: 20 scientists 874–893 publications: 11 scientists 894–913 publications: 11 scientists 914–933 publications: 16 scientists 934–953 publications: 13 scientists 954–973 publications: 10 scientists 974–993 publications: 11 scientists 994–1,013 publications: 9 scientists 1,014–1,033 publications: 9 scientists 1,034–1,053 publications: 10 scientists 1,054–1,064 publications: 6 scientists 1,065+ publications: 99 scientists
34 publications 1,065+

This scientist: 625 publications — 91st percentile

91% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 1,065 publications or more.

Alexander Reznicek D-index placement in Electronics and Electrical Engineering in 2026

The chart shows the D-index (discipline H-index) distribution of Electronics and Electrical Engineering scientists ranked by Research.com in 2026. The highlighted bar marks where Alexander Reznicek sits on this spectrum.

30 D-Index: 178 scientists 31 D-Index: 257 scientists 32 D-Index: 263 scientists 33 D-Index: 262 scientists 34 D-Index: 244 scientists 35 D-Index: 236 scientists 36 D-Index: 211 scientists 37 D-Index: 220 scientists 38 D-Index: 214 scientists 39 D-Index: 214 scientists 40 D-Index: 205 scientists 41 D-Index: 187 scientists 42 D-Index: 194 scientists 43 D-Index: 201 scientists 44 D-Index: 155 scientists 45 D-Index: 189 scientists 46 D-Index: 148 scientists 47 D-Index: 160 scientists 48 D-Index: 134 scientists 49 D-Index: 130 scientists 50 D-Index: 141 scientists 51 D-Index: 156 scientists 52 D-Index: 108 scientists 53 D-Index: 130 scientists 54 D-Index: 112 scientists 55 D-Index: 97 scientists 56 D-Index: 111 scientists 57 D-Index: 102 scientists 58 D-Index: 108 scientists 59 D-Index: 120 scientists 60 D-Index: 103 scientists 61 D-Index: 93 scientists 62 D-Index: 92 scientists 63 D-Index: 74 scientists 64 D-Index: 77 scientists 65 D-Index: 73 scientists 66 D-Index: 64 scientists 67 D-Index: 69 scientists 68 D-Index: 60 scientists 69 D-Index: 39 scientists 70 D-Index: 57 scientists 71 D-Index: 59 scientists 72 D-Index: 46 scientists 73 D-Index: 49 scientists 74 D-Index: 38 scientists 75 D-Index: 35 scientists 76 D-Index: 32 scientists 77 D-Index: 35 scientists 78 D-Index: 31 scientists 79 D-Index: 22 scientists 80 D-Index: 34 scientists 81 D-Index: 31 scientists 82 D-Index: 34 scientists 83 D-Index: 23 scientists 84 D-Index: 18 scientists 85 D-Index: 30 scientists 86 D-Index: 19 scientists 87 D-Index: 19 scientists 88 D-Index: 20 scientists 89 D-Index: 8 scientists 90 D-Index: 17 scientists 91 D-Index: 7 scientists 92 D-Index: 14 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 12 scientists 97 D-Index: 10 scientists 98 D-Index: 10 scientists 99 D-Index: 12 scientists 100 D-Index: 16 scientists 101 D-Index: 5 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 8 scientists 105 D-Index: 9 scientists 106 D-Index: 13 scientists 107 D-Index: 4 scientists 108 D-Index: 5 scientists 109 D-Index: 10 scientists 110 D-Index: 8 scientists 111+ D-Index: 96 scientists
30 D-Index 111+

This scientist: 31 D-Index — 6th percentile

6% of scientists in this discipline score the same or lower.

The last bar groups every scientist with 111 D-Index or more.

Overview

Alexander Reznicek is affiliated with IBM in the United States, where their research focuses on engineering, particularly within electrical and electronic engineering. Their work encompasses advanced topics in semiconductor technology and device physics, with a concentration on ferroelectric and negative capacitance devices, semiconductor materials and devices, as well as advanced memory and neural computing.

Reznicek's publication record includes contributions to the 2021 IEEE International Electron Devices Meeting (IEDM), which is a notable venue in the field of electronic device research. One highlighted paper authored by their frequent coauthor H. Wu is titled "First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications", published in 2021 at the IEEE International Electron Devices Meeting. This paper has accrued a number of citations, indicating engagement from the research community.

Their network of frequent coauthors includes:

  • H. Wu
  • Veenadhar Katragadda
  • Eric R. Evarts
  • Eric R. J. Edwards
  • Richard G. Southwick

Reznicek's main fields of study integrate both broad engineering concepts and specialized areas, with their work emphasizing Electrical and Electronic Engineering. Substantive research topics they have addressed are:

  • Ferroelectric and Negative Capacitance Devices
  • Semiconductor materials and devices
  • Advanced Memory and Neural Computing

These topics suggest a focus on the development and experimental validation of innovative device architectures and materials that could impact future computing and memory technologies. The MRAM (Magnetoresistive Random-Access Memory) data scrubbing work exemplifies such experimental studies that align with cutting-edge semiconductor memory research.

Best Publications

  • Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applications

    K. Cheng;A. Khakifirooz;P. Kulkarni;S. Ponoth

  • CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding

    Meikei Ieong;Alexander Reznicek;Min Yang

  • Method for manufacturing strain silicon mixing underlay and silicon mixing underlay

    Meikei Ieong;Shreesh Narasimha;Alexander Reznicek;Kern Rim

  • High performance extremely thin SOI (ETSOI) hybrid CMOS with Si channel NFET and strained SiGe channel PFET

    K. Cheng;A. Khakifirooz;N. Loubet;S. Luning

  • Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors

    Stephen W. Bedell;Joel P. Desouza;Zhibin Ren;Alexander Reznicek

  • Finfet structures having silicon germanium and silicon fins

    Kangguo Cheng;Bruce B. Doris;Ali Khakifirooz;Alexander Reznicek

  • High acceptor level doping in silicon germanium

    Mona Abdulkhaleg Ebrish;Oleg Gluschenkov;Shogo Mochizuki;Alexander Reznicek

  • Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates

    Tze-Chiang Chen;Guy M. Cohen;Alexander Reznicek;Devendra K. Sadana

  • Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond

    Q. Liu;A. Yagishita;N. Loubet;A. Khakifirooz

  • Nanowire transistor structures with merged source/drain regions using auxiliary pillars

    Pouya Hashemi;Ali Khakifirooz;Alexander Reznicek

  • Sub-25nm FinFET with advanced fin formation and short channel effect engineering

    T. Yamashita;V. S. Basker;T. Standaert;C.-C. Yeh

  • Semiconductor-dielectric-semiconductor device structure fabricated by wafer bonding

    Martin Frank;Alexander Reznicek;Evgeni Gousev;Eduard Cartier

  • Amorphization/templated recrystallization method for changing the orientation of single-crystal silicon: An alternative approach to hybrid orientation substrates

    K. L. Saenger;J. P. de Souza;K. E. Fogel;J. A. Ott

  • Fully depleted extremely thin SOI technology fabricated by a novel integration scheme featuring implant-free, zero-silicon-loss, and faceted raised source/drain

    K. Cheng;A. Khakifirooz;P. Kulkarni;S. Kanakasabapathy

  • Nano-sheet transistors with different threshold voltages

    Karthik Balakrishnan;Kangguo Cheng;Pouya Hashemi;Alexander Reznicek

  • Method of forming integrated semiconductor structure

    Alexander Reznicek

  • High density bulk fin capacitor

    Ali Khakifirooz;Thomas N. Adam;Kangguo Cheng;Alexander Reznicek

  • Dual work function integration for stacked FinFET

    Kangguo Cheng;Pouya Hashemi;Ali Khakifirooz;Alexander Reznicek

  • Semiconductor device including embedded crystalline back-gate bias planes, related design structure and method of fabrication

    Thomas N. Adam;Kangguo Cheng;Ali Khakifirooz;Alexander Reznicek

  • Bulk finfet with controlled fin height and high-k liner

    Alexander Reznicek;Thomas N. Adam;Kangguo Cheng;Ali Khakifirooz

Frequent Co-Authors

Kangguo Cheng
Kangguo Cheng IBM (United States)
Ali Khakifirooz
Ali Khakifirooz Intel (United States)
Bruce B. Doris
Bruce B. Doris IBM (United States)
Devendra K. Sadana
Devendra K. Sadana IBM (United States)
Stephen W. Bedell
Stephen W. Bedell IBM (United States)
Ghavam G. Shahidi
Ghavam G. Shahidi IBM (United States)
Dominic J. Schepis
Dominic J. Schepis Global Foundries
Tak H. Ning
Tak H. Ning IBM (United States)
Vamsi K. Paruchuri
Vamsi K. Paruchuri IBM (United States)
Min Yang
Min Yang Sterne, Kessler, Goldstein & Fox

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