World's Best Scientists 2026 revealed!
Alexander Reznicek

Alexander Reznicek

D-Index & Metrics

Electronics and Electrical Engineering

D-Index
31
Citations
5586
World Ranking
6479
National Ranking
2122

Overview

Alexander Reznicek is affiliated with IBM in the United States, where their research focuses on engineering, particularly within electrical and electronic engineering. Their work encompasses advanced topics in semiconductor technology and device physics, with a concentration on ferroelectric and negative capacitance devices, semiconductor materials and devices, as well as advanced memory and neural computing.

Reznicek's publication record includes contributions to the 2021 IEEE International Electron Devices Meeting (IEDM), which is a notable venue in the field of electronic device research. One highlighted paper authored by their frequent coauthor H. Wu is titled "First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications", published in 2021 at the IEEE International Electron Devices Meeting. This paper has accrued a number of citations, indicating engagement from the research community.

Their network of frequent coauthors includes:

  • H. Wu
  • Veenadhar Katragadda
  • Eric R. Evarts
  • Eric R. J. Edwards
  • Richard G. Southwick

Reznicek's main fields of study integrate both broad engineering concepts and specialized areas, with their work emphasizing Electrical and Electronic Engineering. Substantive research topics they have addressed are:

  • Ferroelectric and Negative Capacitance Devices
  • Semiconductor materials and devices
  • Advanced Memory and Neural Computing

These topics suggest a focus on the development and experimental validation of innovative device architectures and materials that could impact future computing and memory technologies. The MRAM (Magnetoresistive Random-Access Memory) data scrubbing work exemplifies such experimental studies that align with cutting-edge semiconductor memory research.

Best Publications

  • Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applications

    K. Cheng;A. Khakifirooz;P. Kulkarni;S. Ponoth

  • CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding

    Meikei Ieong;Alexander Reznicek;Min Yang

  • Method for manufacturing strain silicon mixing underlay and silicon mixing underlay

    Meikei Ieong;Shreesh Narasimha;Alexander Reznicek;Kern Rim

  • High performance extremely thin SOI (ETSOI) hybrid CMOS with Si channel NFET and strained SiGe channel PFET

    K. Cheng;A. Khakifirooz;N. Loubet;S. Luning

  • Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors

    Stephen W. Bedell;Joel P. Desouza;Zhibin Ren;Alexander Reznicek

  • Finfet structures having silicon germanium and silicon fins

    Kangguo Cheng;Bruce B. Doris;Ali Khakifirooz;Alexander Reznicek

  • High acceptor level doping in silicon germanium

    Mona Abdulkhaleg Ebrish;Oleg Gluschenkov;Shogo Mochizuki;Alexander Reznicek

  • Method for fabricating SiGe-on-insulator (SGOI) and Ge-on-insulator (GOI) substrates

    Tze-Chiang Chen;Guy M. Cohen;Alexander Reznicek;Devendra K. Sadana

  • Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond

    Q. Liu;A. Yagishita;N. Loubet;A. Khakifirooz

  • Nanowire transistor structures with merged source/drain regions using auxiliary pillars

    Pouya Hashemi;Ali Khakifirooz;Alexander Reznicek

  • Sub-25nm FinFET with advanced fin formation and short channel effect engineering

    T. Yamashita;V. S. Basker;T. Standaert;C.-C. Yeh

  • Semiconductor-dielectric-semiconductor device structure fabricated by wafer bonding

    Martin Frank;Alexander Reznicek;Evgeni Gousev;Eduard Cartier

  • Amorphization/templated recrystallization method for changing the orientation of single-crystal silicon: An alternative approach to hybrid orientation substrates

    K. L. Saenger;J. P. de Souza;K. E. Fogel;J. A. Ott

  • Fully depleted extremely thin SOI technology fabricated by a novel integration scheme featuring implant-free, zero-silicon-loss, and faceted raised source/drain

    K. Cheng;A. Khakifirooz;P. Kulkarni;S. Kanakasabapathy

  • Nano-sheet transistors with different threshold voltages

    Karthik Balakrishnan;Kangguo Cheng;Pouya Hashemi;Alexander Reznicek

  • Method of forming integrated semiconductor structure

    Alexander Reznicek

  • High density bulk fin capacitor

    Ali Khakifirooz;Thomas N. Adam;Kangguo Cheng;Alexander Reznicek

  • Dual work function integration for stacked FinFET

    Kangguo Cheng;Pouya Hashemi;Ali Khakifirooz;Alexander Reznicek

  • Semiconductor device including embedded crystalline back-gate bias planes, related design structure and method of fabrication

    Thomas N. Adam;Kangguo Cheng;Ali Khakifirooz;Alexander Reznicek

  • Bulk finfet with controlled fin height and high-k liner

    Alexander Reznicek;Thomas N. Adam;Kangguo Cheng;Ali Khakifirooz

Frequent Co-Authors

Kangguo Cheng
Kangguo Cheng IBM (United States)
Ali Khakifirooz
Ali Khakifirooz Intel (United States)
Bruce B. Doris
Bruce B. Doris IBM (United States)
Devendra K. Sadana
Devendra K. Sadana IBM (United States)
Stephen W. Bedell
Stephen W. Bedell IBM (United States)
Ghavam G. Shahidi
Ghavam G. Shahidi IBM (United States)
Dominic J. Schepis
Dominic J. Schepis Global Foundries
Tak H. Ning
Tak H. Ning IBM (United States)
Vamsi K. Paruchuri
Vamsi K. Paruchuri IBM (United States)
Min Yang
Min Yang Sterne, Kessler, Goldstein & Fox

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

For those pursuing Electronics and Electrical Engineering in the USA, exploring flexible educational options can be a game changer. Many students benefit from competency based universities that allow learners to progress at their own pace by demonstrating skills, rather than following traditional time-based schedules.

Military families often face unique challenges, which makes finding military spouse friendly online colleges essential. These institutions offer tailored support, flexible timelines, and resources to accommodate frequent relocations and other demands.

If you require more flexible enrollment options, consider online programs with online colleges with frequent start dates. Starting courses weekly empowers students to begin their studies without waiting for traditional semester cycles, making it easier to balance education with personal commitments.

Additionally, short-term training can accelerate career entry or specialization. Explore 6 month programs that provide focused certifications and practical skills, often leading to well-paying roles in the engineering field.

Best Scientists Citing Alexander Reznicek

Trending Scientists

Recently Published Articles