2014 - IEEE Fellow For contributions to the characterization of silicon-on-insulator RF MOSFETs and MEMS devices
His main research concerns Optoelectronics, Silicon on insulator, MOSFET, Electrical engineering and Electronic engineering. His research integrates issues of Layer, Substrate and Transistor in his study of Optoelectronics. Jean-Pierre Raskin has researched Silicon on insulator in several fields, including Coplanar waveguide, Doping, Substrate coupling, Microheater and CMOS.
His MOSFET research is multidisciplinary, incorporating perspectives in Gate length, Capacitance, Function and Oscillation. In his study, which falls under the umbrella issue of Electrical engineering, Micropower, Soi cmos, Wireless, Thermistor and Wireless sensor network is strongly linked to Microsystem. His study in Electronic engineering is interdisciplinary in nature, drawing from both AND gate, Equivalent circuit, Electrical impedance and Communication channel.
Optoelectronics, Silicon on insulator, Electrical engineering, MOSFET and Electronic engineering are his primary areas of study. The various areas that Jean-Pierre Raskin examines in his Optoelectronics study include Layer, Substrate and Radio frequency. His Silicon on insulator research is multidisciplinary, incorporating elements of Characterization, Nanotechnology, Microelectromechanical systems, Integrated circuit and Transistor.
His Microelectromechanical systems research includes themes of Microsystem, Thin film and Composite material. His Electrical engineering study incorporates themes from Figure of merit and Engineering physics. The MOSFET study combines topics in areas such as Transconductance, Capacitance, Equivalent circuit, Logic gate and Cutoff frequency.
His primary scientific interests are in Optoelectronics, Silicon on insulator, Nanotechnology, Graphene and Composite material. His work carried out in the field of Optoelectronics brings together such families of science as Transistor and Substrate. He usually deals with Silicon on insulator and limits it to topics linked to Electrical engineering and Electronic engineering.
His Nanotechnology study combines topics in areas such as Molecularly imprinted polymer and Formaldehyde. Jean-Pierre Raskin interconnects Thin film and Amorphous metal in the investigation of issues within Composite material. His studies in MOSFET integrate themes in fields like Cutoff frequency and Capacitance.
This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.
Substrate crosstalk reduction using SOI technology
J.-P. Raskin;A. Viviani;D. Flandre;J.-P. Colinge.
IEEE Transactions on Electron Devices (1997)
Influence of device engineering on the analog and RF performances of SOI MOSFETs
V. Kilchytska;A. Neve;L. Vancaillie;D. Levacq.
IEEE Transactions on Electron Devices (2003)
New substrate passivation method dedicated to HR SOI wafer fabrication with increased substrate resistivity
D. Lederer;J.-P. Raskin.
IEEE Electron Device Letters (2005)
Low Temperature Implementation of Dopant-Segregated Band-edge Metallic S/D junctions in Thin-Body SOI p-MOSFETs
G. Larrieu;E. Dubois;R. Valentin;N. Breil.
international electron devices meeting (2007)
Fabrication method of so1 semiconductor devices
Denis Fladre;Amaury De Mevergnies;Jean-Pierre Raskins.
Raman and XPS characterization of vanadium oxide thin films with temperature
Ferran Ureña-Begara;Aurelian Crunteanu;Jean-Pierre Raskin.
Applied Surface Science (2017)
Identification of RF Harmonic Distortion on Si Substrates and its Reduction Using a Trap-Rich Layer
Daniel C. Kerr;Joseph M. Gering;Thomas G. McKay;Michael S. Carroll.
topical meeting on silicon monolithic integrated circuits in rf systems (2008)
Substrate loss mechanisms for microstrip and CPW transmission lines on lossy silicon wafers
Dimitri Lederer;Jean-Pierre Raskin.
Solid-state Electronics (2003)
A 94-GHz aperture-coupled micromachined microstrip antenna
G.P. Gauthier;J.-P. Raskin;L.P.B. Katehi;G.M. Rebeiz.
IEEE Transactions on Antennas and Propagation (1999)
Low-temperature wafer bonding: a study of void formation and influence on bonding strength
Xuan Xiong Zhang;J.-P. Raskin.
IEEE/ASME Journal of Microelectromechanical Systems (2005)
If you think any of the details on this page are incorrect, let us know.
We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below: