Karen Maex

Overview

Best Publications

• Low dielectric constant materials for microelectronics

  K. Maex;M. R. Baklanov;D. Shamiryan;F. lacopi

  2031
  Citations

• Read Stability and Write-Ability Analysis of SRAM Cells for Nanometer Technologies

  E. Grossar;M. Stucchi;K. Maex;W. Dehaene

  596
  Citations

• Low-k dielectric materials

  Denis Shamiryan;Thomas Abell;Francesca Iacopi;Karen Maex

  500
  Citations

• Tunnel field-effect transistor without gate-drain overlap

  Anne S. Verhulst;William G. Vandenberghe;Karen Maex;Guido Groeseneken

  497
  Citations

• The reasons why metals catalyze the nucleation and growth of carbon nanotubes and other carbon nanomorphologies

  Santiago Esconjauregui;Caroline M. Whelan;Karen Maex

  315
  Citations

• Silicides for integrated circuits: TiSi2 CoSi2

  Karen Maex

  312
  Citations

• Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

  W. Wu;S. H. Brongersma;M. Van Hove;K. Maex

  301
  Citations

• Influence of the electron mean free path on the resistivity of thin metal films

  W. Zhang;S. H. Brongersma;O. Richard;B. Brijs

  281
  Citations

• Dielectric Films for Advanced Microelectronics

  Mikhail Baklanov;Karen Maex

  253
  Citations

• Self-annealing characterization of electroplated copper films

  S. Lagrange;S. H. Brongersma;M. Judelewicz;A. Saerens

  218
  Citations

• Complementary Silicon-Based Heterostructure Tunnel-FETs With High Tunnel Rates

  A.S. Verhulst;W.G. Vandenberghe;K. Maex;S. De Gendt

  217
  Citations

• Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

  Denis Shamiryan;Mikhaïl Baklanov;Serge Vanhaelemeersch;Karen Maex

  197
  Citations

• Boosting the on-current of a n-channel nanowire tunnel field-effect transistor by source material optimization

  Anne S. Verhulst;William G. Vandenberghe;Karen Maex;Guido Groeseneken

  196
  Citations

• Materials aspects, electrical performance, and scalability of Ni silicide towards sub-0.13 μm technologies

  Anne Lauwers;An Steegen;Muriel de Potter;Richard Lindsay

  195
  Citations

• Porous low dielectric constant materials for microelectronics

  Mikhail R Baklanov;Karen Maex

  177
  Citations

• Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation

  F Iacopi;Y Travaly;B Eyckens;C Waldfried

  156
  Citations

• Ni- and Co-based silicides for advanced CMOS applications

  J. A. Kittl;A. Lauwers;O. Chamirian;M. Van Dal

  155
  Citations

• Grain Growth, Stress, and Impurities in Electroplated Copper

  Sywert Brongersma;Emma Kerr;Iwan Vervoort;Annelies Saerens

  153
  Citations

• High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene

  S. Jenei;S. Decoutere;G. Winderickx;H. Struyf

  148
  Citations

• Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

  Caroline M. Whelan;Michael Kinsella;Laureen Carbonell;Hong Meng Ho

  147
  Citations