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Hugo Bender

Hugo Bender

D-Index & Metrics

Materials Science

D-Index
60
Citations
13788
World Ranking
7009
National Ranking
75

Overview

Hugo Bender is affiliated with Imec in Belgium and has contributed significantly to the fields of Engineering, Materials Science, and Physics and Astronomy. Their research spans across subfields such as Electrical and Electronic Engineering, Atomic and Molecular Physics and Optics, Materials Chemistry, Biomedical Engineering, and Surfaces, Coatings and Films.

Bender's research portfolio includes multiple publications on topics related to semiconductor materials and devices, integrated circuits and semiconductor failure analysis, electron and X-ray spectroscopy techniques, MXene and MAX phase materials, advancements in semiconductor devices and circuit design, nanowire synthesis and applications, as well as force microscopy techniques and applications.

Frequent coauthors in Bender's research include:

  • Paola Favia
  • Johan Verbeeck
  • Viveksharma Prabhakara
  • Wilfried Vandervorst
  • Eddy Simoen

The research outputs have appeared in frequent publication venues such as:

  • ECS Journal of Solid State Science and Technology
  • Zenodo (CERN European Organization for Nuclear Research)
  • The Journal of Physical Chemistry C
  • Nanotechnology
  • Nanomaterials

Notable recent papers authored or coauthored by Bender include:

  • Grain-Boundary-Induced Strain and Distortion in Epitaxial Bilayer MoS2 Lattice (2020), The Journal of Physical Chemistry C
  • Unravelling stacking order in epitaxial bilayer MX2 using 4D-STEM with unsupervised learning (2020), Nanotechnology
  • Ferroelectricity in Si-Doped Hafnia: Probing Challenges in Absence of Screening Charges (2020), Nanomaterials
  • Atomic-scale investigations on the wet etching kinetics of GeversusSiGe in acidic H2O2 solutions: a postoperando synchrotron XPS analysis (2020), Journal of Materials Chemistry C
  • Electrical Activity of Extended Defects in Relaxed InxGa1−xAs Hetero-Epitaxial Layers (2020), ECS Journal of Solid State Science and Technology

Best Publications

  • 10×10nm 2 Hf/HfO x crossbar resistive RAM with excellent performance, reliability and low-energy operation

    B. Govoreanu;G.S. Kar;Y-Y. Chen;V. Paraschiv

  • Three-dimensional observation of the conductive filament in nanoscaled resistive memory devices.

    Umberto Celano;Ludovic Goux;Attilio Belmonte;Karl Opsomer

  • High-k dielectrics for future generation memory devices (Invited Paper)

    J. A. Kittl;K. Opsomer;M. Popovici;N. Menou

  • Nanometer-scale magnetic MnAs particles in GaAs grown by molecular beam epitaxy

    J. De Boeck;R. Oesterholt;A. Van Esch;H. Bender

  • Undoped and in-situ B doped GeSn epitaxial growth on Ge by atmospheric pressure-chemical vapor deposition

    Benjamin Vincent;Federica Gencarelli;Hugo Bender;Clement Merckling

  • Crystalline Properties and Strain Relaxation Mechanism of CVD Grown GeSn

    F. Gencarelli;B. Vincent;J. Demeulemeester;A. Vantomme

  • Direct mapping of strain in a strained silicon transistor by high-resolution electron microscopy.

    Florian Hüe;Martin Hÿtch;Hugo Bender;Florent Houdellier

  • Modulation of the Ni FUSI workfunction by Yb doping: from midgap to n-type band-edge

    H.Y. Yu;J.D. Chen;M.F. Li;S.J. Lee

  • Gate-all-around MOSFETs based on vertically stacked horizontal Si nanowires in a replacement metal gate process on bulk Si substrates

    H. Mertens;R. Ritzenthaler;A. Hikavyy;M. S. Kim

  • Island growth in the atomic layer deposition of zirconium oxide and aluminum oxide on hydrogen-terminated silicon: Growth mode modeling and transmission electron microscopy

    Riikka L. Puurunen;Wilfried Vandervorst;Wim F. A. Besling;Olivier Richard

  • Imaging the Three-Dimensional Conductive Channel in Filamentary-Based Oxide Resistive Switching Memory

    Umberto Celano;Ludovic Goux;Robin Degraeve;Andrea Fantini

  • Ternary rare-earth metal oxide high-k layers on silicon oxide

    C Zhao;T Witters;B Brijs;H Bender

  • Materials aspects, electrical performance, and scalability of Ni silicide towards sub-0.13 μm technologies

    Anne Lauwers;An Steegen;Muriel de Potter;Richard Lindsay

  • Experimental determination of the maximum post-process annealing temperature for standard CMOS wafers

    S. Sedky;A. Witvrouw;H. Bender;K. Baert

  • Vertically stacked gate-all-around Si nanowire CMOS transistors with dual work function metal gates

    H. Mertens;R. Ritzenthaler;A. Chasin;T. Schram

  • Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal

    Ann Witvrouw;Bert Du Bois;Piet De Moor;Agnes Verbist

  • AlGaN/GaN/AlGaN Double Heterostructures Grown on 200 mm Silicon (111) Substrates with High Electron Mobility

    Kai Cheng;Hu Liang;Marleen Van Hove;Karen Geens

  • Site Selective Integration of III–V Materials on Si for Nanoscale Logic and Photonic Devices

    Mohanchand Paladugu;Clement Merckling;Roger Loo;Olivier Richard

  • In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines

    V. Teodorescu;L. Nistor;H. Bender;A. Steegen

  • TWO-STEP ROOM TEMPERATURE GRAIN GROWTH IN ELECTROPLATED COPPER

    Sywert Brongersma;Emmanuel Richard;Iwan Vervoort;Hugo Bender

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