World's Best Scientists 2026 revealed!
Cyprian Emeka Uzoh

Cyprian Emeka Uzoh

Overview

Cyprian Emeka Uzoh is affiliated with IBM (United States) and conducts research primarily in the field of Engineering. Their work focuses on subfields such as Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Industrial and Manufacturing Engineering, Hardware and Architecture, and Surgery. Key research topics include 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Manufacturing Process and Optimization, VLSI and Analog Circuit Testing, Orthopaedic implants and arthroplasty, and Injection Molding Process and Properties.

Uzoh has contributed to research published in several venues, with frequent publications in the following:

  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IMAPSource Proceedings

Recent papers authored or co-authored by Uzoh include:

  • The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Hybrid Bond Interconnect and Advanced Packaging Solutions, 2023, IMAPSource Proceedings
  • Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration, 2024, IMAPSource Proceedings

The scientist frequently collaborates with several co-authors, including:

  • Laura Mirkarimi
  • Dominik Suwito
  • G. G. Fountain
  • Thomas Workman
  • Jeremy Theil

Best Publications

  • Damascene Copper electroplating for chip interconnections

    P. C. Andricacos;C. Uzoh;J. O. Dukovic;J. Horkans

  • Full copper wiring in a sub-0.25 /spl mu/m CMOS ULSI technology

    D. Edelstein;J. Heidenreich;R. Goldblatt;W. Cote

  • Method of forming an integrated circuit toroidal inductor

    Burghartz Joachim Norbert;Edelstein Daniel Charles;Jahnes Christopher Vincent;Uzoh Cyprian Emeka

  • Semiconductor structure having recess with conductive metal

    Cyprian Emeka Uzoh;Stephen Edward Greco

  • Method of electrochemical mechanical planarization

    Cyprian Emeka Uzoh;James Mckell Edwin Harper

  • Cobalt-tin alloys and their applications for devices, chip interconnections and packaging

    Vlasta A. Brusic;Jeffrey Robert Marino;Eugene John O'Sullivan;Carlos Juan Sambucetti

  • Electroetch and chemical mechanical polishing equipment

    Cyprian E. Uzoh

  • Method and apparatus for planarizing workpiece

    Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー

  • Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries

    Cyprian E. Uzoh

  • Electroplating workpiece fixture having liquid gap spacer

    Cyprian Emeka Uzoh

  • Open-bottomed via liner structure and method for fabricating same

    Andrew H. Simon;Cyprian E. Uzoh

  • Integrated circuit inductor

    Joachim Norbert Burghartz;Daniel Charles Edelstein;Christopher Vincent Jahnes;Cyprian Emeka Uzoh

  • Apparatus and method for the electrochemical etching of a wafer

    Madhav Datta;Daniel Charles Edelstein;Cyprian Emeka Uzoh

  • THIN-FILM METAL BARRIER LAYER FOR ELECTRICAL INTERCONNECTION

    Cabral Cyril;Dehaven Patrick William;Edelstein Daniel Charles;Klaus David Peter

  • Electroplated interconnection structures on integrated circuit chips

    Panayotis Constantinou Andricacos;Harikilia Deligianni;John Owen Dukovic;Daniel C. Edelstein

  • Serial intelligent electro-chemical-mechanical wafer processor

    Cyprian E. Uzoh;Daniel C. Edelstein

  • Triple damascence tungsten-copper interconnect structure

    Cyprian E. Uzoh

  • Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal

    Cyprian Emeka Uzoh;Wilma Jean Horkans;Panayotis Constantinou Andricacos

  • Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates

    J.N. Burghartz;D.C. Edelstein;K.A. Jenkins;C. Jahnes

  • A high performance liner for copper damascene interconnects

    D. Edelstein;C. Uzoh;C. Cabral;P. DeHaven

Frequent Co-Authors

Daniel C. Edelstein
Daniel C. Edelstein IBM (United States)
James Mckell Edwin Harper
James Mckell Edwin Harper IBM (United States)
Scott K. Reynolds
Scott K. Reynolds IBM (United States)
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
Joachim N. Burghartz
Joachim N. Burghartz University of Stuttgart
Cyril Cabral
Cyril Cabral IBM (United States)
Chenming Hu
Chenming Hu University of California, Berkeley
Stephen M. Rossnagel
Stephen M. Rossnagel IBM (United States)

If you think any of the details on this page are incorrect, let us know.

Report an issue

We appreciate your kind effort to assist us to improve this page, it would be helpful providing us with as much detail as possible in the text box below:

Related Online Degrees & Career Pathways

Studying Engineering and Technology in the USA opens doors to many interdisciplinary career paths. If you’re looking to widen your expertise or pursue management roles, there are several online degrees that complement technical backgrounds.

For those interested in the financial side of tech industries, a bookkeeping certification can provide essential skills in managing finances, budgets, and project costs. Administrative skills are also valued in tech organizations – an office administration associate's degree is an efficient way to build practical knowledge in operations and office management.

For those aspiring to lead teams or manage engineering projects, a business administration online degree offers a strong foundation in management, entrepreneurship, and strategic thinking. To unlock executive leadership roles or move up the career ladder, an online master's in organizational leadership can develop your expertise in leading organizations through change and innovation.

Exploring these online programs can provide technical professionals with a competitive edge, flexibility in career options, and greater advancement opportunities in today's evolving tech-driven landscape.

Best Scientists Citing Cyprian Emeka Uzoh

Trending Scientists

Recently Published Articles