World's Best Scientists 2026 revealed!
Cyprian Emeka Uzoh

Cyprian Emeka Uzoh

Cyprian Emeka Uzoh publication distribution in Engineering and Technology in 2026

The chart shows the distribution of publications by all Research.com ranked scientists in the field of Engineering and Technology in 2026. The highlighted bar marks where Cyprian Emeka Uzoh sits on this spectrum.

38–47 publications: 20 scientists 48–57 publications: 35 scientists 58–67 publications: 96 scientists 68–77 publications: 135 scientists 78–87 publications: 190 scientists 88–97 publications: 259 scientists 98–107 publications: 283 scientists 108–117 publications: 369 scientists 118–127 publications: 341 scientists 128–137 publications: 386 scientists 138–147 publications: 372 scientists 148–157 publications: 457 scientists 158–167 publications: 415 scientists 168–177 publications: 407 scientists 178–187 publications: 421 scientists 188–197 publications: 378 scientists 198–207 publications: 403 scientists 208–217 publications: 317 scientists 218–227 publications: 346 scientists 228–237 publications: 321 scientists 238–247 publications: 260 scientists 248–257 publications: 280 scientists 258–267 publications: 240 scientists 268–277 publications: 214 scientists 278–287 publications: 242 scientists 288–297 publications: 203 scientists 298–307 publications: 166 scientists 308–317 publications: 154 scientists 318–327 publications: 175 scientists 328–337 publications: 159 scientists 338–347 publications: 99 scientists 348–357 publications: 131 scientists 358–367 publications: 106 scientists 368–377 publications: 118 scientists 378–387 publications: 97 scientists 388–397 publications: 108 scientists 398–407 publications: 82 scientists 408–417 publications: 71 scientists 418–427 publications: 64 scientists 428–437 publications: 55 scientists 438–447 publications: 54 scientists 448–457 publications: 60 scientists 458–467 publications: 47 scientists 468–477 publications: 40 scientists 478–487 publications: 30 scientists 488–497 publications: 29 scientists 498–507 publications: 38 scientists 508–517 publications: 40 scientists 518–527 publications: 32 scientists 528–537 publications: 23 scientists 538–547 publications: 28 scientists 548–557 publications: 23 scientists 558–567 publications: 19 scientists 568–577 publications: 16 scientists 578–587 publications: 17 scientists 588–597 publications: 18 scientists 598–607 publications: 22 scientists 608–617 publications: 15 scientists 618–627 publications: 9 scientists 628–637 publications: 11 scientists 638–647 publications: 21 scientists 648–657 publications: 12 scientists 658–667 publications: 9 scientists 668–677 publications: 11 scientists 678–687 publications: 9 scientists 688–697 publications: 6 scientists 698–707 publications: 14 scientists 708–717 publications: 7 scientists 718–727 publications: 8 scientists 728–737 publications: 10 scientists 738–747 publications: 9 scientists 748–757 publications: 5 scientists 758–767 publications: 5 scientists 768–777 publications: 11 scientists 778–787 publications: 7 scientists 788–797 publications: 2 scientists 798–803 publications: 4 scientists 804+ publications: 100 scientists
38 publications 804+

The last bar groups every scientist with 804 publications or more.

Cyprian Emeka Uzoh D-index placement in Engineering and Technology in 2026

The chart shows the D-index (discipline H-index) distribution of Engineering and Technology scientists ranked by Research.com in 2026. The highlighted bar marks where Cyprian Emeka Uzoh sits on this spectrum.

30 D-Index: 59 scientists 31 D-Index: 114 scientists 32 D-Index: 129 scientists 33 D-Index: 189 scientists 34 D-Index: 200 scientists 35 D-Index: 262 scientists 36 D-Index: 311 scientists 37 D-Index: 312 scientists 38 D-Index: 350 scientists 39 D-Index: 385 scientists 40 D-Index: 348 scientists 41 D-Index: 362 scientists 42 D-Index: 426 scientists 43 D-Index: 380 scientists 44 D-Index: 310 scientists 45 D-Index: 341 scientists 46 D-Index: 301 scientists 47 D-Index: 306 scientists 48 D-Index: 271 scientists 49 D-Index: 246 scientists 50 D-Index: 210 scientists 51 D-Index: 253 scientists 52 D-Index: 213 scientists 53 D-Index: 221 scientists 54 D-Index: 195 scientists 55 D-Index: 186 scientists 56 D-Index: 170 scientists 57 D-Index: 167 scientists 58 D-Index: 166 scientists 59 D-Index: 144 scientists 60 D-Index: 152 scientists 61 D-Index: 141 scientists 62 D-Index: 138 scientists 63 D-Index: 131 scientists 64 D-Index: 118 scientists 65 D-Index: 114 scientists 66 D-Index: 119 scientists 67 D-Index: 95 scientists 68 D-Index: 87 scientists 69 D-Index: 77 scientists 70 D-Index: 89 scientists 71 D-Index: 69 scientists 72 D-Index: 54 scientists 73 D-Index: 46 scientists 74 D-Index: 55 scientists 75 D-Index: 54 scientists 76 D-Index: 49 scientists 77 D-Index: 53 scientists 78 D-Index: 46 scientists 79 D-Index: 28 scientists 80 D-Index: 39 scientists 81 D-Index: 36 scientists 82 D-Index: 24 scientists 83 D-Index: 26 scientists 84 D-Index: 36 scientists 85 D-Index: 18 scientists 86 D-Index: 25 scientists 87 D-Index: 19 scientists 88 D-Index: 26 scientists 89 D-Index: 27 scientists 90 D-Index: 23 scientists 91 D-Index: 15 scientists 92 D-Index: 12 scientists 93 D-Index: 9 scientists 94 D-Index: 15 scientists 95 D-Index: 10 scientists 96 D-Index: 13 scientists 97 D-Index: 13 scientists 98 D-Index: 9 scientists 99 D-Index: 7 scientists 100 D-Index: 7 scientists 101 D-Index: 8 scientists 102 D-Index: 7 scientists 103 D-Index: 7 scientists 104 D-Index: 9 scientists 105 D-Index: 6 scientists 106 D-Index: 9 scientists 107+ D-Index: 99 scientists
30 D-Index 107+

The last bar groups every scientist with 107 D-Index or more.

Overview

Cyprian Emeka Uzoh is affiliated with IBM (United States) and conducts research primarily in the field of Engineering. Their work focuses on subfields such as Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Industrial and Manufacturing Engineering, Hardware and Architecture, and Surgery. Key research topics include 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Manufacturing Process and Optimization, VLSI and Analog Circuit Testing, Orthopaedic implants and arthroplasty, and Injection Molding Process and Properties.

Uzoh has contributed to research published in several venues, with frequent publications in the following:

  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • IMAPSource Proceedings

Recent papers authored or co-authored by Uzoh include:

  • The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
  • Hybrid Bond Interconnect and Advanced Packaging Solutions, 2023, IMAPSource Proceedings
  • Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration, 2024, IMAPSource Proceedings

The scientist frequently collaborates with several co-authors, including:

  • Laura Mirkarimi
  • Dominik Suwito
  • G. G. Fountain
  • Thomas Workman
  • Jeremy Theil

Best Publications

  • Damascene Copper electroplating for chip interconnections

    P. C. Andricacos;C. Uzoh;J. O. Dukovic;J. Horkans

  • Full copper wiring in a sub-0.25 /spl mu/m CMOS ULSI technology

    D. Edelstein;J. Heidenreich;R. Goldblatt;W. Cote

  • Method of forming an integrated circuit toroidal inductor

    Burghartz Joachim Norbert;Edelstein Daniel Charles;Jahnes Christopher Vincent;Uzoh Cyprian Emeka

  • Semiconductor structure having recess with conductive metal

    Cyprian Emeka Uzoh;Stephen Edward Greco

  • Method of electrochemical mechanical planarization

    Cyprian Emeka Uzoh;James Mckell Edwin Harper

  • Cobalt-tin alloys and their applications for devices, chip interconnections and packaging

    Vlasta A. Brusic;Jeffrey Robert Marino;Eugene John O'Sullivan;Carlos Juan Sambucetti

  • Electroetch and chemical mechanical polishing equipment

    Cyprian E. Uzoh

  • Method and apparatus for planarizing workpiece

    Mackail Edwin Harper James;Emeka Uzoo Saipryan;サイプライアン・エメカ・ウゾー;ジェイムス・マッケル・エドウィン・ハーパー

  • Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries

    Cyprian E. Uzoh

  • Electroplating workpiece fixture having liquid gap spacer

    Cyprian Emeka Uzoh

  • Open-bottomed via liner structure and method for fabricating same

    Andrew H. Simon;Cyprian E. Uzoh

  • Integrated circuit inductor

    Joachim Norbert Burghartz;Daniel Charles Edelstein;Christopher Vincent Jahnes;Cyprian Emeka Uzoh

  • Apparatus and method for the electrochemical etching of a wafer

    Madhav Datta;Daniel Charles Edelstein;Cyprian Emeka Uzoh

  • THIN-FILM METAL BARRIER LAYER FOR ELECTRICAL INTERCONNECTION

    Cabral Cyril;Dehaven Patrick William;Edelstein Daniel Charles;Klaus David Peter

  • Electroplated interconnection structures on integrated circuit chips

    Panayotis Constantinou Andricacos;Harikilia Deligianni;John Owen Dukovic;Daniel C. Edelstein

  • Serial intelligent electro-chemical-mechanical wafer processor

    Cyprian E. Uzoh;Daniel C. Edelstein

  • Triple damascence tungsten-copper interconnect structure

    Cyprian E. Uzoh

  • Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal

    Cyprian Emeka Uzoh;Wilma Jean Horkans;Panayotis Constantinou Andricacos

  • Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates

    J.N. Burghartz;D.C. Edelstein;K.A. Jenkins;C. Jahnes

  • A high performance liner for copper damascene interconnects

    D. Edelstein;C. Uzoh;C. Cabral;P. DeHaven

Frequent Co-Authors

Daniel C. Edelstein
Daniel C. Edelstein IBM (United States)
James Mckell Edwin Harper
James Mckell Edwin Harper IBM (United States)
Scott K. Reynolds
Scott K. Reynolds IBM (United States)
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
Joachim N. Burghartz
Joachim N. Burghartz University of Stuttgart
Cyril Cabral
Cyril Cabral IBM (United States)
Chenming Hu
Chenming Hu University of California, Berkeley
Stephen M. Rossnagel
Stephen M. Rossnagel IBM (United States)

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