World's Best Scientists 2026 revealed!

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Materials Science

D-Index
60
Citations
10110
World Ranking
7197
National Ranking
1786

Chemistry

D-Index
57
Citations
9822
World Ranking
11291
National Ranking
3071

Research.com Recognitions

  • 1995 - Fellow of the American Association for the Advancement of Science (AAAS)
  • 1991 - E. V. Murphree Award in Industrial and Engineering Chemistry, American Chemical Society (ACS)
  • 1988 - Member of the National Academy of Engineering For imaginative research on engineering aspects of electrodeposition and corrosion and for leadership in electrochemical engineering.

Overview

Richard C. Alkire is affiliated with the University of Illinois at Urbana-Champaign in the United States. Their research primarily focuses on the field of Electrical and Electronic Engineering with a specific concentration on Electrodeposition and Electroless Coatings.

Alkire's recent published works include:

  • Historical Perspectives on Electroplating During the Past 100 Years, 2022, The Electrochemical Society Interface
  • Historical Perspectives on Electroplating during the Past 100 Years, 2022, ECS Meeting Abstracts

These publications indicate a focus on the historical development and technical aspects of electroplating processes over an extended period.

The scientist has collaborated frequently with colleagues including:

  • Xiao Su
  • Tetsuya Ōsaka

Alkire has contributed to academic discourse primarily through the following venues:

  • The Electrochemical Society Interface
  • ECS Meeting Abstracts

Throughout their career, Alkire has been recognized by various professional organizations. Awards include:

  • Fellow of the American Association for the Advancement of Science (AAAS), awarded in 1995
  • E. V. Murphree Award in Industrial and Engineering Chemistry from the American Chemical Society (ACS), awarded in 1991
  • Membership in the National Academy of Engineering since 1988, with a citation for imaginative research on engineering aspects of electrodeposition and corrosion and leadership in electrochemical engineering

Best Publications

  • Advances in electrochemical science and engineering

    Richard C. Alkire;Heinz Gerischer;Dieter M. Kolb;Charles W. Tobias

  • Influence of Fe‐Rich Intermetallic Inclusions on Pit Initiation on Aluminum Alloys in Aerated NaCl

    J. O. Park;J. O. Park;C. H. Paik;Y. H. Huang;R. C. Alkire

  • The Role of Inclusions on Initiation of Crevice Corrosion of Stainless Steel I . Experimental Studies

    Stephen E. Lott;Richard C. Alkire

  • Microelectrochemical Studies of Pit Initiation at Single Inclusions in Al 2024-T3

    Thomas Suter;Richard C. Alkire

  • Initiation of Corrosion Pits at Inclusions on 304 Stainless Steel

    Ruoru Ke;Richard Alkire

  • Pit Initiation on Stainless Steels in 1 M NaCl With and Without Mechanical Stress

    T. Suter;E. G. Webb;H. Böhni;R. C. Alkire

  • Electrochemical Tunnel Etching of Aluminum

    R. S. Alwitt;H. Uchi;T. R. Beck;R. C. Alkire

  • Pit Initiation at Single Sulfide Inclusions in Stainless Steel I. Electrochemical Microcell Measurements

    Eric G. Webb;Richard C. Alkire

  • Mechanic Study of Copper Deposition onto Gold Surfaces by Scaling and Spectral Analysis of In Situ Atomic Force Microscopic Images

    Wolfgang U. Schmidt;Richard C. Alkire;Andrew A. Gewirth

  • Scanning electrochemical microscopy detection of dissolved sulfur species from inclusions in stainless steel

    C. H. Paik;H. S. White;Richard C Alkire

  • Occurrence of Salt Films during Initiation and Growth of Corrosion Pits

    Theodore R. Beck;Richard C. Alkire

  • Microelectrochemical Measurements of the Dissolution of Single MnS Inclusions, and the Prediction of the Critical Conditions for Pit Initiation on Stainless Steel

    E. G. Webb;T. Suter;Richard C Alkire

  • Use of In Situ Atomic Force Microscopy to Image Corrosion at Inclusions

    Rebecca M. Rynders;Chi‐Hum Paik;Ruoru Ke;Richard C. Alkire

  • Flow‐Through Porous Electrodes

    Richard Alkire;Brian Gracon

  • Local chemistry and growth of single corrosion pits in aluminum

    Kai P. Wong;Richard C. Alkire

  • Plating of Copper into Through‐Holes and Vias

    Edward K. Yung;Lubomyr T. Romankiw;Richard C. Alkire

  • Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive

    M. Georgiadou;M. Georgiadou;D. Veyret;R. L. Sani;Richard C Alkire

  • Growth Rates of Aluminum Etch Tunnels

    Kurt Hebert;Richard Alkire

  • Pit Initiation at Single Sulfide Inclusions in Stainless Steel: II. Detection of Local pH, Sulfide, and Thiosulfate

    Eric G. Webb;Richard C. Alkire

  • Predicting Electrode Shape Change with Use of Finite Element Methods

    Richard C Alkire;Terry Bergh;Robert L. Sani

Frequent Co-Authors

Dieter M. Kolb
Dieter M. Kolb University of Ulm
Mark A. Stadtherr
Mark A. Stadtherr The University of Texas at Austin
Jacek Lipkowski
Jacek Lipkowski University of Guelph
Linda R. Petzold
Linda R. Petzold University of California, Santa Barbara
Andrew A. Gewirth
Andrew A. Gewirth University of Illinois at Urbana-Champaign
Philip N. Ross
Philip N. Ross Lawrence Berkeley National Laboratory
Dennis Gannon
Dennis Gannon Indiana University
Mark J. Kushner
Mark J. Kushner University of Michigan–Ann Arbor
Digby D. Macdonald
Digby D. Macdonald University of California, Berkeley

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