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Stephen M. Rossnagel

Stephen M. Rossnagel

D-Index & Metrics

Materials Science

D-Index
57
Citations
11210
World Ranking
7984
National Ranking
1986

Overview

Stephen M. Rossnagel is affiliated with IBM in the United States and is active in the field of engineering. Their research covers multiple subfields, including mechanics of materials, computational mechanics, and electrical and electronic engineering.

The main topics addressed in Rossnagel's work include:

  • Metal and thin film mechanics
  • Surface roughness and optical measurements
  • Semiconductor materials and devices

Rossnagel has contributed to scholarly publications predominantly in the Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, with two papers published in this venue.

Some of the recent papers authored or co-authored by Rossnagel are:

  • Magnetron sputtering, 2020, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
  • Preface for the special topic collection celebrating the achievements and life of Joe Greene, 2024, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

The list of co-authors who have frequently collaborated with Rossnagel includes:

  • I. Petrov
  • Lars Hultman
  • Li-Chyong Chen
  • Jochen M. Schneider

Best Publications

  • Handbook of plasma processing technology : fundamentals, etching, deposition, and surface interactions

    Stephen M. Rossnagel;J. J. Cuomo;William D. Westwood

  • Alteration of Cu conductivity in the size effect regime

    S. M. Rossnagel;T. S. Kuan

  • Metal ion deposition from ionized mangetron sputtering discharge

    S. M. Rossnagel;J. Hopwood

  • Magnetron sputter deposition with high levels of metal ionization

    S. M. Rossnagel;J. Hopwood

  • Handbook of Ion Beam Processing Technology: Principles, Deposition, Film Modification and Synthesis

    J. J. Cuomo;S. M. Rossnagel;H. R. Haufman;Ranga Komanduri

  • Ionic field effect transistors with sub-10 nm multiple nanopores.

    Sung-Wook Nam;Michael J. Rooks;Ki-Bum Kim;Stephen M. Rossnagel

  • Gas density reduction effects in magnetrons

    S. M. Rossnagel

  • Thin film deposition with physical vapor deposition and related technologies

    S. M. Rossnagel

  • Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers

    S. M. Rossnagel;A. Sherman;F. Turner

  • Systems and Methods for Controlling the Position of a Charged Polymer Inside a Nanopore

    Stanislav Polonsky;Stephen M. Rossnagel;Gustavo A. Stolovitzky

  • Structure for confining the switching current in phase memory (PCM) cells

    Geoffrey W. Burr;Chung Hon Lam;Simone Raoux;Stephen M. Rossnagel

  • Directional and ionized physical vapor deposition for microelectronics applications

    S. M. Rossnagel

  • METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES

    Andrew J. Kellock;Hyungjun Kim;Dae-Gyu Park;Satyanarayana V. Nitta

  • Collimated magnetron sputter deposition

    S. M. Rossnagel;D. Mikalsen;H. Kinoshita;J. J. Cuomo

  • Phase transformation of thin sputter-deposited tungsten films at room temperature

    S. M. Rossnagel;I. C. Noyan;C. Cabral

  • Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition

    H. Kim;C. Cabral;C. Lavoie;S. M. Rossnagel

  • Evidence for segregation of Te in Ge2Sb2Te5 films: Effect on the “phase-change” stress

    L. Krusin-Elbaum;C. Cabral;Kuan-Neng Chen;M. Copel

  • Current−voltage relations in magnetrons

    S. M. Rossnagel;H. R. Kaufman

  • Film modification by low energy ion bombardment during deposition

    S.M. Rossnagel;J.J. Cuomo

  • Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition

    H. Kim;C. Detavenier;O. van der Straten;S. M. Rossnagel

Frequent Co-Authors

Cyril Cabral
Cyril Cabral IBM (United States)
Hyungjun Kim
Hyungjun Kim Yonsei University
Jerome J. Cuomo
Jerome J. Cuomo North Carolina State University
Christian Lavoie
Christian Lavoie IBM (United States)
Simone Raoux
Simone Raoux Helmholtz-Zentrum Berlin für Materialien und Energie
Christopher V. Jahnes
Christopher V. Jahnes IBM (United States)
Andrew J. Kellock
Andrew J. Kellock IBM (United States)
Paul M. Solomon
Paul M. Solomon IBM (United States)
Matthew Copel
Matthew Copel IBM (United States)
Bruce G. Elmegreen
Bruce G. Elmegreen IBM (United States)

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