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Materials Science

D-Index
59
Citations
10463
World Ranking
7491
National Ranking
1854

Overview

Thomas P. Moffat is affiliated with the National Institute of Standards and Technology in the United States. Their research primarily spans the field of Engineering, with a focus on Electrical and Electronic Engineering, Renewable Energy, Sustainability and the Environment, Electrochemistry, Atomic and Molecular Physics and Optics, and Electronic, Optical and Magnetic Materials.

Their work covers several specialized topics including Electrochemical Analysis and Applications, Electrodeposition and Electroless Coatings, Electrocatalysts for Energy Conversion, Copper Interconnects and Reliability, CO2 Reduction Techniques and Catalysts, Molecular Junctions and Nanostructures, and Semiconductor Materials and Interfaces.

Thomas P. Moffat is a contributor to various scientific publications and has authored multiple research papers. Recent notable publications include:

  • Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology, 2023, Accounts of Chemical Research
  • High-Aspect-Ratio Ag Nanowire Mat Electrodes for Electrochemical CO Production from CO2, 2021, ACS Catalysis
  • Surface Hydride Formation on Cu(111) and Its Decomposition to Form H2 in Acid Electrolytes, 2021, The Journal of Physical Chemistry Letters
  • Pushing the Limits of Bottom-Up Gold Filling for X-ray Grating Interferometry, 2020, Journal of The Electrochemical Society
  • Bottom-up Cu filling of annular through silicon vias: Microstructure and texture, 2020, Electrochimica Acta

Their frequent coauthors include D. Josell, David Raciti, Trevor Michael Braun, Angela R. Hight Walker, and Eric D. Rus.

The most common venues for their publications are ECS Meeting Abstracts, Journal of The Electrochemical Society, The Journal of Physical Chemistry C, Accounts of Chemical Research, and The Journal of Physical Chemistry Letters.

Best Publications

  • Superconformal Electrodeposition of Copper in 500-90 nm Features

    T. P. Moffat;J. E. Bonevich;W. H. Huber;A. Stanishevsky

  • Superconformal film growth: mechanism and quantification

    Thomas P. Moffat;Daniel Wheeler;Monica D. Edelstein;Daniel Josell

  • Superconformal Electrodeposition of Copper

    T. P. Moffat;D. Wheeler;W. H. Huber;D. Josell

  • Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

    Thomas P. Moffat;Daniel Wheeler;Daniel Josell

  • H2 evolution at Si-based metal–insulator–semiconductor photoelectrodes enhanced by inversion channel charge collection and H spillover

    Daniel V. Esposito;Igor Levin;Thomas P. Moffat;Albert A. Talin;Albert A. Talin

  • Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

    T. P. Moffat;D. Josell

  • Superconformal Electrodeposition in Submicron Features

    Daniel Josell;Daniel Wheeler;W H. Huber;Thomas P. Moffat

  • An Electrochemical and X‐Ray Photoelectron Spectroscopy Study of the Passive State of Chromium

    T. P. Moffat;R. M. Latanision

  • Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers

    Daniel Josell;Daniel Wheeler;C Witt;Thomas P. Moffat

  • Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

    T.P. Moffat;D. Wheeler;S.-K. Kim;D. Josell

  • A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

    Daniel Josell;Daniel Wheeler;W H. Huber;John E. Bonevich

  • Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

    Thomas P. Moffat;Daniel Wheeler;Soo K. Kim;Daniel Josell

  • Modeling Superconformal Electrodeposition Using The Level Set Method

    Daniel Wheeler;Daniel Josell;Thomas P. Moffat

  • Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System Reduction of Overfill Bump Formation During Superfilling

    Soo K. Kim;Daniel Josell;Thomas P. Moffat

  • Self-Terminating Growth of Platinum Films by Electrochemical Deposition

    Unknown

  • Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

    T. P. Moffat;M. Walker;P. J. Chen;J. E. Bonevich

  • Electrochemical and Scanning Tunneling Microscopic Study of Dealloying of Cu3Au

    Thomas P. Moffat;Fu-Ren F. Fan;Allen J. Bard

  • Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

    Soo K. Kim;Daniel Josell;Thomas P. Moffat

  • An X-ray photoelectron spectroscopy study of chromium-metalloid alloys—III

    T.P. Moffat;R.M. Latanision;R.R. Ruf

  • Electrodeposition of Ni1 − x Al x in a Chloroaluminate Melt

    T. P. Moffat

  • Modeling Extreme Bottom-Up Filling of Through Silicon Vias

    D. Josell;D. Wheeler;T. P. Moffat

  • Electrodeposition of Al‐Cr Metallic Glass

    T. P. Moffat

Frequent Co-Authors

Daniel Josell
Daniel Josell National Institute of Standards and Technology
Lee J. Richter
Lee J. Richter National Institute of Standards and Technology
Leonid A. Bendersky
Leonid A. Bendersky National Institute of Standards and Technology
A. Alec Talin
A. Alec Talin Sandia National Laboratories
Mikko Ritala
Mikko Ritala University of Helsinki
Lourdes Salamanca-Riba
Lourdes Salamanca-Riba University of Maryland, College Park
Hoydoo You
Hoydoo You Argonne National Laboratory
Igor Levin
Igor Levin National Institute of Standards and Technology
Soo-Kil Kim
Soo-Kil Kim Chung-Ang University
Markku Leskelä
Markku Leskelä University of Helsinki

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