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Philippe M. Vereecken

Philippe M. Vereecken

D-Index & Metrics

Engineering and Technology

D-Index
42
Citations
7766
World Ranking
6499
National Ranking
83

Overview

Philippe M. Vereecken is a researcher affiliated with Imec in Belgium, with a significant body of work in the fields of engineering and materials science. Their research focuses predominantly on electrical and electronic engineering, materials chemistry, and renewable energy, sustainability, and the environment. Additional areas of study include automotive engineering and electronic, optical, and magnetic materials.

Their main research topics include advancements in battery materials, advanced battery materials and technologies, electrocatalysts for energy conversion, and semiconductor materials and devices. Other topics of interest cover advanced battery technologies research, supercapacitor materials and fabrication, and CO2 reduction techniques and catalysts.

Vereecken has contributed publications to various scientific venues. Frequent publication venues include ECS Meeting Abstracts with 27 publications, Journal of The Electrochemical Society with 8, Chemistry of Materials with 5, ACS Applied Materials & Interfaces with 4, and Journal of Materials Chemistry A with 4.

Among their recent papers are:

  • Silica gel solid nanocomposite electrolytes with interfacial conductivity promotion exceeding the bulk Li-ion conductivity of the ionic liquid electrolyte filler (2020) published in Science Advances
  • Effects of Iron Species on Low Temperature CO2 Electrolyzers (2023) published in Angewandte Chemie International Edition
  • Molecular Layer Deposition of Zeolitic Imidazolate Framework-8 Films (2023) published in Chemistry of Materials
  • Molecular Layer Deposition of "Magnesicone", a Magnesium-based Hybrid Material (2020) published in Chemistry of Materials
  • Atomic Layer Deposition of Nitrogen-Doped Al Phosphate Coatings for Li-Ion Battery Applications (2020) published in ACS Applied Materials & Interfaces

Frequent co-authors who have collaborated with Vereecken include Louis De Taeye, Nina Plankensteiner, Genis Vanheusden, Maarten Mees, and Martijn J.W. Blom. These collaborations reflect interdisciplinary engagements often seen in advanced materials and engineering research.

Best Publications

  • Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface

    MJ Williamson;RM Tromp;Philippe Vereecken;R Hull

  • Chemical vapour deposition of zeolitic imidazolate framework thin films

    Ivo Stassen;Mark Styles;Gianluca Grenci;Hans Van Gorp

  • The chemistry of additives in damascene copper plating

    Philippe M. Vereecken;Robert A. Binstead;Hariklia Deligianni;Panayotis C. Andricacos

  • Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data.

    Aleksandar Radisic;Philippe M. Vereecken;James B. Hannon;Peter C. Searson

  • Liner materials for direct electrodeposition of Cu

    M. W. Lane;C. E. Murray;F. R. McFeely;P. M. Vereecken

  • Electrochemical Deposition of Copper on n‐Si/TiN

    Gerko Oskam;Philippe M. Vereecken;Peter C. Searson

  • Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors

    Ivo Stassen;Nicolò Campagnol;Jan Fransaer;Philippe Vereecken

  • Particle Codeposition in Nanocomposite Films

    P. M. Vereecken;I. Shao;P. C. Searson

  • Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth

    F. Iacopi;Philippe Vereecken;M. Schaekers;M. Caymax

  • The morphology and nucleation kinetics of copper islands during electrodeposition

    A Radisic;Philippe Vereecken;PC Searson;FM Ross

  • Advances in 3D Thin-Film Li-Ion Batteries

    Sébastien Moitzheim;Brecht Put;Philippe M. Vereecken

  • Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects.

    Nicolo’ Chiodarelli;Sugiura Masahito;Yusaku Kashiwagi;Yunlong Li

  • Solid and Solid-Like Composite Electrolyte for Lithium Ion Batteries: Engineering the Ion Conductivity at Interfaces

    Xubin Chen;Philippe M. Vereecken

  • Synthesis and Characterization of Particle-reinforced Ni/Al2O3 Nanocomposites

    I. Shao;P. M. Vereecken;C. L. Chien;P. C. Searson

  • Kinetics of Particle Codeposition of Nanocomposites

    I. Shao;P. M. Vereecken;R. C. Cammarata;P. C. Searson

  • Selective capping of copper wiring

    Panayotis C. Andricacos;Shyng-Tsong Chen;John M. Cotte;Hariklia Deligianni

  • A USB-controlled potentiostat/galvanostat for thin-film battery characterization

    Thomas Dobbelaere;Philippe M. Vereecken;Christophe Detavernier

  • Modeling the Bottom-Up Filling of Through-Silicon vias Through Suppressor Adsorption/Desorption Mechanism

    Liu Yang;Liu Yang;Aleksandar Radisic;Johan Deconinck;Philippe M. Vereecken

  • Anodic Etching of n-GaN Epilayer into Porous GaN and Its Photoelectrochemical Properties

    W. J. Tseng;D. H. van Dorp;R. R. Lieten;P. M. Vereecken

  • Electrochemical Characterization of Adsorption-Desorption of the Cuprous-Suppressor-Chloride Complex during Electrodeposition of Copper

    John G. Long;Peter C. Searson;Philippe M. Vereecken

  • Electrical Characterization of Ultrathin RF-Sputtered LiPON Layers for Nanoscale Batteries.

    Brecht Put;Philippe M. Vereecken;Johan Meersschaut;Alfonso Sepúlveda

  • Correlation between number of walls and diameter in multiwall carbon nanotubes grown by chemical vapor deposition

    Nicolò Chiodarelli;Olivier Richard;Hugo Bender;Marc Heyns

  • Integration and electrical characterization of carbon nanotube via interconnects

    Nicolo' Chiodarelli;Yunlong Li;Daire J. Cott;Sofie Mertens

  • Silica gel solid nanocomposite electrolytes with interfacial conductivity promotion exceeding the bulk Li-ion conductivity of the ionic liquid electrolyte filler

    Xubin Chen;Brecht Put;Akihiko Sagara;Knut Gandrud

  • Electrochemical deposition of copper on n-SI/TIN

    G. Oskam;P. M. Vereecken;J. G. Long;B. J. Moran

Frequent Co-Authors

Christophe Detavernier
Christophe Detavernier Ghent University
Cedric Huyghebaert
Cedric Huyghebaert Black Semiconductor
Peter C. Searson
Peter C. Searson Johns Hopkins University
Dirk De Vos
Dirk De Vos KU Leuven
Jan Fransaer
Jan Fransaer KU Leuven
Sara Bals
Sara Bals University of Antwerp

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