D-Index & Metrics Best Publications

Daniel Josell

National Institute of Standards and Technology
United States

D-Index & Metrics D-index (Discipline H-index) only includes papers and citation values for an examined discipline in contrast to General H-index which accounts for publications across all disciplines.

Discipline name Citations Publications World Ranking National Ranking

Materials Science D-index 42 Citations 6,940 188 World Ranking 9472 National Ranking 2434

Overview

What is he best known for?

The fields of study Daniel Josell is best known for:

Copper
Metal
Aluminium

His work on Finance as part of general PEG ratio research is often related to Chemical engineering, thus linking different fields of science. Daniel Josell combines topics linked to PEG ratio with his work on Finance. Daniel Josell undertakes interdisciplinary study in the fields of Chemical engineering and Metallurgy through his works. His Metallurgy study typically links adjacent topics like Copper interconnect. Much of his study explores Nanotechnology relationship to Copper interconnect and Layer (electronics). Layer (electronics) connects with themes related to Nanotechnology in his study. Daniel Josell connects Copper with Surface finish in his research. Daniel Josell integrates several fields in his works, including Physical chemistry and Chemical physics. Daniel Josell combines Chemical physics and Physical chemistry in his studies.

His most cited work include:

Superconformal Electrodeposition of Copper in 500–90 nm Features (376 citations)
Superconformal film growth: Mechanism and quantification (326 citations)
Superconformal Electrodeposition of Copper (289 citations)

What are the main themes of his work throughout his whole career to date

Daniel Josell integrates many fields in his works, including Metallurgy, Copper, Chemical engineering and Metal. Borrowing concepts from Metallurgy, Daniel Josell weaves in ideas under Chemical engineering. His Composite material study has been linked to subjects such as Layer (electronics) and Microstructure. Microstructure and Composite material are commonly linked in his work. His Nanotechnology study has been linked to subjects such as Thin film and Layer (electronics). His research on Thin film frequently connects to adjacent areas such as Nanotechnology. He merges Physical chemistry with Organic chemistry in his study. Daniel Josell integrates Organic chemistry and Physical chemistry in his studies. While working in this field, he studies both Electrode and Electrochemistry.

Daniel Josell most often published in these fields:

Metallurgy (52.21%)
Composite material (45.13%)
Nanotechnology (43.36%)

This overview was generated by a machine learning system which analysed the scientist’s body of work. If you have any feedback, you can contact us here.

Best Publications

Superconformal Electrodeposition of Copper in 500-90 nm Features

T. P. Moffat;J. E. Bonevich;W. H. Huber;A. Stanishevsky.
Journal of The Electrochemical Society (2000)

557 Citations

Superconformal film growth: mechanism and quantification

Thomas P. Moffat;Daniel Wheeler;Monica D. Edelstein;Daniel Josell.
Ibm Journal of Research and Development (2005)

435 Citations

Superconformal Electrodeposition of Copper

T. P. Moffat;D. Wheeler;W. H. Huber;D. Josell.
Electrochemical and Solid State Letters (2001)

418 Citations

Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

Thomas P. Moffat;Daniel Wheeler;Daniel Josell.
Journal of The Electrochemical Society (2004)

377 Citations

Size-Dependent Resistivity in Nanoscale Interconnects

Daniel Josell;Sywert H. Brongersma;Zsolt Tőkei.
Annual Review of Materials Research (2009)

239 Citations

Superconformal Electrodeposition in Submicron Features

Daniel Josell;Daniel Wheeler;W H. Huber;Thomas P. Moffat.
Physical Review Letters (2001)

227 Citations

Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

T. P. Moffat;D. Josell.
Journal of The Electrochemical Society (2012)

200 Citations

Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers

Daniel Josell;Daniel Wheeler;C Witt;Thomas P. Moffat.
Electrochemical and Solid State Letters (2003)

192 Citations

A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

Daniel Josell;Daniel Wheeler;W H. Huber;John E. Bonevich.
Journal of The Electrochemical Society (2001)

186 Citations

Modeling Superconformal Electrodeposition Using The Level Set Method

Daniel Wheeler;Daniel Josell;Thomas P. Moffat.
Journal of The Electrochemical Society (2003)

163 Citations

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Frequent Co-Authors

External Links

Personal Website for Daniel Josell