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Materials Science

D-Index
46
Citations
8245
World Ranking
11427
National Ranking
2683

Overview

Daniel Josell is a researcher affiliated with the National Institute of Standards and Technology in the United States. Their work spans several fields with a primary focus on Engineering, Physics and Astronomy, and Materials Science. Within these, subfields such as Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics play significant roles in their research activities. Additional subfields include Radiation and Electrochemistry.

The main research topics covered by Daniel Josell include:

  • Electrodeposition and Electroless Coatings
  • Copper Interconnects and Reliability
  • Advanced X-ray Imaging Techniques
  • Electrochemical Analysis and Applications
  • Electrocatalysts for Energy Conversion
  • Semiconductor materials and interfaces
  • Advancements in Photolithography Techniques

Daniel Josell has contributed extensively to scholarly journals, with frequent publications in venues such as:

  • Journal of The Electrochemical Society
  • ECS Meeting Abstracts
  • Scientific Reports
  • Accounts of Chemical Research
  • Electrochimica Acta

Their recent papers include:

  • "Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology," 2023, Accounts of Chemical Research
  • "Pushing the Limits of Bottom-Up Gold Filling for X-ray Grating Interferometry," 2020, Journal of The Electrochemical Society
  • "Bottom-up Cu filling of annular through silicon vias: Microstructure and texture," 2020, Electrochimica Acta
  • "Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias," 2022, Journal of The Electrochemical Society
  • "Buffer layer engineering of L1 FePd thin films with large perpendicular magnetic anisotropy," 2021, AIP Advances

They have collaborated frequently with several researchers, including:

  • Thomas P. Moffat
  • Trevor Michael Braun
  • Lucia Romano
  • David Raciti
  • Konstantins Jefimovs

Best Publications

  • Superconformal Electrodeposition of Copper in 500-90 nm Features

    T. P. Moffat;J. E. Bonevich;W. H. Huber;A. Stanishevsky

  • Superconformal film growth: mechanism and quantification

    Thomas P. Moffat;Daniel Wheeler;Monica D. Edelstein;Daniel Josell

  • Superconformal Electrodeposition of Copper

    T. P. Moffat;D. Wheeler;W. H. Huber;D. Josell

  • Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS

    Thomas P. Moffat;Daniel Wheeler;Daniel Josell

  • Size-Dependent Resistivity in Nanoscale Interconnects

    Daniel Josell;Sywert H. Brongersma;Zsolt Tőkei

  • Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns

    T. P. Moffat;D. Josell

  • Superconformal Electrodeposition in Submicron Features

    Daniel Josell;Daniel Wheeler;W H. Huber;Thomas P. Moffat

  • Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers

    Daniel Josell;Daniel Wheeler;C Witt;Thomas P. Moffat

  • Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing

    T.P. Moffat;D. Wheeler;S.-K. Kim;D. Josell

  • A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches

    Daniel Josell;Daniel Wheeler;W H. Huber;John E. Bonevich

  • Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

    Thomas P. Moffat;Daniel Wheeler;Soo K. Kim;Daniel Josell

  • Modeling Superconformal Electrodeposition Using The Level Set Method

    Daniel Wheeler;Daniel Josell;Thomas P. Moffat

  • Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System Reduction of Overfill Bump Formation During Superfilling

    Soo K. Kim;Daniel Josell;Thomas P. Moffat

  • Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

    T. P. Moffat;M. Walker;P. J. Chen;J. E. Bonevich

  • A new method for tensile testing of thin films

    J. A. Ruud;D. Josell;F. Spaepen;A. L. Greer

  • Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries

    A.C. Lewis;D. Josell;T.P. Weihs

  • Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

    Soo K. Kim;Daniel Josell;Thomas P. Moffat

  • Modeling Extreme Bottom-Up Filling of Through Silicon Vias

    D. Josell;D. Wheeler;T. P. Moffat

  • The formation of f.c.c. titanium in titanium-aluminum multilayers

    D. Van Heerden;D. Josell;D. Shechtman

  • Determination of the interfacial tension by zero creep experiments on multilayers—II. Experiment

    D. Josell;F. Spaepen

  • Determination of the CoTi congruent melting point and thermodynamic reassessment of the Co-Ti system

    A. V. Davydov;U. R. Kattner;D. Josell;R. M. Waterstrat

Frequent Co-Authors

Thomas P. Moffat
Thomas P. Moffat National Institute of Standards and Technology
Lee J. Richter
Lee J. Richter National Institute of Standards and Technology
Leonid A. Bendersky
Leonid A. Bendersky National Institute of Standards and Technology
William J. Boettinger
William J. Boettinger National Institute of Standards and Technology
Mikko Ritala
Mikko Ritala University of Helsinki
Timothy P. Weihs
Timothy P. Weihs Johns Hopkins University
Ichiro Takeuchi
Ichiro Takeuchi University of Maryland, College Park
Samuel E. Lofland
Samuel E. Lofland Rowan University
Frans Spaepen
Frans Spaepen Harvard University
Sam R. Coriell
Sam R. Coriell National Institute of Standards and Technology

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