His work on Finance as part of general PEG ratio research is often related to Chemical engineering, thus linking different fields of science. Daniel Josell combines topics linked to PEG ratio with his work on Finance. Daniel Josell undertakes interdisciplinary study in the fields of Chemical engineering and Metallurgy through his works. His Metallurgy study typically links adjacent topics like Copper interconnect. Much of his study explores Nanotechnology relationship to Copper interconnect and Layer (electronics). Layer (electronics) connects with themes related to Nanotechnology in his study. Daniel Josell connects Copper with Surface finish in his research. Daniel Josell integrates several fields in his works, including Physical chemistry and Chemical physics. Daniel Josell combines Chemical physics and Physical chemistry in his studies.
Daniel Josell integrates many fields in his works, including Metallurgy, Copper, Chemical engineering and Metal. Borrowing concepts from Metallurgy, Daniel Josell weaves in ideas under Chemical engineering. His Composite material study has been linked to subjects such as Layer (electronics) and Microstructure. Microstructure and Composite material are commonly linked in his work. His Nanotechnology study has been linked to subjects such as Thin film and Layer (electronics). His research on Thin film frequently connects to adjacent areas such as Nanotechnology. He merges Physical chemistry with Organic chemistry in his study. Daniel Josell integrates Organic chemistry and Physical chemistry in his studies. While working in this field, he studies both Electrode and Electrochemistry.
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Superconformal Electrodeposition of Copper in 500-90 nm Features
T. P. Moffat;J. E. Bonevich;W. H. Huber;A. Stanishevsky.
Journal of The Electrochemical Society (2000)
Superconformal film growth: mechanism and quantification
Thomas P. Moffat;Daniel Wheeler;Monica D. Edelstein;Daniel Josell.
Ibm Journal of Research and Development (2005)
Superconformal Electrodeposition of Copper
T. P. Moffat;D. Wheeler;W. H. Huber;D. Josell.
Electrochemical and Solid State Letters (2001)
Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS
Thomas P. Moffat;Daniel Wheeler;Daniel Josell.
Journal of The Electrochemical Society (2004)
Size-Dependent Resistivity in Nanoscale Interconnects
Daniel Josell;Sywert H. Brongersma;Zsolt Tőkei.
Annual Review of Materials Research (2009)
Superconformal Electrodeposition in Submicron Features
Daniel Josell;Daniel Wheeler;W H. Huber;Thomas P. Moffat.
Physical Review Letters (2001)
Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns
T. P. Moffat;D. Josell.
Journal of The Electrochemical Society (2012)
Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers
Daniel Josell;Daniel Wheeler;C Witt;Thomas P. Moffat.
Electrochemical and Solid State Letters (2003)
A Simple Equation for Predicting Superconformal Electrodeposition in Submicrometer Trenches
Daniel Josell;Daniel Wheeler;W H. Huber;John E. Bonevich.
Journal of The Electrochemical Society (2001)
Modeling Superconformal Electrodeposition Using The Level Set Method
Daniel Wheeler;Daniel Josell;Thomas P. Moffat.
Journal of The Electrochemical Society (2003)
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