Sergey D. Lopatin

Overview

Best Publications

• Interconnect structure formed in porous dielectric material with minimized degradation and electromigration

  Sergey Lopatin;Fei Wang;Diana Schonauer;Steven C. Avanzino

  483
  Citations

• Method of forming copper/copper alloy interconnection with reduced electromigration

  Takeshi Nogami;Sergey Lopatin;Young-Chang Joo

  364
  Citations

• Semiconductor metalization barrier

  Sergey D. Lopatin;Shekhar Pramanick;Dirk Brown

  278
  Citations

• Apparatus for electroless deposition

  Dmitry Lubomirsky;Arulkumar Shanmugasundram;Ian A. Pancham;Sergey Lopatin

  267
  Citations

• Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure

  Robin Cheung;Sergey Lopatin

  262
  Citations

• Manufacturing method for semiconductor metalization barrier

  Sergey D. Lopatin;Shekhar Pramanick;Dirk Brown

  260
  Citations

• Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed

  Sergey Lopatin;Krishnashree Achuthan

  235
  Citations

• Method of copper interconnect formation using atomic layer copper deposition and a device thereby formed

  Sergey D. Lopatin;Carl Galewski;Takeshi T. N. Nogami

  214
  Citations

• Correlation of stress and texture evolution during self- and thermal annealing of electroplated Cu films

  Haebum Lee;S. Simon Wong;Sergey D. Lopatin

  179
  Citations

• Integrated electroless metallization for ULSI

  Yosi Shacham-Diamand;Sergey Lopatin

  175
  Citations

• Composite materials containing metallized carbon nanotubes and nanofibers

  Sergey D. Lopatin;Robert Z. Bachrach;Liang-Yuh Chen

  151
  Citations

• Thin electroless barrier for copper films

  Sergey D. Lopatin;Yosi Y. Shacham-Diamand;Valery M. Dubin;Yoon So Kim

  128
  Citations

• Method of encapsulated copper (Cu) interconnect formation

  Sergey D. Lopatin;Robin W. Cheung

  116
  Citations

• Method of forming copper sulfide for memory cell

  Minh Van Ngo;Sergey D. Lopatin;Suzette K. Pangrle;Nicholas H. Tripsas

  110
  Citations

• Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers

  Sergey Lopatin;Arulkumar Shanmugasundram;Yosef Shacham-Diamand;Timothy Weidman

  100
  Citations

• Methdo and equipment for electroplating on roll-to-roll flexible solar cell substrates

  Sergey Lopatin;David Eaglesham

  98
  Citations

• Scalable process for application of stabilized lithium metal powder in Li-ion batteries

  Guo Ai;Zhihui Wang;Hui Zhao;Wenfeng Mao

  93
  Citations

• Method of metallizing a solar cell substrate

  Sergey Lopatin;Nicolay Y. Kovarsky;David Eaglesham;John O. Dukovic

  87
  Citations

• Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors

  Sergey D. Lopatin;Dmitri A. Brevnov;Robert Z. Bachrach

  86
  Citations

• Pulse plating of a low stress film on a solar cell substrate

  Sergey Lopatin;David Eaglesham;John O. Dukovic

  84
  Citations

• Process for formation of a wiring network using a porous interlevel dielectric and related structures

  Steven C. Avanzino;Darrell M. Erb;Fei Wang;Sergey Lopatin

  82
  Citations